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Электронный компонент: 74HC/HCT4066

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DATA SHEET
Product specification
Supersedes data of 1998 Oct 02
File under Integrated Circuits, IC06
1998 Nov 10
INTEGRATED CIRCUITS
74HC/HCT4066
Quad bilateral switches
For a complete data sheet, please also download:
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
1998 Nov 10
2
Philips Semiconductors
Product specification
Quad bilateral switches
74HC/HCT4066
FEATURES
Very low "ON" resistance:
50
(typ.) at V
CC
= 4.5 V
45
(typ.) at V
CC
= 6.0 V
35
(typ.) at V
CC
= 9.0 V
Output capability: non-standard
I
CC
category: SSI.
GENERAL DESCRIPTION
The 74HC/HCT4066 are high-speed Si-gate CMOS
devices and are pin compatible with the "4066" of the
"4000B" series. They are specified in compliance with
JEDEC standard no. 7A.
The 74HC/HCT4066 have four independent analog
switches. Each switch has two input/output terminals (nY,
nZ) and an active HIGH enable input (nE). When nE is
LOW the belonging analog switch is turned off.
The "4066" is pin compatible with the "4016" but exhibits a
much lower "ON" resistance. In addition, the "ON"
resistance is relatively constant over the full input signal
range.
QUICK REFERENCE DATA
GND = 0 V; T
amb
= 25
C; t
r
= t
f
= 6 ns
Notes
1. C
PD
is used to determine the dynamic power dissipation (P
D
in
W):
a) P
D
= C
PD
V
CC
2
f
i
+
{(C
L
+
C
S
)
V
CC
2
f
o
} where:
b) f
i
= input frequency in MHz
c) f
o
= output frequency in MHz
d)
{(C
L
+
C
S
)
V
CC
2
f
o
} = sum of outputs
e) C
L
= output load capacitance in pF
f) C
S
= maximum switch capacitance in pF
g) V
CC
= supply voltage in V
2. For HC the condition is V
I
= GND to V
CC
For HCT the condition is V
I
= GND to V
CC
-
1.5 V
SYMBOL
PARAMETER
CONDITIONS
TYPICAL
UNIT
HC
HCT
t
PZH
/ t
PZL
turn-on time nE to V
os
C
L
= 15 pF; R
L
= 1 k
; V
CC
= 5 V
11
12
ns
t
PHZ
/ t
PLZ
turn-off time nE to V
os
13
16
ns
C
I
input capacitance
3.5
3.5
pF
C
PD
power dissipation capacitance per switch
notes 1 and 2
11
12
pF
C
S
max. switch capacitance
8
8
pF
1998 Nov 10
3
Philips Semiconductors
Product specification
Quad bilateral switches
74HC/HCT4066
ORDERING INFORMATION
PIN DESCRIPTION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
74HC4066
DIP14
plastic dual in-line package; 14 leads (300 mil)
SOT27-1
74HC4066
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
74HC4066
SSOP14
plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
74HC4066
TSSOP14
plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
74HCT4066
DIP14
plastic dual in-line package; 14 leads (300 mil)
SOT27-1
74HCT4066
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
74HCT4066
SSOP14
plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
74HCT4066
TSSOP14
plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
PIN NO.
SYMBOL
NAME AND FUNCTION
1, 4, 8, 11
1Y to 4Y
independent inputs/outputs
2, 3, 9, 10
1Z to 4Z
independent inputs/outputs
7
GND
ground (0 V)
13, 5, 6, 12
1E to 4E
enable inputs (active HIGH)
14
V
CC
positive supply voltage
Fig.1 Pin configuration.
handbook, halfpage
MGR253
4066
1
2
3
4
5
6
7
8
14
13
12
11
10
9
1Y
1Z
2Z
2Y
2E
3E
GND
3Y
3Z
4Z
4Y
4E
1E
VCC
Fig.2 Logic symbol.
handbook, halfpage
MGR254
13
1
1Y
2
1Z
4
2Y
3
2Z
8
3Y
9
3Z
11
4Y
10
4Z
1E
5
2E
6
3E
12
4E
1998 Nov 10
4
Philips Semiconductors
Product specification
Quad bilateral switches
74HC/HCT4066
handbook, halfpage
MGR255
13 #
5 #
6 #
12 #
1
2
4
3
8
9
11
10
handbook, halfpage
MGR256
13 #
5 #
6 #
12 #
1
1
1
X1
1
1
X1
1
1
X1
1
1
X1
2
4
3
8
9
11
10
Fig.3 IEC logic symbol.
a.
b.
Fig.4 Functional diagram.
handbook, halfpage
MGR257
11
4Y
12
4E
4Z
10
3Z
9
2Z
3
1Z
2
8
3Y
6
3E
4
2Y
5
2E
1
1Y
13
1E
FUNCTION TABLE
Note
1. H = HIGH voltage level; L = LOW voltage level.
INPUT NE
SWITCH
L
off
H
on
Fig.5 Schematic diagram (one switch).
handbook, halfpage
MGR258
VCC
GND
nE
nZ
nY
VCC
1998 Nov 10
5
Philips Semiconductors
Product specification
Quad bilateral switches
74HC/HCT4066
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134) Voltages are referenced to GND
(GND = 0 V)
Note
1. To avoid drawing V
CC
current out of terminal nZ, when switch current flows in terminal nY, the voltage drop across
the bidirectional switch must not exceed 0.4 V. If the switch current flows into terminal nZ, no V
CC
current will flow
out of terminal nY. In this case there is no limit for the voltage drop across the switch, but the voltages at nY and nZ
may not exceed V
CC
or GND.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
CONDITIONS
V
CC
DC supply voltage
-
0.5
+11.0
V
I
IK
DC digital input diode current
20
mA
for V
I
< -
0.5 V or V
I
>
V
CC
+
0.5 V
I
SK
DC switch diode current
20
mA
for V
S
< -
0.5 V or V
S
>
V
CC
+
0.5 V
I
IS
DC switch current
25
mA
for
-
0.5 V
<
V
S
<
V
CC
+
0.5 V
I
CC;
I
GND
DC V
CC
or GND current
50
mA
T
stg
storage temperature range
-
65
+150
C
P
tot
power dissipation per package
for temperature range:
-
40 to +125
C
74HC/HCT
plastic DIL
750
mW
above +70
C: derate linearly with 12 mW/K
plastic mini-pack (SO)
500
mW
above +70
C: derate linearly with 8 mW/K
P
S
power dissipation per switch
100
mW
SYMBOL
PARAMETER
74HC
74HCT
UNIT
CONDITIONS
min.
typ.
max.
min.
typ.
max.
V
CC
DC supply voltage
2.0
5.0
10.0
4.5
5.0
5.5
V
V
I
DC input voltage range
GND
V
CC
GND
V
CC
V
V
S
DC switch voltage range
GND
V
CC
GND
V
CC
V
T
amb
operating ambient
temperature range
-
40
+85
-
40
+85
C
see DC and AC
CHARACTERISTICS
T
amb
operating ambient
temperature range
-
40
+125
-
40
+125
C
t
r
, t
f
input rise and fall times
6.0
1000
6.0
500
ns
V
CC
= 2.0 V
500
V
CC
= 4.5 V
400
V
CC
= 6.0 V
250
V
CC
= 10.0 V