DATA SHEET
Product specification
Supersedes data of 1997 Apr 01
1999 Apr 26
DISCRETE SEMICONDUCTORS
BSR30; BSR31; BSR33
PNP medium power transistors
book, halfpage
M3D109
1999 Apr 26
2
Philips Semiconductors
Product specification
PNP medium power transistors
BSR30; BSR31; BSR33
FEATURES
High current (max. 1 A)
Low voltage (max. 80 V).
APPLICATIONS
Telephony and general industrial applications
Thick and thin-film circuits.
DESCRIPTION
PNP medium power transistor in a SOT89 plastic
package. NPN complements: BSR40; BSR41 and BSR43.
PINNING
PIN
DESCRIPTION
1
emitter
2
collector
3
base
Fig.1 Simplified outline (SOT89) and symbol.
handbook, halfpage
1
2
3
Bottom view
MAM297
3
2
1
MARKING
TYPE NUMBER
MARKING CODE
BSR30
BR1
BSR31
BR2
BSR33
BR4
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 6 cm
2
.
For other mounting conditions, see
"Thermal considerations for SOT89 in the General Part of associated Handbook".
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CBO
collector-base voltage
open emitter
BSR30; BSR31
-
-
70
V
BSR33
-
-
90
V
V
CEO
collector-emitter voltage
open base
BSR30; BSR31
-
-
60
V
BSR33
-
-
80
V
V
EBO
emitter-base voltage
open collector
-
-
5
V
I
C
collector current (DC)
-
-
1
A
I
CM
peak collector current
-
-
2
A
I
BM
peak base current
-
-
200
mA
P
tot
total power dissipation
T
amb
25
C; note 1
-
1.35
W
T
stg
storage temperature
-
65
+150
C
T
j
junction temperature
-
150
C
T
amb
operating ambient temperature
-
65
+150
C
1999 Apr 26
3
Philips Semiconductors
Product specification
PNP medium power transistors
BSR30; BSR31; BSR33
THERMAL CHARACTERISTICS
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm
2
.
For other mounting conditions, see
"Thermal considerations for SOT89 in the General Part of associated Handbook".
CHARACTERISTICS
T
amb
= 25
C unless otherwise specified.
Note
1. Pulse test: t
p
= 300
s;
< 0.01.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient
note 1
93
K/W
R
th j-s
thermal resistance from junction to soldering point
13
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
I
CBO
collector cut-off current
I
E
= 0; V
CB
=
-
60 V
-
-
100
nA
I
E
= 0; V
CB
=
-
60 V; T
j
= 150
C
-
-
50
A
I
EBO
emitter cut-off current
I
C
= 0; V
EB
=
-
5 V
-
-
100
nA
h
FE
DC current gain
I
C
=
-
100
A; V
CE
=
-
5 V; note 1
BSR30
10
-
BSR31; BSR33
30
-
DC current gain
I
C
=
-
100 mA; V
CE
=
-
5 V; note 1
BSR30
40
120
BSR31; BSR33
100
300
DC current gain
I
C
=
-
500 mA; V
CE
=
-
5 V; note 1
BSR30
30
-
BSR31; BSR33
50
-
V
CEsat
collector-emitter saturation
voltage
I
C
=
-
150 mA; I
B
=
-
15 mA; note 1
-
-
0.25
V
I
C
=
-
500 mA; I
B
=
-
50 mA; note 1
-
-
0.5
V
V
BEsat
base-emitter saturation voltage
I
C
=
-
150 mA; I
B
=
-
15 mA; note 1
-
-
1
V
I
C
=
-
500 mA; I
B
=
-
50 mA; note 1
-
-
1.2
V
f
T
transition frequency
I
C
=
-
50 mA; V
CE
=
-
10 V;
f = 100 MHz
100
-
MHz
1999 Apr 26
4
Philips Semiconductors
Product specification
PNP medium power transistors
BSR30; BSR31; BSR33
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
DIMENSIONS (mm are the original dimensions)
SOT89
97-02-28
w
M
e
1
e
E
HE
B
0
2
4 mm
scale
b3
b2
b1
c
D
L
A
Plastic surface mounted package; collector pad for good heat transfer; 3 leads
SOT89
1
2
3
UNIT
A
mm
1.6
1.4
0.48
0.35
c
0.44
0.37
D
4.6
4.4
E
2.6
2.4
HE
4.25
3.75
e
3.0
w
0.13
e1
1.5
L
min.
0.8
b2
b1
0.53
0.40
b3
1.8
1.4
1999 Apr 26
5
Philips Semiconductors
Product specification
PNP medium power transistors
BSR30; BSR31; BSR33
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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