Philips Semiconductors
Product specification
Triacs
BT131W series
logic level
GENERAL DESCRIPTION
QUICK REFERENCE DATA
Glass passivated, sensitive gate triacs
SYMBOL
PARAMETER
MAX.
MAX. UNIT
in a plastic envelope suitable for
surface mounting, intended for use in
BT131W-
500
600
general
purpose
bidirectional
V
DRM
Repetitive peak off-state voltages
500
600
V
switching
and
phase
control
I
T(RMS)
RMS on-state current
1
1
A
applications.
These
devices
are
I
TSM
Non-repetitive peak on-state current
10
10
A
intended to be interfaced directly to
microcontrollers,
logic
integrated
circuits and other low power gate
trigger circuits.
PINNING - SOT223
PIN CONFIGURATION
SYMBOL
PIN
DESCRIPTION
1
main terminal 1
2
main terminal 2
3
gate
tab
main terminal 2
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
-500
-600
V
DRM
Repetitive peak off-state
-
500
1
600
1
V
voltages
I
T(RMS)
RMS on-state current
full sine wave; T
sp
108 C
-
1
A
I
TSM
Non-repetitive peak
full sine wave; T
j
= 25 C prior to
on-state current
surge
t = 20 ms
-
10
A
t = 16.7 ms
-
11
A
I
2
t
I
2
t for fusing
t = 10 ms
-
0.5
A
2
s
dI
T
/dt
Repetitive rate of rise of
I
TM
= 1.5 A; I
G
= 0.2 A;
on-state current after
dI
G
/dt = 0.2 A/
s
triggering
T2+ G+
-
50
A/
s
T2+ G-
-
50
A/
s
T2- G-
-
50
A/
s
T2- G+
-
10
A/
s
I
GM
Peak gate current
-
2
A
V
GM
Peak gate voltage
-
5
V
P
GM
Peak gate power
-
5
W
P
G(AV)
Average gate power
over any 20 ms period
-
0.5
W
T
stg
Storage temperature
-40
150
C
T
j
Operating junction
-
125
C
temperature
T1
T2
G
4
1
2
3
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 3 A/
s.
July 1998
1
Rev 1.000
Philips Semiconductors
Product specification
Triacs
BT131W series
logic level
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
R
th j-sp
Thermal resistance
full or half cycle
-
-
15
K/W
junction to solder point
R
th j-a
Thermal resistance
pcb mounted; minimum footprint
-
156
-
K/W
junction to ambient
pcb mounted; pad area as in fig:14
-
70
-
K/W
STATIC CHARACTERISTICS
T
j
= 25 C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
I
GT
Gate trigger current
V
D
= 12 V; I
T
= 0.1 A
T2+ G+
-
0.4
3
mA
T2+ G-
-
1.3
3
mA
T2- G-
-
1.4
3
mA
T2- G+
-
3.8
7
mA
I
L
Latching current
V
D
= 12 V; I
GT
= 0.1 A
T2+ G+
-
1.2
5
mA
T2+ G-
-
4.0
8
mA
T2- G-
-
1.0
5
mA
T2- G+
-
2.5
8
mA
I
H
Holding current
V
D
= 12 V; I
GT
= 0.1 A
-
1.3
5
mA
V
T
On-state voltage
I
T
= 2 A
-
1.2
1.5
V
V
GT
Gate trigger voltage
V
D
= 12 V; I
T
= 0.1 A
-
0.7
1.5
V
V
D
= 400 V; I
T
= 0.1 A; T
j
= 125 C
0.2
0.3
-
V
I
D
Off-state leakage current
V
D
= V
DRM(max)
; T
j
= 125 C
-
0.1
0.5
mA
DYNAMIC CHARACTERISTICS
T
j
= 25 C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
dV
D
/dt
Critical rate of change of
V
DM
= 67% V
DRM(max)
; T
j
= 125 C;
5
15
-
V/
s
off-state voltage
exponential waveform; R
GK
= 1 k
t
gt
Gate controlled turn-on
I
TM
= 1.5 A; V
D
= V
DRM(max)
; I
G
= 0.1 A;
-
2
-
s
time
dI
G
/dt = 5 A/
s
July 1998
2
Rev 1.000
Philips Semiconductors
Product specification
Triacs
BT131W series
logic level
Fig.1. Maximum on-state dissipation, P
tot
, versus rms
on-state current, I
T(RMS)
, where
= conduction angle.
Fig.2. Maximum permissible non-repetitive peak
on-state current I
TSM
, versus pulse width t
p
, for
sinusoidal currents, t
p
20ms.
Fig.3. Maximum permissible non-repetitive peak
on-state current I
TSM
, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
Fig.4. Maximum permissible rms current I
T(RMS)
,
versus lead temperature T
lead
.
Fig.5. Maximum permissible repetitive rms on-state
current I
T(RMS)
, versus surge duration, for sinusoidal
currents, f = 50 Hz; T
lead
108C.
Fig.6. Normalised gate trigger voltage
V
GT
(T
j
)/ V
GT
(25C), versus junction temperature T
j
.
0
0.2
0.4
0.6
0.8
1
1.2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
= 180
120
90
60
30
BT134W
IT(RMS) / A
Ptot / W
Tsp(max) / C
125
122
119
116
113
110
107
104
1
-50
0
50
100
150
0
0.2
0.4
0.6
0.8
1
1.2
BT134W
Tsp / C
IT(RMS) / A
108 C
1
10
100
1000
BT134W
T / s
ITSM / A
10us
100us
1ms
10ms
100ms
T
ITSM
time
I
Tj initial = 25 C max
T
dI /dt limit
T
T2- G+ quadrant
0.01
0.1
1
10
0
0.5
1
1.5
2.0
2.5
3
BT132D
surge duration / s
IT(RMS) / A
1
10
100
1000
0
2
4
6
8
10
12
BT134W
Number of cycles at 50Hz
ITSM / A
T
ITSM
time
I
Tj initial = 25 C max
T
-50
0
50
100
150
0.4
0.6
0.8
1
1.2
1.4
1.6
BT136
Tj / C
VGT(Tj)
VGT(25 C)
July 1998
3
Rev 1.000
Philips Semiconductors
Product specification
Triacs
BT131W series
logic level
Fig.7. Normalised gate trigger current
I
GT
(T
j
)/ I
GT
(25C), versus junction temperature T
j
.
Fig.8. Normalised latching current I
L
(T
j
)/ I
L
(25C),
versus junction temperature T
j
.
Fig.9. Normalised holding current I
H
(T
j
)/ I
H
(25C),
versus junction temperature T
j
.
Fig.10. Typical and maximum on-state characteristic.
Fig.11. Transient thermal impedance Z
th j-sp
, versus
pulse width t
p
.
Fig.12. Minimum, critical rate of rise of off-state
voltage, dV
D
/dt versus junction temperature T
j
.
-50
0
50
100
150
0
0.5
1
1.5
2
2.5
3
BT131
Tj / C
T2+ G+
T2+ G-
T2- G-
T2- G+
IGT(Tj)
IGT(25 C)
0
0.5
1
1.5
2
0
0.5
1
1.5
2
BT134W
VT / V
IT / A
Tj = 125 C
typ
max
Tj = 25 C
Vo = 1.0 V
Rs = 0.21 Ohms
-50
0
50
100
150
0
0.5
1
1.5
2
2.5
3
TRIAC
Tj / C
IL(Tj)
IL(25 C)
10us
0.1ms
1ms
10ms
0.1s
1s
10s
tp / s
0.01
0.1
1
10
Zth j-sp (K/W)
100
t
p
P
t
D
unidirectional
bidirectional
BT134W
-50
0
50
100
150
0
0.5
1
1.5
2
2.5
3
TRIAC
Tj / C
IH(Tj)
IH(25C)
0
50
100
150
1
10
100
1000
Tj / C
dVD/dt (V/us)
July 1998
4
Rev 1.000
Philips Semiconductors
Product specification
Triacs
BT131W series
logic level
MOUNTING INSTRUCTIONS
Dimensions in mm.
Fig.13. soldering pattern for surface mounting SOT223.
3.8
min
6.3
2.3
4.6
1.5
min
1.5
min
1.5
min
(3x)
July 1998
5
Rev 1.000
Philips Semiconductors
Product specification
Triacs
BT131W series
logic level
MECHANICAL DATA
Dimensions in mm
Net Mass: 0.11 g
Fig.14. SOT223 surface mounting package.
Notes
1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines".
Order code: 9397 750 00505.
2. Epoxy meets UL94 V0 at 1/8".
6.7
6.3
3.1
2.9
4
1
2
3
2.3
1.05
0.85
0.80
0.60
4.6
3.7
3.3
7.3
6.7
B
A
0.10
0.02
13
16
max
1.8
max
10
max
0.32
0.24
(4x)
B
M
0.1
A
M
0.2
July 1998
6
Rev 1.000
Philips Semiconductors
Product specification
Triacs
BT131W series
logic level
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
July 1998
7
Rev 1.000
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