Document Outline
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- PINNING - SOT429 (TO247)
- PIN CONFIGURATION
- SYMBOL
- LIMITING VALUES
- THERMAL RESISTANCES
- STATIC CHARACTERISTICS
- DYNAMIC CHARACTERISTICS
- REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
- MECHANICAL DATA
- DEFINITIONS
- LIFE SUPPORT APPLICATIONS
Philips Semiconductors
Product Specification
PowerMOS transistor
BUK436W-200A/B
GENERAL DESCRIPTION
QUICK REFERENCE DATA
N-channel enhancement mode
SYMBOL
PARAMETER
MAX.
MAX.
UNIT
field-effect power transistor in a
plastic envelope.
BUK436
-200A
-200B
The device is intended for use in
V
DS
Drain-source voltage
200
200
V
Switched Mode Power Supplies
I
D
Drain current (DC)
19
17
A
(SMPS), motor control, welding,
P
tot
Total power dissipation
125
125
W
DC/DC and AC/DC converters, and
R
DS(ON)
Drain-source on-state
0.16
0.2
in general purpose switching
resistance
applications.
PINNING - SOT429 (TO247)
PIN CONFIGURATION
SYMBOL
PIN
DESCRIPTION
1
gate
2
drain
3
source
tab
drain
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DS
Drain-source voltage
-
-
200
V
V
DGR
Drain-gate voltage
R
GS
= 20 k
-
200
V
V
GS
Gate-source voltage
-
-
30
V
-200A
-200B
I
D
Drain current (DC)
T
mb
= 25 C
-
19
17
A
I
D
Drain current (DC)
T
mb
= 100 C
-
12
11
A
I
DM
Drain current (pulse peak value)
T
mb
= 25 C
-
76
68
A
P
tot
Total power dissipation
T
mb
= 25 C
-
125
W
T
stg
Storage temperature
-
- 55
150
C
T
j
Junction Temperature
-
-
150
C
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
R
th j-mb
Thermal resistance junction to
-
-
1.0
K/W
mounting base
R
th j-a
Thermal resistance junction to
-
45
-
K/W
ambient
2
3
1
d
g
s
July 1997
1
Rev 1.000
Philips Semiconductors
Product Specification
PowerMOS transistor
BUK436W-200A/B
STATIC CHARACTERISTICS
T
mb
= 25 C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
(BR)DSS
Drain-source breakdown
V
GS
= 0 V; I
D
= 0.25 mA
200
-
-
V
voltage
V
GS(TO)
Gate threshold voltage
V
DS
= V
GS
; I
D
= 1 mA
2.1
3.0
4.0
V
I
DSS
Zero gate voltage drain current
V
DS
= 200 V; V
GS
= 0 V; T
j
= 25 C
-
1
10
A
I
DSS
Zero gate voltage drain current
V
DS
= 200 V; V
GS
= 0 V; T
j
=125 C
-
0.1
1.0
mA
I
GSS
Gate source leakage current
V
GS
=
30 V; V
DS
= 0 V
-
10
100
nA
R
DS(ON)
Drain-source on-state
V
GS
= 10 V;
BUK436-200A
-
0.15
0.16
resistance
I
D
= 10 A
BUK436-200B
-
0.17
0.20
DYNAMIC CHARACTERISTICS
Tmb = 25 C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
g
fs
Forward transconductance
V
DS
= 25 V; I
D
= 10 A
8.5
16
-
S
C
iss
Input capacitance
V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz
-
1500
2000
pF
C
oss
Output capacitance
-
300
400
pF
C
rss
Feedback capacitance
-
60
100
pF
t
d on
Turn-on delay time
V
DD
= 30 V; I
D
= 3 A;
-
20
30
ns
t
r
Turn-on rise time
V
GS
= 10 V;
-
40
60
ns
t
d off
Turn-off delay time
R
gen
= 50
;
-
145
185
ns
t
f
Turn-off fall time
R
GS
= 50
-
50
70
ns
L
d
Internal drain inductance
Measured from contact screw on
-
5
-
nH
tab to centre of die
L
d
Internal drain inductance
Measured from drain lead 6 mm
-
5
-
nH
from package to centre of die
L
s
Internal source inductance
Measured from source lead 6 mm
-
12.5
-
nH
from package to source bond pad
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
Tmb = 25 C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
I
DR
Continuous reverse drain
-
-
-
19
A
current
I
DRM
Pulsed reverse drain current
-
-
-
76
A
V
SD
Diode forward voltage
I
F
= 19 A ; V
GS
= 0 V
-
1.0
1.7
V
t
rr
Reverse recovery time
I
F
= 19 A; -dI
F
/dt = 100 A/
s;
-
180
-
ns
Q
rr
Reverse recovery charge
V
GS
= 0 V; V
R
= 30 V
-
2.5
-
C
July 1997
2
Rev 1.000
Philips Semiconductors
Product Specification
PowerMOS transistor
BUK436W-200A/B
Fig.1. Normalised power dissipation.
PD% = 100
P
D
/P
D 25 C
= f(T
mb
)
Fig.2. Normalised continuous drain current.
ID% = 100
I
D
/I
D 25 C
= f(T
mb
); conditions: V
GS
10 V
Fig.3. Safe operating area. T
mb
= 25 C
I
D
& I
DM
= f(V
DS
); I
DM
single pulse; parameter t
p
Fig.4. Transient thermal impedance.
Z
th j-mb
= f(t); parameter D = t
p
/T
Fig.5. Typical output characteristics, T
j
= 25 C.
I
D
= f(V
DS
); parameter V
GS
Fig.6. Typical on-state resistance, T
j
= 25 C.
R
DS(ON)
= f(I
D
); parameter V
GS
0
20
40
60
80
100
120
140
Tmb / C
PD%
Normalised Power Derating
120
110
100
90
80
70
60
50
40
30
20
10
0
1E-05
1E-03
1E-01
1E+01
t / s
Zth j-mb / (K/W)
10
1
0.1
0.01
0.001
0
0.5
0.2
0.1
0.05
0.02
BUKx56-lv
D =
D =
t
p
t
p
T
T
P
t
D
0
20
40
60
80
100
120
140
Tmb / C
ID%
Normalised Current Derating
120
110
100
90
80
70
60
50
40
30
20
10
0
0
2
4
6
8
10
12
14
16
18
20
BUK456-200A
VDS / V
40
30
20
10
0
4
5
6
7
10
20
ID / A
VGS / V =
1
10
100
1000
VDS / V
100
10
1
0.1
DC
BUK436-200A,B
ID / A
tp = 10 us
100 us
1 ms
10 ms
100 ms
A B
RDS(ON) = VDS/ID
0
10
20
30
40
BUK456-200A
ID / A
1.0
0.8
0.6
0.4
0.2
0
4
4.5
5
5.5
6
7
10
RDS(ON) / Ohm
VGS / V =
July 1997
3
Rev 1.000
Philips Semiconductors
Product Specification
PowerMOS transistor
BUK436W-200A/B
Fig.7. Typical transfer characteristics.
I
D
= f(V
GS
) ; conditions: V
DS
= 25 V; parameter T
j
Fig.8. Typical transconductance, T
j
= 25 C.
g
fs
= f(I
D
); conditions: V
DS
= 25 V
Fig.9. Normalised drain-source on-state resistance.
a = R
DS(ON)
/R
DS(ON)25 C
= f(T
j
); I
D
= 10 A; V
GS
= 10 V
Fig.10. Gate threshold voltage.
V
GS(TO)
= f(T
j
); conditions: I
D
= 1 mA; V
DS
= V
GS
Fig.11. Sub-threshold drain current.
I
D
= f(V
GS)
; conditions: T
j
= 25 C; V
DS
= V
GS
Fig.12. Typical capacitances, C
iss
, C
oss
, C
rss
.
C = f(V
DS
); conditions: V
GS
= 0 V; f = 1 MHz
0
2
4
6
8
10
BUK456-200A
VGS / V
40
30
20
10
0
ID / A
Tj / C =
150
25
-60
-40
-20
0
20
40
60
80
100
120
140
Tj / C
VGS(TO) / V
4
3
2
1
0
max.
typ.
min.
0
10
20
30
40
BUK456-200A
ID / A
gfs / S
20
15
10
5
0
0
1
2
3
4
VGS / V
ID / A
1E-01
1E-02
1E-03
1E-04
1E-05
1E-06
SUB-THRESHOLD CONDUCTION
typ
2 %
98 %
-60
-40
-20
0
20
40
60
80
100 120 140
Tj / C
Normalised RDS(ON) = f(Tj)
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
a
0
20
40
VDS / V
C / pF
Ciss
Coss
Crss
10
100
1000
10000
BUK4y6-200
July 1997
4
Rev 1.000
Philips Semiconductors
Product Specification
PowerMOS transistor
BUK436W-200A/B
Fig.13. Typical turn-on gate-charge characteristics.
V
GS
= f(Q
G
); conditions: I
D
= 19 A; parameter V
DS
Fig.14. Typical reverse diode current.
I
F
= f(V
SDS
); conditions: V
GS
= 0 V; parameter T
j
0
10
20
30
40
QG / nC
VGS / V
12
10
8
6
4
2
0
VDS / V =40
160
BUK456-200
0
1
2
BUK456-200A
VSDS / V
IF / A
40
30
20
10
0
Tj / C = 150
25
July 1997
5
Rev 1.000
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