Philips Semiconductors
Product Specification
PowerMOS transistor
BUK554-200A/B
Logic level FET
GENERAL DESCRIPTION
QUICK REFERENCE DATA
N-channel enhancement mode
SYMBOL
PARAMETER
MAX.
MAX.
UNIT
logic level field-effect power
transistor in a plastic envelope.
BUK554
-200A
-200B
The device is intended for use in
V
DS
Drain-source voltage
200
200
V
Switched Mode Power Supplies
I
D
Drain current (DC)
9.2
8.2
A
(SMPS), motor control, welding,
P
tot
Total power dissipation
90
90
W
DC/DC and AC/DC converters, and
T
j
Junction temperature
175
175
C
in automotive and general purpose
R
DS(ON)
Drain-source on-state
0.4
0.5
switching applications.
resistance;
V
GS
= 5 V
PINNING - TO220AB
PIN CONFIGURATION
SYMBOL
PIN
DESCRIPTION
1
gate
2
drain
3
source
tab
drain
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DS
Drain-source voltage
-
-
200
V
V
DGR
Drain-gate voltage
R
GS
= 20 k
-
200
V
V
GS
Gate-source voltage
-
-
15
V
V
GSM
Non-repetitive gate-source voltage t
p
50
s
-
20
V
-200A
-200B
I
D
Drain current (DC)
T
mb
= 25 C
-
9.2
8.2
A
I
D
Drain current (DC)
T
mb
= 100 C
-
6.5
5.8
A
I
DM
Drain current (pulse peak value)
T
mb
= 25 C
-
36
33
A
P
tot
Total power dissipation
T
mb
= 25 C
-
90
W
T
stg
Storage temperature
-
- 55
175
C
T
j
Junction Temperature
-
-
175
C
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
R
th j-mb
Thermal resistance junction to
-
-
1.67
K/W
mounting base
R
th j-a
Thermal resistance junction to
-
60
-
K/W
ambient
1 2 3
tab
d
g
s
April 1993
1
Rev 1.100
Philips Semiconductors
Product Specification
PowerMOS transistor
BUK554-200A/B
Logic level FET
STATIC CHARACTERISTICS
T
mb
= 25 C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
(BR)DSS
Drain-source breakdown
V
GS
= 0 V; I
D
= 0.25 mA
200
-
-
V
voltage
V
GS(TO)
Gate threshold voltage
V
DS
= V
GS
; I
D
= 1 mA
1.0
1.5
2.0
V
I
DSS
Zero gate voltage drain current
V
DS
= 200 V; V
GS
= 0 V; T
j
= 25 C
-
1
10
A
I
DSS
Zero gate voltage drain current
V
DS
= 200 V; V
GS
= 0 V; T
j
=125 C
-
0.1
1.0
mA
I
GSS
Gate source leakage current
V
GS
=
10 V; V
DS
= 0 V
-
10
100
nA
R
DS(ON)
Drain-source on-state
V
GS
= 5 V;
BUK554-200A
-
0.35
0.4
resistance
I
D
= 3.5 A
BUK554-200B
-
0.4
0.5
DYNAMIC CHARACTERISTICS
T
mb
= 25 C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
g
fs
Forward transconductance
V
DS
= 25 V; I
D
= 3.5 A
3.5
6.0
-
S
C
iss
Input capacitance
V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz
-
800
1000
pF
C
oss
Output capacitance
-
120
160
pF
C
rss
Feedback capacitance
-
65
90
pF
t
d on
Turn-on delay time
V
DD
= 30 V; I
D
= 2.9 A;
-
16
30
ns
t
r
Turn-on rise time
V
GS
= 5 V; R
GS
= 50
;
-
75
110
ns
t
d off
Turn-off delay time
R
gen
= 50
-
120
180
ns
t
f
Turn-off fall time
-
50
75
ns
L
d
Internal drain inductance
Measured from contact screw on
-
3.5
-
nH
tab to centre of die
L
d
Internal drain inductance
Measured from drain lead 6 mm
-
4.5
-
nH
from package to centre of die
L
s
Internal source inductance
Measured from source lead 6 mm
-
7.5
-
nH
from package to source bond pad
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
T
mb
= 25 C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
I
DR
Continuous reverse drain
-
-
-
9.2
A
current
I
DRM
Pulsed reverse drain current
-
-
-
36
A
V
SD
Diode forward voltage
I
F
= 9.2 A ; V
GS
= 0 V
-
1.1
1.3
V
t
rr
Reverse recovery time
I
F
= 9.2 A; -dI
F
/dt = 100 A/
s;
-
200
-
ns
Q
rr
Reverse recovery charge
V
GS
= 0 V; V
R
= 100 V
-
0.6
-
C
AVALANCHE LIMITING VALUE
T
mb
= 25 C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
W
DSS
Drain-source non-repetitive
I
D
= 9 A ; V
DD
100 V ;
-
-
50
mJ
unclamped inductive turn-off
V
GS
= 5 V ; R
GS
= 50
energy
April 1993
2
Rev 1.100
Philips Semiconductors
Product Specification
PowerMOS transistor
BUK554-200A/B
Logic level FET
Fig.1. Normalised power dissipation.
PD% = 100
P
D
/P
D 25 C
= f(T
mb
)
Fig.2. Normalised continuous drain current.
ID% = 100
I
D
/I
D 25 C
= f(T
mb
); conditions: V
GS
5 V
Fig.3. Safe operating area. T
mb
= 25 C
I
D
& I
DM
= f(V
DS
); I
DM
single pulse; parameter t
p
Fig.4. Transient thermal impedance.
Z
th j-mb
= f(t); parameter D = t
p
/T
Fig.5. Typical output characteristics, T
j
= 25 C.
I
D
= f(V
DS
); parameter V
GS
Fig.6. Typical on-state resistance, T
j
= 25 C.
R
DS(ON)
= f(I
D
); parameter V
GS
0
20
40
60
80
100
120
140
160
180
Tmb / C
PD%
Normalised Power Derating
120
110
100
90
80
70
60
50
40
30
20
10
0
1E-07
1E-05
1E-03
1E-01
1E+01
t / s
Zth / (K/W)
10
1
0.1
0.01
0
0.5
0.2
0.1
0.05
0.02
D =
BUKx54-lv
D =
t
p
t
p
T
T
P
t
D
0
20
40
60
80
100
120
140
160
180
Tmb / C
ID%
Normalised Current Derating
120
110
100
90
80
70
60
50
40
30
20
10
0
0
2
4
6
8
10
12
14
16
18
20
BUK554-200A
VDS / V
20
15
10
5
0
3
4
5
7
10
ID / A
VGS / V =
1
10
100
1000
VDS / V
100
10
1
0.1
DC
BUK554-200A,B
ID / A
tp = 10 us
100 us
1 ms
10 ms
RDS(ON) = VDS/ID
100 ms
A
B
0
2
4
6
8
10
12
14
16
18
20
BUK554-200A
ID / A
1.0
0.8
0.6
0.4
0.2
0
2.5
3
3.5
4
4.5
5
10
RDS(ON) / Ohm
VGS / V =
April 1993
3
Rev 1.100
Philips Semiconductors
Product Specification
PowerMOS transistor
BUK554-200A/B
Logic level FET
Fig.7. Typical transfer characteristics.
I
D
= f(V
GS
) ; conditions: V
DS
= 25 V; parameter T
j
Fig.8. Typical transconductance, T
j
= 25 C.
g
fs
= f(I
D
); conditions: V
DS
= 25 V
Fig.9. Normalised drain-source on-state resistance.
a = R
DS(ON)
/R
DS(ON)25 C
= f(T
j
); I
D
= 3.5 A; V
GS
= 5 V
Fig.10. Gate threshold voltage.
V
GS(TO)
= f(T
j
); conditions: I
D
= 1 mA; V
DS
= V
GS
Fig.11. Sub-threshold drain current.
I
D
= f(V
GS)
; conditions: T
j
= 25 C; V
DS
= V
GS
Fig.12. Typical capacitances, C
iss
, C
oss
, C
rss
.
C = f(V
DS
); conditions: V
GS
= 0 V; f = 1 MHz
0
2
4
6
8
BUK554-200A
VGS / V
20
15
10
5
0
ID / A
Tj / C =
25
150
-60
-20
20
60
100
140
180
Tj / C
VGS(TO) / V
2
1
0
max.
typ.
min.
0
2
4
6
8
10
12
14
16
18
20
BUK554-200A
ID / A
gfs / S
8
7
6
5
4
3
2
1
0
0
0.4
0.8
1.2
1.6
2
2.4
VGS / V
ID / A
1E-01
1E-02
1E-03
1E-04
1E-05
1E-06
SUB-THRESHOLD CONDUCTION
2 %
typ
98 %
-60
-20
20
60
100
140
180
Tj / C
Normalised RDS(ON) = f(Tj)
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
a
0
20
40
VDS / V
C / pF
Ciss
Coss
Crss
10
100
1000
10000
BUK5y4-200
April 1993
4
Rev 1.100
Philips Semiconductors
Product Specification
PowerMOS transistor
BUK554-200A/B
Logic level FET
Fig.13. Typical turn-on gate-charge characteristics.
V
GS
= f(Q
G
); conditions: I
D
= 9.2 A; parameter V
DS
Fig.14. Typical reverse diode current.
I
F
= f(V
SDS
); conditions: V
GS
= 0 V; parameter T
j
Fig.15. Normalised avalanche energy rating.
W
DSS
% = f(T
mb
); conditions: I
D
= 9 A
Fig.16. Avalanche energy test circuit.
0
10
20
30
40
QG / nC
VGS / V
12
10
8
6
4
2
0
VDS / V =40
160
BUK554-200
20
40
60
80
100
120
140
160
180
Tmb / C
120
110
100
90
80
70
60
50
40
30
20
10
0
WDSS%
0
1
2
BUK554-200A
VSDS / V
20
15
10
5
0
IF / A
Tj / C = 150
25
L
T.U.T.
VDD
RGS
R 01
VDS
-ID/100
+
-
shunt
VGS
0
W
DSS
=
0.5
LI
D
2
BV
DSS
/(
BV
DSS
-
V
DD
)
April 1993
5
Rev 1.100
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