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Электронный компонент: PBYL3020CTB

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Philips Semiconductors
Product specification
Rectifier diodes
PBYL3025CT, PBYL3025CTB series
Schottky barrier
FEATURES
SYMBOL
QUICK REFERENCE DATA
Low forward volt drop
Fast switching
V
R
= 20 V/ 25 V
Reverse surge capability
High thermal cycling performance
I
O(AV)
= 30 A
Low thermal resistance
V
F
0.43 V
GENERAL DESCRIPTION
Dual schottky rectifier diodes intended for use as output rectifiers in low voltage, high frequency switched mode power
supplies.
The PBYL3025CT series is supplied in the SOT78 (TO220AB) conventional leaded package.
The PBYL3025CTB series is supplied in the SOT404 surface mounting package.
PINNING
SOT78 (TO220AB)
SOT404
PIN
DESCRIPTION
1
gate
2
drain
1
3
source
tab
drain
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
PBYL30
20CT
25CT
PBYL30
20CTB
25CTB
V
RRM
Peak repetitive reverse
-
20
25
V
voltage
V
RWM
Working peak reverse
-
20
25
V
voltage
V
R
Continuous reverse voltage
T
mb
120 C
-
20
25
V
I
O(AV)
Average rectified output
square wave;
= 0.5; T
mb
123 C
-
30
A
current (both diodes
conducting)
I
FRM
Repetitive peak forward
square wave;
= 0.5; T
mb
123 C
-
30
A
current per diode
I
FSM
Non-repetitive peak forward
t = 10 ms
-
135
A
current per diode
t = 8.3 ms
-
150
A
sinusoidal; T
j
= 125 C prior to
surge; with reapplied V
RRM(max)
I
RRM
Peak repetitive reverse
pulse width and repetition rate
-
1
A
surge current per diode
limited by T
j max
T
j
Operating junction
-
150
C
temperature
T
stg
Storage temperature
- 65
175
C
1. It is not possible to make connection to pin 2 of the SOT404 package.
k
a1
a2
1
3
2
1 2 3
tab
1
3
tab
2
March 1998
1
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes
PBYL3025CT, PBYL3025CTB series
Schottky barrier
THERMAL RESISTANCES
SYMBOL PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
R
th j-mb
Thermal resistance junction
per diode
-
-
2
K/W
to mounting base
both diodes
-
-
1.5
K/W
R
th j-a
Thermal resistance junction
SOT78 package, in free air
-
60
-
K/W
to ambient
SOT404 package, pcb mounted, minimum
-
50
-
K/W
footprint, FR4 board
ELECTRICAL CHARACTERISTICS
All characteristics are per diode at T
j
= 25 C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
V
F
Forward voltage
I
F
= 15 A; T
j
= 150C
-
0.35
0.43
V
I
F
= 15 A; T
j
= 125C
-
0.38
0.46
V
I
F
= 30 A; T
j
= 125C
-
0.52
0.6
V
I
F
= 30 A
-
0.6
0.67
V
I
R
Reverse current
V
R
= V
RWM
-
1
5
mA
V
R
= V
RWM
; T
j
= 100C
-
22
40
mA
C
d
Junction capacitance
V
R
= 5 V; f = 1 MHz, T
j
= 25C to 125C
-
700
-
pF
March 1998
2
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes
PBYL3025CT, PBYL3025CTB series
Schottky barrier
Fig.1. Maximum forward dissipation P
F
= f(I
F(AV)
) per
diode; square current waveform where
I
F(AV)
=I
F(RMS)
x
D.
Fig.2. Maximum forward dissipation P
F
= f(I
F(AV)
) per
diode; sinusoidal current waveform where a = form
factor = I
F(RMS)
/ I
F(AV)
.
Fig.3. Typical and maximum forward characteristic
I
F
= f(V
F
); parameter T
j
Fig.4. Typical reverse leakage current per diode;
I
R
= f(V
R
); parameter T
j
Fig.5. Typical junction capacitance per diode;
C
d
= f(V
R
); f = 1 MHz; T
j
= 25C to 125 C.
Fig.6. Transient thermal impedance per diode;
Z
th j-mb
= f(t
p
).
0
5
10
15
20
25
0
2
4
6
8
10
12
D = 1.0
0.5
0.2
0.1
PBYL3025CT
Rs = 0.009 Ohms
Vo = 0.32 V
Average forward current, IF(AV) (A)
Forward dissipation, PF (W)
Tmb(max) / C
150
T
I
D =
t
p
t
p
T
t
146
142
138
134
130
126
0
5
10
15
20
25
10uA
100uA
1mA
10mA
100mA
1A
PBYR2025CT
VR / V
IR / A
100
25
Tj = 150 C
125
75
50
0
5
10
15
0
2
4
6
8
10
a = 1.57
1.9
2.2
2.8
4
PBYL3025CT
Rs = 0.009 Ohms
Vo = 0.32 V
Average forward current, IF(AV) (A)
Forward dissipation, PF (W)
Tmb(max) / C
150
146
142
138
134
130
1
10
100
100
1000
10000
PBYR2025CT
VR / V
Cd / pF
0
0.2
0.4
0.6
0.8
1
0
5
10
15
20
25
30
PBYR2025CT
VF / V
IF / A
Tj = 125 C
Tj = 25 C
typ
max
1us
10us
100us
1ms
10ms
100ms
1s
10s
0.001
0.01
0.1
1
10
PBYL3025CT
pulse width, tp (s)
Transient thermal impedance, Zth j-mb (K/W)
D =
t
p
t
p
T
T
P
t
D
March 1998
3
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes
PBYL3025CT, PBYL3025CTB series
Schottky barrier
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
Fig.7. SOT78 (TO220AB); pin 2 connected to mounting base.
Notes
1. Refer to mounting instructions for SOT78 (TO220) envelopes.
2. Epoxy meets UL94 V0 at 1/8".
10,3
max
3,7
2,8
3,0
3,0 max
not tinned
1,3
max
(2x)
1 2 3
2,4
0,6
4,5
max
5,9
min
15,8
max
1,3
2,54 2,54
0,9 max (3x)
13,5
min
March 1998
4
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes
PBYL3025CT, PBYL3025CTB series
Schottky barrier
MECHANICAL DATA
Dimensions in mm
Net Mass: 1.4 g
Fig.8. SOT404 : centre pin connected to mounting base.
MOUNTING INSTRUCTIONS
Dimensions in mm
Fig.9. SOT404 : soldering pattern for surface mounting.
Notes
1. Epoxy meets UL94 V0 at 1/8".
11 max
4.5 max
1.4 max
10.3 max
0.5
15.4
2.5
0.85 max
(x2)
2.54 (x2)
17.5
11.5
9.0
5.08
3.8
2.0
March 1998
5
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes
PBYL3025CT, PBYL3025CTB series
Schottky barrier
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
March 1998
6
Rev 1.000