1.
Product profile
1.1 General description
Standard level N-channel enhancement mode field effect transistor in a plastic package
using TrenchMOSTM technology.
1.2 Features
1.3 Applications
s
DC-to-DC primary side switching.
1.4 Quick reference data
2.
Pinning information
[1]
It is not possible to make a connection to pin 2 of the SOT404 package.
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
Rev. 01 -- 8 November 2004
Product data sheet
s
Low on-state resistance
s
Fast switching
s
Low thermal resistance
s
Low gate charge.
s
V
DS
200 V
s
I
D
32.7 A
s
R
DSon
77 m
s
Q
gd
= 9.6 nC (typ).
Table 1:
Discrete pinning
Pin
Description
Simplified outline
Symbol
1
gate
SOT78 (TO-220AB)
SOT404 (D
2
-PAK)
2
drain
[1]
3
source
mb
mounting base;
connected to drain
1 2
mb
3
1
3
2
mb
S
D
G
mbb076
9397 750 14003
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 8 November 2004
2 of 13
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
3.
Ordering information
4.
Limiting values
Table 2:
Ordering information
Type number
Package
Name
Description
Version
PHP33NQ20T
TO-220AB
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3 lead
TO-220AB
SOT78
PHB33NQ20T
D
2
-PAK
Plastic single-ended surface mounted package (D
2
-PAK); 3 leads (one lead
cropped)
SOT404
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
V
DS
drain-source voltage (DC)
25
C
T
j
175
C
-
200
V
V
DGR
drain-gate voltage (DC)
25
C
T
j
175
C; R
GS
= 20 k
-
200
V
V
GS
gate-source voltage (DC)
-
20
V
I
D
drain current (DC)
T
mb
= 25
C; V
GS
= 10 V;
Figure 2
and
3
-
32.7
A
T
mb
= 100
C; V
GS
= 10 V;
Figure 2
-
23.1
A
I
DM
peak drain current
T
mb
= 25
C; pulsed; t
p
10
s;
Figure 3
-
65.4
A
P
tot
total power dissipation
T
mb
= 25
C;
Figure 1
-
230
W
T
stg
storage temperature
-
55
+175
C
T
j
junction temperature
-
55
+175
C
Source-drain diode
I
S
source (diode forward) current (DC)
T
mb
= 25
C
-
32.7
A
I
SM
peak source (diode forward) current T
mb
= 25
C; pulsed; t
p
10
s
-
65.4
A
Avalanche ruggedness
E
DS(AL)S
non-repetitive drain-source
avalanche energy
unclamped inductive load; I
D
= 10.4 A;
t
p
= 0.14 ms; V
DD
200 V; R
GS
= 50
;
V
GS
= 10 V; starting at T
j
= 25
C
-
190
mJ
9397 750 14003
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 8 November 2004
3 of 13
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
Fig 1.
Normalized total power dissipation as a
function of mounting base temperature.
Fig 2.
Normalized continuous drain current as a
function of mounting base temperature.
T
mb
= 25
C; I
DM
is single pulse; V
GS
= 10 V
Fig 3.
Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
03aa16
0
40
80
120
0
50
100
150
200
T
mb
(
C)
P
der
(%)
03aa24
0
40
80
120
0
50
100
150
200
T
mb
(
C)
I
der
(%)
P
der
P
tot
P
tot 25 C
(
)
-----------------------
100%
=
I
der
I
D
I
D 25 C
(
)
-------------------
100%
=
03ao10
10
-1
1
10
10
2
1
10
10
2
10
3
V
DS
(V)
I
D
(A)
DC
100
s
10 ms
Limit R
DSon
= V
DS
/ I
D
1 ms
t
p
= 10
s
9397 750 14003
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 8 November 2004
4 of 13
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
5.
Thermal characteristics
5.1 Transient thermal impedance
Table 4:
Thermal characteristics
Symbol Parameter
Conditions
Min
Typ
Max
Unit
R
th(j-mb)
thermal resistance from junction to mounting base
Figure 4
-
-
0.65
K/W
R
th(j-a)
thermal resistance from junction to ambient
SOT78
vertical in free air
-
60
-
K/W
SOT404
mounted on a printed-circuit
board; minimum footprint;
vertical in still air
-
50
-
K/W
Fig 4.
Transient thermal impedance from junction to mounting base as a function of pulse duration.
03ao09
10
-3
10
-2
10
-1
1
10
10
-5
10
-4
10
-3
10
-2
10
-1
1
t
p
(s)
Z
th(j-mb)
(K/W)
single pulse
= 0.5
0.2
0.1
0.05
0.02
t
p
T
P
t
t
p
T
=
9397 750 14003
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 8 November 2004
5 of 13
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
6.
Characteristics
Table 5:
Characteristics
T
j
= 25
C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
V
(BR)DSS
drain-source breakdown voltage
I
D
= 250
A; V
GS
= 0 V
T
j
= 25
C
200
-
-
V
T
j
=
-
55
C
180
-
-
V
V
GS(th)
gate-source threshold voltage
I
D
= 1 mA; V
DS
= V
GS
;
Figure 9
and
10
T
j
= 25
C
2
3
4
V
T
j
= 175
C
1
-
-
V
T
j
=
-
55
C
-
-
4.4
V
I
DSS
drain-source leakage current
V
DS
= 160 V; V
GS
= 0 V
T
j
= 25
C
-
-
1
A
T
j
= 175
C
-
-
500
A
I
GSS
gate-source leakage current
V
GS
=
20 V; V
DS
= 0 V
-
10
100
nA
R
DSon
drain-source on-state resistance
V
GS
= 10 V; I
D
= 15 A;
Figure 6
and
8
T
j
= 25
C
-
65
77
m
T
j
= 175
C
-
182
215
m
Dynamic characteristics
Q
g(tot)
total gate charge
I
D
= 25 A; V
DS
= 100 V; V
GS
= 10 V;
Figure 11
-
32.2
-
nC
Q
gs
gate-source charge
-
6.5
-
nC
Q
gd
gate-drain (Miller) charge
-
9.6
-
nC
C
iss
input capacitance
V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz;
Figure 13
-
1870
-
pF
C
oss
output capacitance
-
230
-
pF
C
rss
reverse transfer capacitance
-
70
-
pF
t
d(on)
turn-on delay time
V
DS
= 100 V; R
L
= 4
;
V
GS
= 10 V; R
G
= 6
-
12
-
ns
t
r
rise time
-
35
-
ns
t
d(off)
turn-off delay time
-
43
-
ns
t
f
fall time
-
45
-
ns
Source-drain diode
V
SD
source-drain (diode forward) voltage I
S
= 25 A; V
GS
= 0 V;
Figure 12
-
0.87
1.2
V
t
rr
reverse recovery time
I
S
= 20 A; dI
S
/dt =
-
100 A/
s; V
GS
= 0 V
-
150
-
ns
Q
r
recovered charge
-
645
-
nC
9397 750 14003
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 8 November 2004
6 of 13
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
T
j
= 25
C
T
j
= 25
C
Fig 5.
Output characteristics: drain current as a
function of drain-source voltage; typical values.
Fig 6.
Drain-source on-state resistance as a function
of drain current; typical values.
T
j
= 25
C and 175
C; V
DS
> I
D
R
DSon
Fig 7.
Transfer characteristics: drain current as a
function of gate-source voltage; typical values.
Fig 8.
Normalized drain-source on-state resistance
factor as a function of junction temperature.
03ao11
0
10
20
30
40
0
1
2
3
4
5
V
DS
(V)
I
D
(A)
T
j
= 25
C
V
GS
= 3.8 V
10 V
4 V
4.2 V
4.4 V
4.6 V
5 V
03ao12
25
50
75
100
125
0
10
20
30
40
I
D
(A)
R
DSon
(m
)
4.6 V
V
GS
= 4.4 V
T
j
= 25
C
10 V
5 V
03ao13
0
10
20
30
40
0
2
4
6
V
GS
(V)
I
D
(A)
V
DS
> I
D
x R
DSon
T
j
= 25
C
175
C
03al52
0
1
2
3
-60
0
60
120
180
a
T
j
(
C)
a
R
DSon
R
DSon 25 C
(
)
-----------------------------
=
9397 750 14003
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 8 November 2004
7 of 13
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
I
D
= 1 mA; V
DS
= V
GS
T
j
= 25
C; V
DS
= 5 V
Fig 9.
Gate-source threshold voltage as a function of
junction temperature.
Fig 10. Sub-threshold drain current as a function of
gate-source voltage.
I
D
= 25 A; V
DS
= 40 V, 100 V and 160 V
Fig 11. Gate-source voltage as a function of gate charge; typical values.
03aa32
0
1
2
3
4
5
-60
0
60
120
180
T
j
(
C)
V
GS(th)
(V)
max
min
typ
03aa35
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
0
2
4
6
V
GS
(V)
I
D
(A)
max
typ
min
03ao16
0
2
4
6
8
10
0
10
20
30
40
Q
G
(nC)
V
GS
(V)
I
D
= 25 A
T
j
= 25
C
V
DS
= 40 V
100 V
160 V
9397 750 14003
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 8 November 2004
8 of 13
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
T
j
= 25
C and 175
C; V
GS
= 0 V
V
GS
= 0 V; f = 1 MHz
Fig 12. Source (diode forward) current as a function of
source-drain (diode forward) voltage; typical
values.
Fig 13. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values.
03ao14
0
10
20
30
40
0
0.3
0.6
0.9
1.2
V
SD
(V)
I
S
(A)
T
j
= 25
C
175
C
V
GS
= 0 V
03ao15
10
10
2
10
3
10
4
10
-1
1
10
10
2
V
DS
(V)
C
(pF)
C
iss
C
oss
C
rss
9397 750 14003
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 8 November 2004
9 of 13
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
7.
Package outline
Fig 14. SOT78 (TO-220AB) package outline.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT78
SC-46
3-lead TO-220AB
D
D1
q
p
L
1
2
3
L1
(1)
b1
e
e
b
0
5
10 mm
scale
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB
SOT78
DIMENSIONS (mm are the original dimensions)
A
E
A1
c
Note
1. Terminals in this zone are not tinned.
Q
L2
UNIT
A1
b1
D1
e
p
mm
2.54
q
Q
A
b
D
c
L2
max.
3.0
3.8
3.6
15.0
13.5
3.30
2.79
3.0
2.7
2.6
2.2
0.7
0.4
15.8
15.2
0.9
0.6
1.3
1.0
4.5
4.1
1.39
1.27
6.4
5.9
10.3
9.7
L1
(1)
E
L
01-02-16
03-01-22
mounting
base
9397 750 14003
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 8 November 2004
10 of 13
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
Fig 15. SOT404 (D
2
-PAK) package outline.
UNIT
A
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
A1
D1
D
max.
E
e
Lp
HD
Q
c
2.54
2.60
2.20
15.80
14.80
2.90
2.10
11
1.60
1.20
10.30
9.70
4.50
4.10
1.40
1.27
0.85
0.60
0.64
0.46
b
DIMENSIONS (mm are the original dimensions)
SOT404
0
2.5
5 mm
scale
Plastic single-ended surface mounted package (D
2
-PAK); 3 leads (one lead cropped)
SOT404
e
e
E
b
D1
HD
D
Q
Lp
c
A1
A
1
3
2
mounting
base
01-02-12
04-10-13
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
9397 750 14003
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 8 November 2004
11 of 13
8.
Revision history
Table 6:
Revision history
Document ID
Release
date
Data sheet
status
Change
notice
Doc. number
Supersedes
PHP_PHB33NQ20T_1
20041108 Product
data sheet
-
9397 750 14003
-
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
9397 750 14003
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 -- 8 November 2004
12 of 13
9.
Data sheet status
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
10. Definitions
Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
11. Disclaimers
Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
12. Trademarks
TrenchMOS -- is a trademark of Koninklijke Philips Electronics N.V.
13. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level
Data sheet status
[1]
Product status
[2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 8 November 2004
Document number: 9397 750 14003
Published in The Netherlands
Philips Semiconductors
PHP/PHB33NQ20T
N-channel TrenchMOSTM standard level FET
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
3
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
5.1
Transient thermal impedance . . . . . . . . . . . . . . 4
6
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12
10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13
Contact information . . . . . . . . . . . . . . . . . . . . 12
PDF 
ZIP