1.
Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an
integrated guard ring for stress protection, encapsulated in small and flat lead plastic SMD
packages.
1.2 Features
s
Forward current:
2 A
s
Reverse voltage:
10 V
s
Ultra low forward voltage
s
Small and flat lead SMD plastic packages
1.3 Applications
s
Low voltage rectification
s
High efficiency DC-to-DC conversion
s
Switch mode power supply
s
Inverse polarity protection
s
Low power consumption applications
1.4 Quick reference data
[1]
Pulse test: t
p
300
s;
0.02.
PMEG1020EH; PMEG1020EJ
10 V, 2 A ultra low V
F
MEGA Schottky barrier rectifiers
Rev. 03 -- 14 April 2005
Product data sheet
Table 1:
Product overview
Type number
Package
Configuration
Philips
JEITA
PMEG1020EH
SOD123F
-
single diode
PMEG1020EJ
SOD323F
SC-90
single diode
Table 2:
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
I
F
forward current
T
sp
55
C
-
-
2
A
V
R
reverse voltage
-
-
10
V
V
F
forward voltage
I
F
= 2 A
[1]
-
350
460
mV
9397 750 14929
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 14 April 2005
2 of 9
Philips Semiconductors
PMEG1020EH; PMEG1020EJ
10 V, 2 A ultra low V
F
MEGA Schottky barrier rectifiers
2.
Pinning information
[1]
The marking bar indicates the cathode.
3.
Ordering information
4.
Marking
5.
Limiting values
Table 3:
Pinning
Pin
Description
Simplified outline
Symbol
1
cathode
[1]
2
anode
001aab540
1
2
sym001
1
2
Table 4:
Ordering information
Type number
Package
Name
Description
Version
PMEG1020EH
-
plastic surface mounted package; 2 leads
SOD123F
PMEG1020EJ
SC-90
plastic surface mounted package; 2 leads
SOD323F
Table 5:
Marking codes
Type number
Marking code
PMEG1020EH
A8
PMEG1020EJ
CB
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
V
R
reverse voltage
-
10
V
I
F
forward current
T
sp
55
C
-
2
A
I
FRM
repetitive peak forward current
t
p
1 ms;
0.5
-
7
A
I
FSM
non-repetitive peak forward
current
square wave;
t
p
= 8 ms
-
9
A
P
tot
total power dissipation
T
amb
25
C
PMEG1020EH
[1]
-
375
mW
[2]
-
830
mW
PMEG1020EJ
[1]
360
mW
[2]
-
830
mW
T
j
junction temperature
-
150
C
9397 750 14929
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 14 April 2005
3 of 9
Philips Semiconductors
PMEG1020EH; PMEG1020EJ
10 V, 2 A ultra low V
F
MEGA Schottky barrier rectifiers
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
6.
Thermal characteristics
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
For Schottky barrier rectifiers thermal run-away has to be considered, as in some applications the reverse
power losses P
R
are a significant part of the total power losses. Nomograms for determining the reverse
power losses P
R
and I
F(AV)
rating are available on request.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
[4]
Soldering point of cathode tab.
7.
Characteristics
[1]
Pulse test: t
p
300
s;
0.02.
T
amb
ambient temperature
-
65
+150
C
T
stg
storage temperature
-
65
+150
C
Table 6:
Limiting values
...continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Table 7:
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
R
th(j-a)
thermal resistance from junction
to ambient
in free air
PMEG1020EH
[1] [2]
-
-
330
K/W
[2] [3]
-
-
150
K/W
PMEG1020EJ
[1] [2]
-
-
350
K/W
[2] [3]
-
-
150
K/W
R
th(j-sp)
thermal resistance from junction
to solder point
[4]
PMEG1020EH
-
-
60
K/W
PMEG1020EJ
-
-
55
K/W
Table 8:
Characteristics
T
amb
= 25
C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
F
forward voltage
I
F
= 0.01 A
[1]
-
100
130
mV
I
F
= 0.1 A
[1]
-
170
200
mV
I
F
= 1 A
[1]
-
280
350
mV
I
F
= 2 A
[1]
-
350
460
mV
I
R
reverse current
V
R
= 5 V
-
0.7
2
mA
V
R
= 8 V
-
1
2.5
mA
V
R
= 10 V
-
1.2
3
mA
C
d
diode capacitance
V
R
= 5 V; f = 1 MHz
-
40
50
pF
9397 750 14929
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 14 April 2005
4 of 9
Philips Semiconductors
PMEG1020EH; PMEG1020EJ
10 V, 2 A ultra low V
F
MEGA Schottky barrier rectifiers
(1) T
amb
= 85
C
(2) T
amb
= 25
C
(3) T
amb
=
-
40
C
(1) T
amb
= 85
C
(2) T
amb
= 25
C
(3) T
amb
=
-
40
C
Fig 1.
Forward current as a function of forward
voltage; typical values
Fig 2.
Reverse current as a function of reverse
voltage; typical values
T
amb
= 25
C; f = 1 MHz
Fig 3.
Diode capacitance as a function of reverse voltage; typical values
006aaa008
10
10
2
10
3
10
4
I
F
(mA)
1
V
F
(mV)
0
400
300
100
200
(1)
(2)
(3)
006aaa009
10
2
10
10
4
10
3
10
5
I
R
(
A)
1
V
R
(V)
0
10
5
(1)
(2)
(3)
V
R
(V)
0
10
8
4
6
2
006aaa010
60
100
140
C
d
(pF)
20
9397 750 14929
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 14 April 2005
5 of 9
Philips Semiconductors
PMEG1020EH; PMEG1020EJ
10 V, 2 A ultra low V
F
MEGA Schottky barrier rectifiers
8.
Package outline
9.
Packing information
[1]
For further information and the availability of packing methods, see
Section 15
.
Fig 4.
Package outline SOD123F
Fig 5.
Package outline SOD323F (SC-90)
04-11-29
Dimensions in mm
1.2
1.0
0.25
0.10
3.6
3.4
2.7
2.5
0.55
0.35
0.70
0.55
1.7
1.5
1
2
04-09-13
Dimensions in mm
0.80
0.65
0.25
0.10
0.5
0.3
2.7
2.3
1.8
1.6
0.40
0.25
1.35
1.15
1
2
Table 9:
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
Package
Description
Packing quantity
3000
10000
PMEG1020EH
SOD123F
4 mm pitch, 8 mm tape and reel
-115
-135
PMEG1020EJ
SOD323F
9397 750 14929
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 14 April 2005
6 of 9
Philips Semiconductors
PMEG1020EH; PMEG1020EJ
10 V, 2 A ultra low V
F
MEGA Schottky barrier rectifiers
10. Soldering
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 6.
Reflow soldering footprint SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7.
Reflow soldering footprint SOD323F (SC-90)
1.6
1.6
2.9
4
4.4
1.1 1.2
2.1
1.1
(2
)
solder lands
solder resist
occupied area
solder paste
001aab169
1.65
0.50
(2
)
2.10
1.60
2.80
0.60
3.05
0.50
0.95
solder lands
solder resist
occupied area
solder paste
9397 750 14929
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 14 April 2005
7 of 9
Philips Semiconductors
PMEG1020EH; PMEG1020EJ
10 V, 2 A ultra low V
F
MEGA Schottky barrier rectifiers
11. Revision history
Table 10:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
PMEG1020EH_EJ_3
20050414
Product data sheet
-
9397 750 14929
PMEG1020EJ_2;
PMEG1020EH_1
Modifications:
This data sheet is a combination of data sheets PMEG1020EJ_2 and PMEG1020EH_1.
Product status for PMEG1020EH changed
PMEG1020EJ_2
20041001
Product data sheet
-
9397 750 14013
PMEG1020EJ_1
PMEG1020EH_1
20050203
Objective data sheet
-
9397 750 14173
-
Philips Semiconductors
PMEG1020EH; PMEG1020EJ
10 V, 2 A ultra low V
F
MEGA Schottky barrier rectifiers
9397 750 14929
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 -- 14 April 2005
8 of 9
12. Data sheet status
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
13. Definitions
Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
14. Disclaimers
Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
15. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level
Data sheet status
[1]
Product status
[2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 14 April 2005
Document number: 9397 750 14929
Published in The Netherlands
Philips Semiconductors
PMEG1020EH; PMEG1020EJ
10 V, 2 A ultra low V
F
MEGA Schottky barrier rectifiers
16. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9
Packing information. . . . . . . . . . . . . . . . . . . . . . 5
10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7
12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . 8
13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
15
Contact information . . . . . . . . . . . . . . . . . . . . . 8
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