PTN3342
High speed differential line receiver
Rev. 01 -- 05 January 2004
Product data
1.
Description
The PTN3342 is a differential line receiver that implements the electrical
characteristics of Low-Voltage Differential Signaling (LVDS). This device meets or
exceeds the requirements of the ANSI
TIA/EIA-644 Standard. LVDS is used to
achieve higher data rates on commonly used media. LVDS overcomes the limitations
of achievable slew rates and EMI restrictions of previous differential signaling
techniques. The PTN3342 operates at a 3.3 volt supply level. Any of the four
differential receivers provides a valid logical output state with a
100 mV differential
input voltage within the input common-mode voltage range. The input common-mode
voltage range allows 1 volt of ground potential difference between two LVDS nodes.
The PTN3342 is identical to the PTN3332 but with the termination resistor integrated
with the receiver.
The intended application of this device is for point-to-point baseband transmission
rates over a controlled impedance media of approximately 100
. The maximum
rates and distance of data transfer are dependent upon the attenuation
characteristics of the media selected and the noise coupling to the environment.
The PTN3342 is designed to function over the full industrial temperature range of
-
40
C to +85
C.
2.
Features
s
Meets or exceeds the requirements of ANSI
TIA/EIA-644 Standard
s
Designed for signaling rates of up to 400 Mbps
s
Differential input thresholds of
100 mV
s
Power dissipation of 60 mW typical at 200 MHz
s
Typical propagation delay of 2.6 ns
s
Low Voltage TTL (LVTTL) logic output levels
s
Pin compatible with AM26LS32 and SN65LVDS32
s
Open-circuit fail safe
s
Termination resistors on chip.
3.
Applications
s
Low voltage, low EMI, high speed differential signal receiver
s
Point-to-point high speed data transmission
s
High performance switches and routers.
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
2 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
4.
Ordering information
5.
Functional diagram division
Table 1:
Ordering information
Type number
Package
Name
Description
Version
PTN3342DH
TSSOP16
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
PTN3342D
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
Resistors = 110
.
Fig 1.
Functional diagram.
002aaa080
PTN3342
G
G
4
12
4Y
LVDS
13
4A
14
4B
15
4Y
LVDS
11
3A
10
3B
9
4Y
LVDS
5
2A
6
2B
7
4Y
LVDS
3
1A
2
1B
1
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
3 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
6.
Pinning information
6.1 Pinning
6.2 Pin description
Fig 2.
TSSOP16 pin configuration.
Fig 3.
SO16 pin configuration.
PTN3342DH
002aaa081
1
2
3
4
5
6
7
8
1B
1A
1Y
G
2Y
2A
2B
GND
V
CC
4B
4A
4Y
G
3Y
3A
3B
16
15
14
13
12
11
10
9
PTN3342D
002aaa082
1
2
3
4
5
6
7
8
1B
1A
1Y
G
2Y
2A
2B
GND
V
CC
4B
4A
4Y
G
3Y
3A
3B
16
15
14
13
12
11
10
9
Table 2:
Pin description
Symbol
Pin
Description
1B, 2B, 3B, 4B
1, 7, 9, 15
LVDS inverting input
1A, 2A, 3A, 4A
2, 6, 10, 14
LVDS non-inverting input
1Y, 2Y, 3Y, 4Y
3, 5, 11, 13
LVTTL output
G
4
Enable (active-HIGH)
GND
8
Ground
G
12
Enable (active-LOW)
V
CC
16
Supply
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
4 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
7.
Functional description
7.1 Function table
[1]
H = HIGH level; L = LOW level; X = irrelevant; Z = high impedance; ? = indeterminate state.
8.
Limiting values
[1]
Values beyond absolute maximum ratings can cause the device to be prematurely damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
9.
Recommended operating conditions
Table 3:
Function table
Differential input
Enables
Output
A, B
G
G
Y
V
ID
100 mV
H
X
H
X
L
H
-
100 mV < V
ID
< 100 mV
H
X
?
X
L
?
V
ID
-
100 mV
H
X
L
X
L
L
X
L
H
Z
Open
H
X
L
X
L
L
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Min
Max
Unit
V
CC
supply voltage
-
0.5
4.0
V
V
I
input voltage (enables and outputs)
-
0.5
V
CC
+ 0.5
V
T
amb
operating ambient temperature range
-
40
+85
C
T
j
operating junction temperature
-
40
+150
C
T
stg
storage temperature range
-
65
+150
C
ESD
>2
-
kV
Table 5:
Recommended operating conditions
Symbol
Parameter
Min
Nom
Max
Unit
V
CC
supply voltage
3
3.3
3.6
V
V
IH
HIGH-level input voltage
2
-
-
V
V
IL
LOW-level input voltage
-
-
0.8
V
V
ID
Magnitude of differential input voltage
0.1
-
0.6
V
V
IC
Common-mode input voltage
V
ID
/2
-
2.4
-
V
ID
/2
V
T
amb
Operating temperature range
-
40
-
+85
C
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
5 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
10. Static characteristics
[1]
All typical values are at T
amb
= 25
C and V
CC
= 3.3 V.
Table 6:
DC electrical characteristics
Over recommended operating conditions, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
[1]
Max
Unit
V
rr+
positive differential input voltage
threshold
See
Figure 4
and
Table 8
.
-
-
100
mV
V
rr
-
negative differential input voltage
threshold
-
100
-
-
mV
V
OH
HIGH-level output voltage
I
OH
=
-
8 mA
2.4
-
-
V
I
OH
=
-
4 mA
2.8
-
-
V
V
OL
LOW-level output voltage
-
-
0.4
V
I
CC
supply current
enabled, no load
-
10
18
mA
disabled
-
0.25
0.5
mA
I
I
input current (A or B inputs).
Input current measured with other input
open.
V
I
= 0 V
-
2
-
10
-
20
A
V
I
= 2.4 V
-
1.2
-
3
-
A
I
I(OFF)
Power-off input current (A or B inputs)
V
CC
= 0 V; V
I
= 3.6 V
-
6
20
A
I
IH
HIGH-level input current (G or G inputs)
V
IH
= 2 V
-
-
10
A
I
IL
LOW-level input current (G or G inputs)
V
IL
= 0.8 V
-
-
10
A
I
OZ
High-impedance output current
V
O
= 0 V or V
CC
-
10
-
10
A
Z
(t)
88
-
132
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
6 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
11. Dynamic characteristics
[1]
All typical values are at T
amb
= 25
C, and V
CC
= 3.3 V.
[2]
t
sk(o)
is the skew between specified outputs of a single device with all driving inputs connected together and the outputs switching in the
same direction while driving identical specified loads.
[3]
t
sk(p-p)
is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, same temperature, and have identical packages and test circuits.
Table 7:
AC electrical characteristics
Over recommended operating conditions, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
[1]
Max
Unit
t
PLH
propagation delay, LOW-to-HIGH level output
C
L
= 10 pF
See
Figure 5
.
1.3
2.6
6
ns
t
PHL
propagation delay, HIGH-to-LOW level output
1.3
2.5
6
ns
t
r
output rise time (20 to 80%)
-
0.6
-
ns
t
f
output fall time (80 to 20%)
-
0.7
-
ns
t
sk(p)
pulse skew (t
PHL
-
t
PLH
)
-
-
0.4
ns
t
sk(o)
channel-to-channel output skew
[2]
-
0.1
0.3
ns
t
sk(p-p)
part-to-part skew
[3]
-
-
1
ns
t
PZH
propagation delay, high-impedance to
HIGH-level output
See
Figure 6
.
-
8
12
ns
t
PZL
propagation delay, high-impedance to LOW-level
output
-
3
12
ns
t
PHZ
propagation delay, HIGH-level to
high-impedance output
-
6.5
12
ns
t
PLZ
propagation delay, LOW-level to high-impedance
output
-
5.5
12
ns
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
7 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
12. Test figures
Fig 4.
Voltage definitions.
Table 8:
Receiver minimum and maximum input threshold test voltages
Applied voltages
Resulting differential
input voltage
Resulting common-mode
input voltage
V
IA
V
IB
V
ID
V
IC
1.25 V
1.15 V
100 mV
1.2 V
1.15 V
1.25 V
-
100 mV
1.2 V
2.4 V
2.3 V
100 mV
2.35 V
2.3 V
2.4 V
-
100 mV
2.35 V
0.1 V
0 V
100 mV
0.05 V
0 V
0.1 V
-
100 mV
0.05 V
1.5 V
0.9 V
600 mV
1.2 V
0.9 V
1.5 V
-
600 mV
1.2 V
2.4 V
1.8 V
600 mV
2.1 V
1.8 V
2.4 V
-
600 mV
2.1 V
0.6 V
0 V
600 mV
0.3 V
0 V
0.6 V
-
600 mV
0.3 V
A
B
Y
(V
IA
+ V
IB
)
2
V
IC
V
IA
V
IB
V
ID
V
O
002aaa029
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
8 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Fig 5.
Timing test circuit and waveforms.
A
B
Y
V
IA
V
IB
V
ID
V
O
002aaa030
C
L
= 10 pF
V
IA
V
IB
1.4 V
1.0 V
V
ID
0.4 V
0.4 V
0 V
V
OH
1.4 V
V
OL
t
PHL
t
PLH
t
f
t
r
80%
20%
80%
20%
V
O
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
9 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Fig 6.
Enable/disable time test circuit and waveforms.
t
PZH
V
O
A
B
002aaa031
C
L
10 pF
1.2 V
G
G
V
TEST
A
G
2.5 V
1.0 V
2.0 V
1.4 V
0.8 V
2.0 V
1.4 V
0.8 V
G
V
TEST
t
PZL
t
PLZ
t
PZL
t
PLZ
V
OL
V
OL
+ 0.5 V
1.4 V
2.5 V
Y
V
TEST
A
G
0 V
1.4 V
2.0 V
1.4 V
0.8 V
2.0 V
1.4 V
0.8 V
G
t
PHZ
t
PZH
t
PHZ
0 V
V
OH
0.5 V
1.4 V
V
OH
Y
R
500
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
10 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
13. Package outline
Fig 7.
TSSOP16 package outline (SOT403-1).
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.40
0.06
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1
MO-153
99-12-27
03-02-18
w
M
b
p
D
Z
e
0.25
1
8
16
9
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
A
max.
1.1
pin 1 index
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
11 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Fig 8.
SO16 package outline (SOT109-1).
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT109-1
99-12-27
03-02-19
076E07
MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.39
0.38
0.16
0.15
0.05
1.05
0.041
0.244
0.228
0.028
0.020
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
0
2.5
5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
12 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering can still
be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In
these situations reflow soldering is recommended. In these situations reflow
soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270
C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 225
C (SnPb process) or below 245
C (Pb-free process)
for all BGA, HTSSON..T and SSOP..T packages
for packages with a thickness
2.5 mm
for packages with a thickness < 2.5 mm and a volume
350 mm
3
so called
thick/large packages.
below 240
C (SnPb process) or below 260
C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
13 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
C or
265
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in
most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
C.
14.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
Table 9:
Suitability of surface mount IC packages for wave and reflow soldering
methods
Package
[1]
Soldering method
Wave
Reflow
[2]
BGA, HTSSON..T
[3]
, LBGA, LFBGA, SQFP,
SSOP..T
[3]
, TFBGA, USON, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable
[4]
suitable
PLCC
[5]
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
[5][6]
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended
[7]
suitable
CWQCCN..L
[8]
, PMFP
[9]
, WQCCN..L
[8]
not suitable
not suitable
Philips Semiconductors
PTN3342
High speed differential line receiver
Product data
Rev. 01 -- 05 January 2004
14 of 16
9397 750 08484
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
C
10
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Revision history
Table 10:
Revision history
Rev Date
CPCN
Description
01
20040105
-
Product data (9397 750 08484). ECN 853-2444 A14997 of 15 December 2003.
9397 750 08484
Philips Semiconductors
PTN3342
High speed differential line receiver
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 01 -- 05 January 2004
15 of 16
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.
Fax: +31 40 27 24825
16. Data sheet status
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
18. Disclaimers
Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Level
Data sheet status
[1]
Product status
[2][3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Koninklijke Philips Electronics N.V. 2004.
Printed in the U.S.A.
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 05 January 2004
Document order number: 9397 750 08484
Contents
Philips Semiconductors
PTN3342
High speed differential line receiver
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Functional diagram division . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
7.1
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
9
Recommended operating conditions. . . . . . . . 4
10
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
11
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
12
Test figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14.1
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14.2
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12
14.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12
14.4
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13
14.5
Package related soldering information . . . . . . 13
15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15
17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
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