Document Outline
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- PACKAGE OUTLINE
- RATINGS
- CHARACTERISTICS
- APPLICATION INFORMATION
- PACKAGE OUTLINE
- SOLDERING
- DEFINITIONS
- LIFE SUPPORT APPLICATIONS
DATA SHEET
Product specification
File under Integrated Circuits, ICO1
March 1986
INTEGRATED CIRCUITS
TDA1015T
0,5 W audio power amplifier
March 1986
2
Philips Semiconductors
Product specification
0,5 W audio power amplifier
TDA1015T
GENERAL DESCRIPTION
The TDA1015T is a low-cost audio amplifier which can deliver up to 0,5 W output power into a 16
load impedance at
a supply voltage of 9 V. The amplifier is specially designed for portable applications such as radios and recorders.
The IC has a very low supply voltage requirement (3,6 V min.).
Features
High input impedance
Separated preamplifier and power amplifier
Limited noise behaviour at radio frequencies
Short-circuit protected
Miniature encapsulation.
QUICK REFERENCE DATA
PACKAGE OUTLINE
8-lead mini-pack; plastic (SO8; SOT96A); SOT96-1; 1996 July 23.
Supply voltage range
V
P
3,6 to 12 V
Peak output current
I
OM
max.
1 A
Output power
P
o
typ.
0,5 W
Voltage gain power amplifier
G
V1
typ.
29 dB
Voltage gain preamplifier
G
V2
typ.
23 dB
Total quiescent current
I
tot
max.
22 mA
Operating ambient temperature range
T
amb
-
25 to +150
C
Storage temperature range
T
stg
-
55 to + 150
C
March 1986
3
Philips Semiconductors
Product specification
0,5 W audio power amplifier
TDA1015T
Fig.1 Block diagram.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage
V
P
max.
12 V
Peak output current
I
OM
max.
1 A
Total power dissipation
see derating curve Fig.2
Storage temperature range
-
55 to + 150
C
A.C. short-circuit duration of load during sine-wave drive at V
P
= 9 V
t
sc
max.
1 hour
Fig.2 Power derating curve.
March 1986
4
Philips Semiconductors
Product specification
0,5 W audio power amplifier
TDA1015T
CHARACTERISTICS
T
amb
= 25
C; V
P
= 9 V; R
L
= 16
; f = 1 kHz; see Fig.3; unless otherwise specified
Notes to the characteristics
1. Output power is measured with an ideal coupling capacitor to the speaker load.
2. Measured with a load resistance of 20 k
.
3. The frequency response is mainly determined by the capacitors, C1, C3 (low frequency) and C4 (high frequency).
4. Independent of load impedance of preamplifier.
5. Effective unweighted r.m.s. noise voltage measured in a bandwidth from 60 Hz to 15 kHz (slopes 12 dB/octave).
6. Ripple rejection measured with a source impedance between 0 and 2 k
(maximum ripple amplitude of 2 V).
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
V
P
Supply voltage
3,6
9
12
V
I
ORM
Repetitive peak output current
-
-
1
A
I
tot
Total quiescent current
-
12
22
mA
A.F. output power at d
tot
= 10%; note 1
P
o
V
P
= 9 V; R
L
= 16
-
0,5
-
W
P
o
V
P
= 6 V; R
L
= 8
-
0,3
-
W
G
v1
Voltage gain power amplifier
-
29
-
dB
G
v2
Voltage gain preamplifier (note 2)
-
23
-
dB
G
tot
Total voltage gain
49
52
55
dB
B
Frequency response at
-
3 dB (note 3)
-
60 to 15 000
-
Hz
|Z
i1
|
Input impedance power amplifier
-
20
-
k
|Z
i2
|
Input impedance preamplifier (note 4)
100
200
-
k
|Z
o2
|
Output impedance preamplifier
0,5
1
1,5
k
Output voltage preamplifier (r.m.s. value)
V
o2(rms)
d
tot
< 1% (note 2)
-
0,7
-
V
Noise output voltage (r.m.s. value); note 5
V
n(rms)
R
S
= 0
-
0,2
-
mV
V
n(rms)
R
S
= 10 k
-
0,5
-
mV
Noise output voltage (r.m.s. value)
V
n(rms)
f = 500 kHz; B = 5 kHz; R
S
= 0
-
8
-
V
Ripple rejection at f = 100 Hz;
RR
C2 = 1
F (note 6)
-
38
-
dB
March 1986
5
Philips Semiconductors
Product specification
0,5 W audio power amplifier
TDA1015T
APPLICATION INFORMATION
Fig.3 Test circuit.
Fig.4
Total quiescent current as a function
of supply voltage.
Fig.5
Output power as a function of supply
voltage; d
tot
= 10%; f = 1 kHz.
______
measured in Fig.3
- - - -
measured with a 1,5 M
resistor
connected between pins 7 and 2.
March 1986
6
Philips Semiconductors
Product specification
0,5 W audio power amplifier
TDA1015T
Fig.6 Total distortion as a function of output power; V
P
= 9 V; R
L
= 16
; f = kHz.
______
measured in Fig.3
- - - -
measured with a 1,5 M
resistor connected between pins 7 and 2.
Fig.7 Application circuit for power stage only and battery power supply; G
v1
= 29 dB; |Z
i1
| = 20 k
.
March 1986
7
Philips Semiconductors
Product specification
0,5 W audio power amplifier
TDA1015T
Fig.8
Application circuit for preamplifier and power amplifier stages and battery power supply;
G
v tot
= 52 dB; |Z
i2
| = 200 k
.
March 1986
8
Philips Semiconductors
Product specification
0,5 W audio power amplifier
TDA1015T
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S
MS-012AA
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.050
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
95-02-04
97-05-22
March 1986
9
Philips Semiconductors
Product specification
0,5 W audio power amplifier
TDA1015T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
March 1986
10
Philips Semiconductors
Product specification
0,5 W audio power amplifier
TDA1015T
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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