DATA SHEET
Preliminary specification
Supersedes data of October 1990
File under Integrated Circuits, IC01
April 1993
INTEGRATED CIRCUITS
TDA1575T
FM front end circuit for
CENELEC EN 55020 applications
April 1993
2
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
FEATURES
Bipolar integrated FM front end circuit, designed for use
in car radios and home receivers
Fulfils CENELEC EN 55020 requirements
Radio frequency range of
76 to 90 MHz (Japan) or
87.5 to 108 MHz (Europe, USA)
Low noise oscillator, buffered oscillator output
Double balanced mixer
Internal buffered mixer driving
Linear IF amplifier, suitable for ceramic IF filters
Regulated reference voltage.
QUICK REFERENCE DATA
ORDERING INFORMATION
Note
1. SOT109-1; 1996 August 29.
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage
7
8.5
10
V
I
P
supply current, without mixer
-
23
-
mA
V
REF
reference voltage output
-
4.2
-
V
Z
I
mixer input impedance
-
14
-
NF
noise figure of mixer
-
9
-
dB
EMF1
3rd order intermodulation
-
115
-
dB
V
V
OSC
oscillator buffer output signal (RMS value)
75
-
-
mV
THD
total harmonic distortion
-
-
15
-
dBC
G
v
IF gain
-
30
-
dB
NF
IF noise figure
-
6.5
-
dB
Z
I
IF input impedance
-
300
-
Z
O
IF output impedance
-
300
-
EMF2
AGC wideband threshold (RMS value)
-
17
-
mV
EXTENDED
TYPE NUMBER
PACKAGE
PINS
PIN POSITION
MATERIAL
CODE
TDA1575T
16
mini-pack
plastic
SOT109A
(1)
April 1993
3
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
Fig.1 Block diagram and test circuit.
Coils TOKO
L1: MC-108 514 HNE-150023S14; L = 78 nH, N = 4 turns
L2: MC-111 E516 HNS-200057; L = 80 nH
L3: A119 ACS-17114 FTT
April 1993
4
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
PINNING
SYMBOL
PIN
DESCRIPTION
MIXI1
1
RF input 1 to mixer
MIXI2
2
RF input 2 to mixer
AGCI
3
HF input to automatic gain control
GND
4
ground (0 V)
V
REF
5
reference voltage output
OSCO
6
oscillator output
OSCI1
7
oscillator input 1
OSCI2
8
oscillator input 2
LO
9
buffered oscillator output
IFO
10
linear FM IF output
IFI1
11
FM IF input 1
IFI2
12
FM IF input 2
V
P
13
supply voltage (+8.5 V)
MIXO1
14
mixer output 1
MIXO2
15
mixer output 2
AGCO
16
automatic gain control output
Fig.2 Pin configuration.
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
Note to the limiting values
1. Equivalent to discharging a 100 pF capacitor through a 1.5 k
series resistor.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
P
supply voltage (pin 13)
0
12
V
V
14, 15
voltage at mixer output
0
V
P
V
P
tot
total power dissipation
0
380
mW
T
stg
storage temperature range
-
55
+150
C
T
amb
operating ambient temperature range
-
40
+85
C
V
ESD
electrostatic handling (see note 1)
all pins except 3 and 10
-
2000
V
pin 3
-
+2000
V
-
-
1000
V
pin 10
-
+1500
V
-
-
2000
V
April 1993
5
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
CHARACTERISTICS
V
P
= 8.5 V and T
amb
= +25
C, measurements taken in Fig.1 with f
0
= 98 MHz (EMF1) unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage (pin 13)
7
8.5
10
V
I
P
supply current
without mixer
16
23
30
mA
V
REF
reference voltage (pin 5)
I
5
3 mA
3.9
4.2
4.4
V
Mixer
I
14+15
mixer supply current (pins 14 and 15)
-
4
-
mA
V
1,2
DC voltage input (pins 1 and 2)
-
1
-
V
Z
1,2
input impedance
-
14
-
V
14,15
DC output voltage (pins 14 and 15)
4
-
10
V
C
14,15
output capacitance
-
13
-
pF
G
P
conversion power gain
note 1
-
14
-
dB
EMF1
IP3
3rd order intercept point
-
115
-
dB
V
NF
noise figure
-
9
-
dB
total noise figure
including
transforming network
-
11
-
dB
Oscillator
V
7,8
DC input voltage (pins 7 and 8)
-
1.3
-
V
V
6
DC output voltage (pin 6)
-
2.0
-
V
f
residual FM at pin 6
f = 300 to 15000 Hz;
de-emphasis 50
s
-
2.2
-
Hz
Oscillator buffered output (pin 9)
V
O
output signal (RMS value)
R
L
= 500
; C
L
= 2 pF
75
-
-
mV
V
9
DC output voltage
-
6
-
V
R
9
DC output resistor
-
950
-
THD
total harmonic distortion
-
-
15
-
dBC
f
S
spurious frequencies
EMF1 = 2 V;
R
S
= 50
;
f
OSC
= 108.7 MHz
-
-
37
-
dBC
Automatic gain control (AGC)
R
3
input resistance (pin 3)
-
4
-
k
C
3
input capacitance
-
3
-
pF
V
16
AGC output swing (DC)
Figs 3 and 4
0.5
-
V
P
-
0.3 V
I
16
output current at I
3
= 0
V
16
=
1
/
2
V
P
-
25
-
50
-
150
A
output current at U
3
= 2 V
V
16
= 7 to 10 V
2
-
5
mA
EMF2
threshold (RMS value)
I
16
= 0; V
16
=
1
/
2
V
P
;
Figs 4 and 5
-
17
-
mV
April 1993
6
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
Note
1. G
P
= 10 log (4V
o mix
10.7 MHz) / (EMF2
98 MHz)
2
(R
S1
/ R
ML
).
Linear IF amplifier
IF = 10.7 MHz
V
11,12
DC input voltage (pins 11 and 12)
-
1.25
-
V
Z
12-11
input impedance
240
300
360
C
12-11
input capacitance
-
13
-
pF
V
10
DC output voltage (pin 10)
-
4.4
-
V
Z
10
output impedance
240
300
360
C
10
output capacitance
-
3
-
pF
V
O
output signal (RMS value)
-
1 dB compression
-
-
650
mV
G
v
IF voltage gain (20 log (V
10
-
4
/ V
12
-
11
))
27
30
-
dB
G
v
IF voltage gain deviation
T
amb
=
-
40 to +85
C
-
0
-
dB
NF
noise figure
R
S
= 300
-
6.5
-
dB
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Fig.3
AGC output voltage V
16
as a function of
V
i3
RMS at I
16
= 0, measured in test circuit
Fig.1.
Fig.4
AGC output current I
16
as a function of
V
i3
RMS at V
16
= 8.5 V, measured in test
circuit Fig.1.
April 1993
7
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
APPLICATION INFORMATION
Operating characteristics
Measured in application circuit Fig.7, according to
"CENELEC EN 55020, Chapter 4.1 (passive interference
suppression)". Measurements are shown in Figs. 8 and 9.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
S
supply voltage
7
8.5
10
V
I
S
total supply current
-
37
-
mA
f
RF
tuning range of RF input
87.5
-
108
MHz
V
tune
tuning voltage of RF input
1
-
7
V
G
gain (20 log V
O IF
/ V
ant
)
-
43
-
dB
V
i ant
input sensitivity
S/N = 26 dB;
R
ant
= 150
-
2
-
V
IR
image rejection
f = 98 MHz
-
64
-
dB
RSS
repeat spot suppression
f = 98 MHz;
V
i ant
= 10
V
-
89
-
dB
DBS
double beat suppression
f1 = 93 MHz;
f2 = 98 MHz
DBS1
f
tune
= 88 MHz
-
81
-
dB
DBS2
f
tune
= 103 MHz
-
80
-
dB
DBS3
f
tune
= 90.15 MHz
-
85
-
dB
CBS
continuous beat suppression
f1 = 90 MHz;
f2 = 100.7 MHz
f
tune
= 95 MHz
-
90
-
dB
Fig.5 Set-up for CENELEC EN 55020 passive interference measurements.
SG1: Wanted carrier; modulated with f = 1 kHz,
f =
40 kHz (for audio reference)
SG2: Unwanted carrier; modulated with f = 1 kHz, FM:
f =
40 kHz (in band) or AM: m = 80% (out of band)
increase level of SG2 until S/N = 26 dB w.r.t. wanted modulation (for car radio, home radio S/N = 40 dB)
April 1993
8
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
Fig.6 PCB layout of FM front end unit.
April 1993
9
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
Fig.7 Application circuit of FM front end with TDA1575T and FET-preamplifier.
April 1993
10
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
Fig.8
Interference level as a function of detuning for S/N = 26 dB;
IN-BAND passive interference (CENELEC EN 55020).
Fig.9
Interference level as a function of detuning for S/N = 26 dB;
OUT-OF-BAND passive interference (CENELEC EN 55020).
April 1993
11
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
Fig.10 Internal circuits.
April 1993
12
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
PACKAGE OUTLINE
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT109-1
95-01-23
97-05-22
076E07S
MS-012AC
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.39
0.38
0.16
0.15
0.050
1.05
0.041
0.244
0.228
0.028
0.020
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
0
2.5
5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
April 1993
13
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
April 1993
14
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
April 1993
15
Philips Semiconductors
Preliminary specification
FM front end circuit for
CENELEC EN 55020 applications
TDA1575T
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1997
SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 So Paulo, SO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Printed in The Netherlands
547027/00/03/pp16
Date of release: April 1993
Document order number:
9397 750 02439
PDF 
ZIP