June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

FEATURES

Quasi-split sound processor for all standards e. g. B/G (FM sound) and L (AM sound)

Automatic muting of the AF2 signal (at B/G) by the input level

AM signal processing for L standard and switching over the audio signal

Layout-compatible with TDA3858 (32 pins) and TDA3857 (20 pins).

GENERAL DESCRIPTION

Separate symmetrical IF inputs for FM or AM sound.
Gain controlled wideband IF amplifier, input select switch. AGC generation due to peak sync for FM or mean signal level
for AM. Reference amplifier for the regeneration of the vision carrier. Optimized limiting amplifier for AM suppression in
the regenerated vision carrier signal and 90

phase shifter. Intercarrier mixer for FM sound, output with low-pass filter.

Separate signal processing for 5.5 and 5.74 MHz intercarriers. Wide supply voltage range, only 300 mW power
dissipation at 5 V.

QUICK REFERENCE DATA

ORDERING INFORMATION

Note

1. SOT234-1; 1996 November 28.

2. SOT137-1; 1996 November 28.

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

supply voltage (pin 21)

4.5

8.8

supply current

i IF

IF input sensitivity (

3 dB)

100

o(RMS)

audio output signal for FM (B/G)

o(RMS)

audio output signal for AM (L)

0.6

THD

total harmonic distortion

for FM

0.5

for AM

S/N (W)

weighted signal-to-noise ratio

for FM

for AM

EXTENDED

TYPE NUMBER

PACKAGE

PINS

PIN

POSITION

MATERIAL

CODE

TDA3856

shrink DIL

plastic

SOT234

(1)

TDA3856T

plastic

SOT137

(2)

June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

PINNING

SYMBOL

PIN

DESCRIPTION

AMIF1

AM IF difference input 1 for L standard (32.4 MHz)

AMIF2

AM IF difference input 2 for L standard (32.4 MHz)

AGC

charge capacitor for AGC (FM and AM)

charge capacitor for AM AGC

MODE

3-state input for standard select

FM2R1

reference circuit for FM2 (5.74 MHz)

FM2R2

reference circuit for FM2 (5.74 MHz)

AF2

AF2 output (AF out of 5.74 MHz)

AF1

AF1 output (AF out of 5.5 MHz or AM)

FM1R1

reference circuit for FM1 (5.5 MHz)

FM1R2

reference circuit for FM1 (5.5 MHz)

VC-R1

reference circuit for the vision carrier (38.9 MHz)

VC-R2

reference circuit for the vision carrier (38.9 MHz)

AFAM

DC decoupling capacitor for AM demodulator (AF-AM)

FM1|

intercarrier input for FM1 (5.5 MHz)

AF1

DC decoupling capacitor for FM1 demodulator (AF1)

ICO

intercarrier output signal (5.5/5.74 MHz)

AF2

DC decoupling capacitor for FM2 demodulator (AF2)

FM2I

intercarrier input for FM2 (5.74 MHz)

GND

ground (0 V)

+5 to +8 V supply voltage

REF

charge capacitor for reference voltage

FMIF1

IF difference input 1 for B/G standard (38.9 MHz)

FMIF2

IF difference input 2 for B/G standard (38.9 MHz)

Fig.2 Pin configuration.

June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

FUNCTIONAL DESCRIPTION

The quasi-split sound processor is suitable for all
standards.
Dependent on the voltage at pin 5 either FM mode (B/G)
or AM mode (L) is selected.

B/G standard (FM mode)

Pins 23 and 24 are active, AGC detector uses peak sync
level. Sound carrier SC1 (5.5 MHz) provides AF1, sound
carrier SC2 (5.74 MHz) provides AF2.

Muting

With no sound carrier SC2 at pin 19, AF2 output is muted
(in mid-position of the standard select switch FM mode
without muting of AF2 is selected).
The mute circuit prevents false signal recognition in the
stereo decoder at high IF signal levels when no second
sound carrier exists (mono) and an AF signal is present in
the identification signal frequency range.
With 1 mV at pin 19, under measurement conditions, AF2
is switched on (see limiting amplifier). Weak input signals
at pins 23 and 24 generate noise at pin 19, which is
present in the intercarrier signal and passes through the
5.74 MHz filter. Noise at pin 19 inhibits muting. No
misinterpretation due to white noise occurs in the stereo
decoder, when non-correlated noise masks the
identification signal frequencies, which may be present in
sustained tone signals. The stereo decoder remains
switched to mono.

L standard (AM mode)

Pins 1 and 2 are active, AGC detector uses mean signal
level. The audio signal from the AM demodulator is output
on AF1, with AF2 output muted.

Sound carrier notch filter for an improved intercarrier
buzz

The series capacitor C

in the 38.9 MHz resonant circuit

provides a notch at the sound carrier frequency in order to
provide more attenuation for the sound carrier in the vision
carrier reference channel. The ratio of parallel/series
capacitor depends on the ratio of VC/SC frequency and
has to be adapted to other TV transmission standards if
necessary, according to the formula C

= C

)

The result is an improved intercarrier buzz (up to 10 dB
improvement in sound channel 2 with 250 kHz video
modulation for B/G stereo) or suppression of 350 kHz
video modulated beat frequency in the digitally-modulated
NICAM subcarrier.

Intercarrier buzz fine tuning with 250 kHz square
wave video modulation

The picture carrier for quadrature demodulation in the
intercarrier mixer is not exactly 90 degrees due to the shift
variation in the integrated phase shift network. The tuning
of the LC reference circuit to provide optimal video
suppression at the intercarrier output is not the same as
that to provide optimal intercarrier buzz suppression. In
order to optimize the AF signal performance, a fine tuning
for the optimal S/N at the sound channel 2 (from 5.74 MHz)
may be performed with a 250 kHz square wave video
modulation.

Measurements at the demodulators

For all signal-to-noise measurements the generator must
meet the following specifications: phase modulation
errors

0.5

for B/W-jumps

intercarrier signal-to-noise ratio as measured with
`TV-demodulator AMF2' (weighted S/N) must be

60 dB

at 6 kHz sine wave modulation of the B/W-signal.
Signal-to-noise ratios are measured with

f =

50 kHz

deviation and f

mod

= 1 kHz; with a deviation of

30 kHz the

S/N ratio is deteriorated by 4.5 dB.

June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note to the Limiting Values

1. Equivalent to discharging a 200 pF capacitor through a 0

series resistor.

CHARACTERISTICS

= 5 V and T

amb

= +25

C; measurements taken in Fig.3 with f

= 38.9 MHz, f

SC1

= 33.4 MHz and

SC2

= 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100% (proportional to

10% residual carrier).
Vision carrier amplitude (RMS value) V

i VC

= 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and

VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation

f = 50 kHz, unless otherwise

specified.

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

supply voltage (pin 21)

8.8

voltage (pins 1, 2, 5, 8, 9, 15, 17, 19, 23 and 24)

tot

total power dissipation

650

stg

storage temperature

+150

amb

operating ambient temperature

+70

ESD

electrostatic handling (note 1)

all pins except pins 1, 2, 23 and 24

500

pins 1, 2, 23 and 24

400

500

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage (pin 21)

4.5

8.8

supply current (pin 21)

IF source control (pin 5)

input voltage in order to obtain standards

B/G (FM) with automatic muting

pin 5 connected

2.8

pin 5 open-circuit

2.8

B/G (FM) without muting

pin 5 connected or
alternative measure:
22 k

to GND

1.3

2.3

L (AM sound)

pin 5 connected

0.8

input current

= V

100

= 0 V

300

IF input not activated (pins 1-2 or 23-24)

input resistance

100

DC input voltage (pins 1, 2 or 23, 24)

LOW set internally

0.1

12-13

crosstalk attenuation of IF input switch

note 1

IF amplifier (pins 1-2 or 23-24)

input resistance

1.8

2.2

input capacitance

2.0

2.6

June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

DC potential, voltage (pins 1, 2, 23, 24)

1.75

i IF (RMS)

maximum input signal (RMS value)

= +1 dB

100

input signal sensitivity B/G standard
(RMS value, pins 32-24)

3 dB intercarrier signal

reduction at pin 17

100

input signal sensitivity L standard
(RMS value, pins 1-2)

3 dB intercarrier signal

reduction at pin 9

100

voltage for gain control (pin 3)

1.7

2.6

IF gain control

IF bandwidth

3 dB

MHz

Resonance amplifier (pins 12-13)

o (p-p)

vision carrier amplitude
(peak-to-peak value)

= 38.9 MHz

270

12-13

operating resistance

inductance

Figs 3 and 5

0.247

capacitance

Q-factor of resonant circuit

= 90

12, 13

DC voltage (pins 12 and 13)

Intercarrier mixer output (pin 17)

o (RMS)

output signal for 5.5 MHz (RMS value)

125

output signal for 5.74 MHz (RMS value)

IF bandwidth

1 dB

8.5

MHz

3 dB

MHz

VID

residual video AM on intercarrier

note 2

VC(RMS

)

residual vision carrier (RMS value)

1st/2nd harmonic
(38.9/77.8 MHz)

0.5

output resistance (emitter follower)

1 mA emitter current

allowable AC output current (pin 17)

0.7

allowable DC output current

DC voltage

LC-circuit at pin 12, 13
adjusted to minimum
video content at pin 17

1.5

1.75

2.0

Limiting amplifiers (pins 15 and 19)

i (RMS)

minimum input signal (RMS value)

3 dB AF signal

300

450

maximum input signal (RMS value)

200

15, 19

input resistance

450

560

700

15, 19

DC voltage

i (RMS)

level detector threshold for no muting
(RMS value, pin 19)

only 5.74 MHz channel

0.8

1.2

1.7

hysteresis of level detector

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

FM1 and FM2 demodulators

Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with V

i IF (RMS)

= 10 mV (f

mod

= 1 kHz, deviation

f =

50 kHz) at pins 15 and 19 without ceramic filters, R

= 50

De-emphasis 50

s and V

= V

(B/G standard).

-factor = 11 for resonant circuits at pins 6-7 and 10-11 (including IC).

IC (RMS)

intercarrier signals
(RMS values, pins 6-7 and 10-11)

100

DC voltage (pins 6, 7, 10 and 11)

1.8

o(RMS)

AF output signals
(RMS values, pins 8 and 9)

0.84

0.95

1.07

difference of AF signals between
channels (pins 8 and 9)

8, 9

output resistance

100

130

8, 9

DC voltage

1.8

2.1

2.4

8, 9(M)

allowed AC current of emitter output
(peak value)

note 3

1.5

8, 9

maximum allowed DC output current

THD

total harmonic distortion

0.5

1.0

o(RMS)

AF output signal (RMS value)

THD = 1.5%

1.25

AM suppression

1 kHz; m = 0.3

S/N(W)

weighted signal-to-noise ratio

CCIR468-3

AF bandwidth (

3 dB)

lower limit

upper limit

100

kHz

crosstalk attenuation (pins 9-8)

16, 18

DC voltage (pins 16 and 18)

1.8

AM demodulator V

= 0 V (AM mode)

input signals at pins 1-2: SC = 32.4 MHz; f

mod

= 1 kHz; m = 0.8; V

i AM (RMS)

= 10 mV

o (RMS)

AF output signal at pin 9 (RMS value)

530

600

675

output resistance (pin 9)

100

130

o (M)

maximum AC output current (peak value)

note 3

1.5

maximum DC output current

DC voltage

1.8

2.1

2.4

THD

total harmonic distortion

Fig.4

S/N(W)

weighted signal-to-noise ratio

CCIR468-3

AF bandwidth (

3 dB)

lower limit

upper limit

100

kHz

DC voltage (pin 14)

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

Notes to the characteristics

Crosstalk attenuation of IF input switch, measured at R

12-13

= 470

(instead of LC circuit);

input signal V

i (RMS)

= 20 mV (pins 23-24). AGC voltage V

set to a value to achieve V

o (RMS)

= 20 mV (pins 12-13).

After switching (V

= 0 V) measure attenuation.

IF coupling with OFWG3203 and OFWL9350 (Siemens).

2. Spurious intercarrier AM: m = (A

B)/A

(A = signal at sync; B = signal with 100% picture modulation).

3. For larger current: R

2.2 k

(pin 8 or 9 to GND) in order to increase the bias current of the output emitter follower.

AF signal switches

input signals: AM carrier into pin 1, 2

see part AM demodulator

FM intercarrier into pin 15

see part FM demodulator

no signal in pin 19 (AF2)

the output signals are related to the signals described in the demodulator parts.

omute

AF2 mute attenuation (pin 8)

B/G mode; V

= V

oAM

oFM

AF1 FM signal (pin 9) attenuation of
unwanted FM signal

L mode; V

= 0;

FM: modulated;
AM: unmodulated

oFM

oAM

AF1 AM signal (pin 9) attenuation of
unwanted AM signal

B/G mode; V

= V

FM: unmodulated;
AM: modulated

8, 9

DC jump at the AF outputs

switching to FM or AM
sound or Mute

AF performance for FM operation (standard B/G)

input signals: B/G IF input signal (pin 23, 24)

unmodulated sound carriers

different video modulation (100%)

the output signals are related to the signals described in the demodulator parts.

(S+N)/N(W) weighted signal-to-noise ratio

CCIR468-3;
de-emphasis 50

black picture

= 5.5 MHz

2T/20T pulses with white bar

= 5.5 MHz

6 kHz sine wave, B/W-modulated

= 5.5 MHz

250 kHz square wave, B/W-modulated

= 5.5 MHz

black picture

= 5.742 MHz

2T/20T pulses with white bar

= 5.742 MHz

6 kHz sine wave, B/W-modulated

= 5.742 MHz

250 kHz square wave, B/W-modulated

= 5.742 MHz

Ripple rejection of the AF outputs (B/G and L standard)

ripple rejection
V

ripple

on V

/ V

ripple

on V

out

R(p-p)

= 200 mV;

= 70 Hz

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

PACKAGE OUTLINES

UNIT

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

DIMENSIONS (mm are the original dimensions)

SOT234-1

92-11-17
95-02-04

max.

1.3
0.8

0.53
0.40

0.32
0.23

22.3
21.4

9.1
8.7

3.2
2.8

0.18

1.778

10.16

10.7
10.2

12.2
10.5

1.6

4.7

0.51

3.8

(e )

seating plane

pin 1 index

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1)

max.

min.

max.

SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)

SOT234-1

June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

2.65

0.30
0.10

2.45
2.25

0.49
0.36

0.32
0.23

15.6
15.2

7.6
7.4

1.27

10.65
10.00

1.1
1.0

0.9
0.4

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1
0.4

SOT137-1

detail X

(A )

0.25

075E05

MS-013AD

pin 1 index

0.10

0.012
0.004

0.096
0.089

0.019
0.014

0.013
0.009

0.61
0.60

0.30
0.29

0.050

1.4

0.055

0.419
0.394

0.043
0.039

0.035
0.016

0.01

0.25

0.01

0.004

0.043
0.016

0.01

10 mm

scale

SO24: plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

95-01-24
97-05-22

June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

SDIP

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300

C it may remain in

contact for up to 10 seconds. If the bit temperature is
between 300 and 400

C, contact may be up to 5 seconds.

EFLOW SOLDERING

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

The longitudinal axis of the package footprint must be
parallel to the solder flow.

The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

June 1994

Philips Semiconductors

Product specification

Quasi-split sound processor for all standards

TDA3856

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

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