Document Outline
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- PACKAGE OUTLINE
- RATINGS
- THERMAL RESISTANCE
- CHARACTERISTICS
- APPLICATION INFORMATION
- PACKAGE OUTLINE
- SOLDERING
- DEFINITIONS
- LIFE SUPPORT APPLICATIONS
DATA SHEET
Preliminary specification
File under Integrated Circuits, IC02
March 1991
INTEGRATED CIRCUITS
TDA4566
Colour transient improvement
circuit
March 1991
2
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
GENERAL DESCRIPTION
The TDA4566 is a monolithic integrated circuit for colour-transient improvement (CTI) and luminance delay line in gyrator
technique in colour television receivers.
Features
Colour transient improvement for colour difference signals (R-Y) and (B-Y) with transient detecting-, storage- and
switching stages resulting in high transients of colour difference output signals
A luminance signal path (Y) which substitutes the conventional Y-delay coil with an integrated Y-delay line
Switchable delay time from 550 ns to 820 ns in steps of 90 ns and additional fine adjustment of 37 ns
Two Y output signals; one of 180 ns less delay
QUICK REFERENCE DATA
Note
1. Delay time is proportional to resistor R
14-18
.
R
14-18
also influences the bandwidth; a value of 1.2 k
results in a bandwidth of 5 MHz (typ.).
PACKAGE OUTLINE
18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 27.
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage (pin 10)
V
P
10.8
12
13.2
V
Supply current (pin 10)
I
P
-
35
50
mA
Y-signal delay at pin 12
S1 open;
R
14-18
= 1.2 k
;
note 1
V
15-18
= 0 to 2.5 V
t
17-12
490
550
610
ns
V
15-18
= 3.5 to 5.5 V
t
17-12
580
640
700
ns
V
15-18
= 6.5 to 8.5 V
t
17-12
670
730
790
ns
V
15-18
= 9.5 to12 V
t
17-12
760
820
880
ns
Y-signal amplification
0.5 MHz
Y
0
1
2
dB
(R-Y) and (B-Y) signal
attenuation
cd
-
1
0
+
1
dB
output transient time
t
tr
-
100
200
ns
March 1991
3
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
Fig.1 Block diagram.
March 1991
4
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
Fig.2 Internal pin circuit diagram.
March 1991
5
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
THERMAL RESISTANCE
Note
1. Pins 3, 4, 5, 6, 9, 13 and 14 DC potential not published.
PARAMETER
SYMBOL
MIN.
MAX.
UNIT
Supply voltage range (pin 10)
V
P
= V
10-18
0
13.2
V
Voltage ranges to pin 18 (ground)
at pins 1, 2, 12 and 15
V
n-18
0
V
P
V
at pin 11
V
11-18
0
(V
P
-
3 V)
V
at pin 17
V
17-18
0
7
V
Voltage ranges
at pin 7 to pin 6
V
7-6
0
5
V
at pin 8 to pin 9
V
8-9
0
5
V
Currents
at pins 6, 9
I
6, 9
-
10
+
10
mA
at pins 7, 8, 11 and 12
I
7, 8, 11, 12
internally limited
Total power dissipation
(T
j
= 150
C; T
amb
= 70
C
P
tot
-
1.1
W
Storage temperature range
T
stg
-
25
+
150
C
Operating ambient temperature range
T
amb
0
+
70
C
From junction to ambient (in free air)
R
th j
-
a
= 70
K/W
March 1991
6
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
CHARACTERISTICS
V
P
= V
10-18
= 12 V; T
amb
= 25
C; measured in application circuit Fig.3; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply (pin 10)
Supply voltage
V
P
10.8
12
13.2
V
Supply current
I
P
-
35
50
mA
Colour difference paths
(R-Y) input voltage
(75% colour bar signal)
(peak-to-peak value)
V
1(p-p)
-
0.63
1.5
V
(B-Y) input voltage
(75% colour bar signal)
(peak-to-peak value)
V
2(p-p)
-
0.8
1.9
V
Input resistance
(R-Y)
R
1-18
8
12
16
k
(B-Y)
R
2-18
8
12
16
k
Internal bias voltage
(R-Y)
V
1-18
3.8
4.3
4.8
V
(B-Y)
V
1-18
3.8
4.3
4.8
V
Signal attenuation
(R-Y)
V
8
/ V
1
-
1
0
+
1
dB
(B-Y)
V
7
/ V
2
-
1
0
+
1
dB
Output transient time
note 1
t
tr
-
100
200
ns
Output resistance
(B-Y)
R
7-18
-
100
-
(R-Y)
R
8-18
-
100
-
DC output voltage
(B-Y)
V
7-18
3.8
4.3
4.8
V
(R-Y)
V
8-18
3.8
4.3
4.8
V
Output current
note 2
source
I
7, 8
0.4
-
-
mA
sink
-
I
7, 8
1.0
-
-
mA
March 1991
7
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
Y-signal path
Y-input voltage
(composite signal)
capacitive
(peak-to-peak value)
coupling
V
17(p-p)
-
0.45
0.62
V
Internal bias voltage
during clamping
V
17-18
2.1
2.4
2.7
V
Input current
during picture content
I
17
-
8
12
A
during sync. pulse
-
I
17
-
100
150
A
Y-signal delay at pin 12
S1 open;
R
14
= 1.2 k
;
notes 3 and 4
at V
15
-
18
= 0 to 2.5 V
t
17-18
490
550
610
ns
at V
15-18
= 3.5 to 5.5 V
t
17-18
580
640
700
ns
at V
15
-
18
= 6.5 to 8.5 V
t
17-18
670
730
790
ns
at V
15-18
= 9.5 to12 V
t
17-18
760
820
880
ns
Fine adjustment of Y-signal
delay for all 4 steps
S1 closed
t
17-12
-
37
-
ns
Signal delay between pin 11
and pin 12
S1 open
t
11-12
160
180
200
ns
Dependency of delay time
on temperature
-
0.001
-
K
-
1
on supply voltage
-
-
0.03
-
V
-
1
Input switching current
-
I
15
-
15
25
A
Y-signal attenuation
f = 0.5 MHz
pin 11 from pin 17
V
11
/V
17
-
1
0
+
1
dB
pin 12 from pin 17
V
12
/V
17
0
+
1
+
2
dB
Frequency response at
3 MHz referred to 0.5 MHz
note 5
pin 11
0
-
3.0
dB
pin 12
0
-
3.0
dB
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
t
17
12
t
17
12
T
j
------------------------------
t
17
12
t
17
12
V
-----------------------------
P
V
11
(3 MHz)
V
11
(0.5 MHz)
-------------------------------------
V
12
(3 MHz)
V
12
(0.5 MHz)
-------------------------------------
March 1991
8
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
Notes
1. Output signal transient time measured with C
6-18
= C
9-18
= 220 pF without resistor (see Fig. 3).
2. Output current measured with emitter follower with constant current source of 0.6 mA.
3. R
14-18
influences the bandwidth; a value of 1.2 k
results in a bandwidth of 5 MHz (typ.).
4. Delay time is proportional to resistor R
14-18
. Devices with suffix "A" require the value of the resistor to be 1.15 k
;
a 27 k
; resistor connected in parallel with R
14-18
= 1.2 k
.;
5. Frequency response measured with V
15-18
= 9.5 V and switch S1 open.
Frequency response at
5 MHz referred to 0.5 MHz
note 5
pin 11
-
3.0
-
2.0
dB
pin 12
-
3.0
-
2.0
dB
DC output voltage
pin 11
V
11-18
1.8
2.3
2.6
V
pin 12
V
12-18
9.8
10.3
10.8
V
Output current
note 2
source
I
11, 12
-
-
0.4
mA
sink
-
I
11, 12
-
-
1.0
mA
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
V
11
(5 MHz)
V
11
(0.5 MHz)
-------------------------------------
V
12
(5 MHz)
V
12
(0.5 MHz)
-------------------------------------
March 1991
9
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
APPLICATION INFORMATION
Table 1
Switching sequence for delay times.
Notes
1. When switch (S1) is closed the delay time is increased by 37 ns.
2. Where: X = connection closed; 0 = connection open.
CONNECTION
(2)
VOLTAGE AT PIN 15
DELAY TIME (ns)
(1)
(a)
(b)
(c)
0
0
0
0 to 2.5 V
550
0
0
X
3.5 to 5.5 V
640
0
X
X
6.5 to 8.5 V
730
X
X
X
9.5 to 12 V
820
Fig.3 Application diagram and test circuit.
(1) Residual carrier reduced to 20 mV peak-to-peak (R = 1 k
, C = 100 pF).
(2) Switching sequence for delay times shown in Table 1.
(3) R
14
-
18
= 1.2 k
for TDA4566.
R
14
-
18
= 1.15 k
for TDA4566A (27 k
resistor connected in parallel to 1.2 k
).
March 1991
10
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT102-1
93-10-14
95-01-23
UNIT
A
max.
1
2
b
1
(1)
(1)
(1)
b
2
c
D
E
e
M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
0.254
2.54
7.62
8.25
7.80
9.5
8.3
0.85
4.7
0.51
3.7
inches
0.055
0.044
0.021
0.015
0.013
0.009
1.40
1.14
0.055
0.044
0.86
0.84
0.26
0.24
0.15
0.13
0.01
0.10
0.30
0.32
0.31
0.37
0.33
0.033
0.19
0.020
0.15
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
b
2
e
D
A
2
Z
18
1
10
9
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
March 1991
11
Philips Semiconductors
Preliminary specification
Colour transient improvement circuit
TDA4566
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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