DATA SHEET
Product specification
Supersedes data of February 1992
File under Integrated Circuits, IC02
1997 Mar 27
INTEGRATED CIRCUITS
TDA4800
Vertical deflection circuit for monitor
applications
1997 Mar 27
2
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
FEATURES
Fully integrated, few external components
RC oscillator with wide sync range of 1 : 3 (e.g.
50 to 150 Hz)
Synchronization by positive or negative going sync
pulse
Blanking pulse duration is determined externally
Dual frequency criterion for automatic amplitude
switch-over (e.g. 50 to 60 Hz)
Guard circuit for screen protection
Sawtooth generator with buffer stage supplied by
external voltage
Preamplifier
Power output stage with thermal and SOAR protection
Flyback generator
Internal voltage stabilizer.
GENERAL DESCRIPTION
The TDA4800 is an integrated circuit for vertical deflection
primarily in monitors (and TV receivers). The complete
circuit consists of 11 main functional blocks as shown in
Fig.1.
QUICK REFERENCE DATA
Notes
1. Measured in Fig.4.
2. f
o
= 45 Hz (f
sync(max)
= 3f
o
).
3. P
tot
= 3.6 W for R
th(j-a)
= 20 K/W.
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P1
supply voltage (pin 6)
10
-
30
V
V
P2
supply voltage (pin 10)
10
-
45
V
I
P
supply current (pins 6 and 10)
note 1
-
215
-
mA
I
7(p-p)
output current (peak-to-peak value)
-
-
2.6
A
f
sync
picture frequency
notes 1 and 2
-
-
135
Hz
V
3
positive sync input pulse
1.0
-
6.0
V
V
3
negative sync input pulse
-
0.5
-
-
0.7
V
T
amb
operating ambient temperature
note 3
-
20
-
+70
C
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA4800
DBS13P
plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
1997 Mar 27
3
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MHA590
R3
P1
R10
C11
C10
R15
R14
P2
R9
R16
6.5
mH
D2
BAX18
D1
1N4148
C7
Vamplitude
VP2 = 23 V
C4
C8
C9
frequency
criterion
C5
C12
linearity
vertical
deflection
unit
R4
6.5
R6
R5
R2
R17
R1
(frequency)
R8
R7
R11
4
3
2
5
6
7
9
8
10
11
12
13
R12
R13
C6
C2
C1
amplitude
1
blank
output
sync input
or
OSCILLATOR
RAMP
GENERATOR
BUFFER
STAGE
+
2 V
PRE-
AMPLIFIER
POWER
OUTPUT STAGE
FLYBACK
GENERATOR
THERMAL AND
SOAR PROTECTION
SYNC
CIRCUIT
FREQUENCY
DETECTOR
VOLTAGE
STABILIZER
BLANKING
PULSE
GENERATOR
TDA4800
GUARD
CIRCUIT
1997 Mar 27
4
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
PINNING
SYMBOL PIN
DESCRIPTION
OSC
R
1
oscillator resistor
OSC
C
2
oscillator capacitor
SYB
O
3
sync input; blanking pulse output
S
OUT
4
sawtooth output
PRE
I
5
preamplifier input
V
P1
6
supply voltage 1
OUTP
7
deflection output
GND
8
ground
C
FLY
9
pin for the flyback generator capacitor
V
P2
10
supply voltage 2
S
GEN
11
sawtooth generator
BP
DU
12
blanking pulse duration
FRQ
C
13
frequency criterion
handbook, halfpage
TDA4800
MHA584
1
2
3
4
5
6
7
8
9
10
11
12
13
OSCR
OSCC
SYBO
SOUT
PREI
VP1
CFLY
VP2
SGEN
BPDU
FRQC
OUTP
GND
Fig.2 Pin configuration.
1997 Mar 27
5
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
FUNCTIONAL DESCRIPTION
The complete circuit consists of the following functional
blocks as shown in Fig.1:
1. Oscillator
2. Synchronization circuit
3. Blanking pulse generator
4. Frequency detector and storage
5. Ramp generator
6. Buffer stage
7. Preamplifier
8. Power output stage
9. Flyback generator
10. Guard circuit
11. Voltage stabilizer.
Oscillator (pins 1 and 2)
The oscillator is an RC-oscillator with a threshold value
switch, which ensures very good frequency stability.
The upper and lower threshold voltages are defined by an
internal voltage divider.
An external capacitor C1 at pin 2 is charged by a constant
current source. When the scan voltage of C1 reaches the
upper threshold voltage, oscillator flyback starts. Capacitor
C1 discharges via an internal resistor and transistor until
the lower threshold is reached.
The constant charge current and free-running frequency f
o
are adjusted by an external resistor R1 at pin 1:
with K = 0.68.
Synchronization circuit (pin 3)
A positive- or negative-going pulse fed to pin 3
synchronizes the oscillator by lowering the upper threshold
voltage. The synchronizing range is f
o
to 3f
o
. For example:
f
o
= 50 Hz
f
sync(max)
= 150 Hz.
Blanking pulse generator (pin 3)
Also at pin 3 a blanking pulse is available. Diode D1
separates the synchronization pulse from the blanking
pulse. During scanning, the external capacitor C6 at pin 12
is charged to an internal stabilized voltage V
stab2
.
The blanking pulse starts with the beginning of oscillator
flyback; then capacitor C6 discharges via the external
resistor R13 at pin 12. The blanking pulse stops when the
capacitor voltage is
1
/
2
V
stab2
.
f
o
1
K
R1
C1
--------------------------------
=
The blanking pulse duration is determined by the values of
external components R13 and C6 at pin 12:
t
bl
= R13
C6
Ln2.
Frequency detector with storage (pin 13)
At the end of the scanning period a frequency detector
detects the oscillator frequency (see "Note" below).
When this frequency is above the threshold a flip-flop is set
to store this information. The output is an open collector
output.
N
OTE
Frequency detector change-over at pin 13 from low (= low
frequency) to high (= high frequency) is determined by f
o
:
f
threshold
= 1.23
f
o
.
Ramp generator (pin 11)
The ramp generator consists of two external series
capacitors C4 and C5, external charge resistor R12
(connected to pin 11), and an internal differential amplifier
which is synchronously switched by the oscillator.
External capacitors C4 and C5 at pin 11 are charged by
the charging current via the external charge resistor R12
until oscillator flyback starts. C4 and C5 are then
discharged via pin 11 by an internal resistor and transistor.
This generates a positive-going ramp voltage.
Buffer stage (pin 4)
The buffer stage consists of two emitter followers.
The ramp voltage is fed via the buffer stage and is
available at pin 4 with a low ohmic output impedance. With
R4 and P1 it generates a ramp function, which, together
with the feedback network of the deflection yoke, gives a
high degree of linearity at the picture tube. The linearity
can be adjusted by P1.
Preamplifier (pin 5)
The preamplifier is a differential amplifier.
The non-inverting input is fixed at about 2 V by an internal
voltage divider. The inverting input at pin 5 is connected to
the ramp voltage via R3 and feedback network P2,
R5 to R11, R15, R16, C7, C10 and C11.
Power output stage (pin 7)
The power output stage is an amplifier with a
quasi-complementary class-B output. The output is
connected to pin 7.
The power stage includes SOAR and thermal protection.
1997 Mar 27
6
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
Flyback generator (pin 9)
The flyback generator has an external capacitor C8 at
pin 9. During scanning, the internal circuit switches pin 9
almost to ground; thereby C8 is charged by the supply
voltage via external components R14 and D2.
During the flyback time pin 9 is switched almost to the
supply voltage, so that the supply voltage for the power
output stage (pin 6) is nearly doubled. This high flyback
voltage ensures a very short flyback time.
Guard circuit (pin 3)
When the vertical deflection current is absent (e.g.
short-circuited, or open-circuited of the yoke) the guard
circuit changes the blanking pulse at pin 3 into a DC signal
which blanks the beam current to protect the screen.
Also an oscillator defect (C1 short-circuited or
R1 disconnected from pin 1) switches on the guard circuit.
Voltage stabilizer
The voltage stabilizer circuit provides a stable operating
voltage of about 7.5 V for several internal circuits of the
TDA4800.
INTERNAL CIRCUITRY
Fig.3 Internal circuitry.
handbook, full pagewidth
MHA588
7
8
9
6
5
4
3
2
1
10
Vstab
11
12
13
TDA4800
1997 Mar 27
7
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1. I
6
, I
7
and I
8
are limited by SOAR protection circuit that ensures that short-circuiting between the output pin 7 and
supply voltage or ground does not destroy the output stage. A short-circuit may be soldered into the printed-circuit
board or may sometimes (non-periodically) occur in the applied circuit.
2. The maximum value for the operating ambient temperature range and the power dissipation depends on the
heatsink.
3. Internally limited by thermal protection: switching temperature point at T
j
= 150
8
C.
4. Human body model: 1.5 k
, 100 pF, 5 pulses.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
2
voltages
0
6
V
V
11
0
24
V
V
12
0
6
V
V
13
0
50
V
V
10
supply voltages (V
P
)
0
50
V
V
9
0
50
V
V
7
0
60
V
V
6
0
60
V
V
5
0
6
V
V
4
0
24
V
V
3
-
0.7
+6
V
I
1
currents
0
-
1
mA
I
3
+3
-
10
mA
I
4
0
-
5
mA
I
6
, I
7
, I
8
note 1
I
9
-
1.5
+1.5
A
I
11
-
0.1
+30
mA
T
stg
storage temperature
-
25
+150
C
T
amb
operating ambient temperature
note 2
-
20
+70
C
T
j
junction temperature
note 3
-
150
C
P
tot
total power dissipation
note 2
-
-
W
V
ESD
ESD sensitivity
note 4
-
2000
+
2000
V
SYMBOL
PARAMETER
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
20
K/W
R
th(j-mb)
thermal resistance from junction to mounting base
5
K/W
1997 Mar 27
8
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
CHARACTERISTICS
All voltages are measured to GND (ground; pin 8); T
amb
= 25
C; V
P
= 23 V; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P1
supply voltage (pin 6)
10
-
30
V
V
P2
supply voltage (pin 10)
10
-
45
V
I
10
supply current
V
10
= 25 V; V
5
= 3 V
without load
-
12
-
mA
I
6
supply current
V
6
= 25 V; V
5
= 1 V
without load
-
20
-
mA
I
6
supply current
V
6
= 25 V; V
5
= 3 V
without load
-
5
-
mA
V
7(min)
minimum output voltage
I
7
= 1 A
-
1.4
1.65
V
V
7(max)
maximum output voltage
I
7
=
-
1 A
V
6
-
2.3 V
6
-
2.0
-
V
V
9
output voltage during flyback
I
9
=
-
1 A
-
V
10
-
2.2
-
V
I
7
output current
-
-
1.3
A
I
9
output current
-
-
1.3
A
I
5
preamplifier input current
-
-
0.1
-
A
V
1
stabilized voltage
6.1
6.8
7.3
V
V
3
blanking pulse output voltage
-
5.7
-
V
R
3
blanking pulse output resistance
-
300
-
I
3
blanking pulse output current
0
-
-
3
mA
t
bl
blanking pulse duration
R = 100 k
;
C = 10 nF (pin 12)
640
680
730
s
V
11
output voltage ramp generator
0.3
-
20
V
I
11
output current ramp generator
-
2
-
15
10
3
A
V
13
output voltage frequency detector
lower frequency
I
13
= 1 mA
-
-
1.0
V
I
13
leakage current frequency detector higher frequency
V
13
= 50 V
-
-
1.0
A
V
4
output voltage buffer stage
0
-
20
V
I
4
output current buffer stage
-
-
-
4.0
mA
V
3
synchronizing input voltage
positive sync
1.0
-
6.0
V
V
3
synchronizing input voltage
negative sync
-
0.5
-
-
0.7
V
tolerance of free running oscillator
without sync
-
3.0
-
+3.0
%
oscillator temperature dependency T
mb
= 20 to 100
C
-
10
-
4
-
K
-
1
oscillator voltage dependency
V
P
= 10 to 30 V
-
4
10
-
4
-
K
-
1
synchronizing ratio
1 : 2.9
1 : 3
-
f
f
-----
1
T
mb
--------------
f
f
-----
1
V
P
----------
f
o
f
sync
------------
1997 Mar 27
9
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
TEST AND APPLICATION INFORMATION
Fig.4 Test and application circuit.
handbook, full pagewidth
MHA589
47 k
100 k
560
(0.5 W)
2200
F
10
F
5.6
3.3
(4 W)
100
120
0.82
(0.5 W)
6.5
mH
BAX18
1N4148
100
nF
Vamplitude
VP2 = 23 V
100
nF
100
F
100
F
frequency
criterion
50 Hz: low
60 Hz: high
blank pulse
duration:
tbl = R
C
Ln2
100
nF
100 nF
linearity
vertical
deflection
unit
47 k
15 k
6.5
10 k
15 k
100
k
330 k
(frequency)
2.2 k
4.7 k
1.5 k
4
3
2
5
6
7
9
8
10
11
12
13
562 k
180
k
(R)
10
nF
(C)
47 nF
100 nF
amplitude
1
blank
output
sync input
or
OSCILLATOR
RAMP
GENERATOR
BUFFER
STAGE
+
2 V
PRE-
AMPLIFIER
POWER
OUTPUT STAGE
FLYBACK
GENERATOR
THERMAL AND
SOAR PROTECTION
SYNC
CIRCUIT
FREQUENCY
DETECTOR
VOLTAGE
STABILIZER
BLANKING
PULSE
GENERATOR
TDA4800
GUARD
CIRCUIT
1997 Mar 27
10
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
TDA4800 in the test and application circuit (see Fig.4)
SYMBOL
PARAMETER
CONDITIONS
TYP.
UNIT
V
P2
supply voltage
23
V
I
P
supply current
215
mA
V
7
DC output voltage
11.8
V
V
7M
peak output voltage
45
V
I
7
output current
0.8
A
I
Y(p-p)
vertical deflection current (peak-to-peak value)
1.5
A
t
fb
flyback time
0.3
ms
t
bl
blanking pulse duration
1.25
ms
P
tot
total power dissipation
3.3
W
f
o
free running oscillator frequency
without sync
45
Hz
1997 Mar 27
11
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
PACKAGE OUTLINE
UNIT
A
e
1
A
2
b
p
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
L
3
m
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
3.4
v
0.8
12.2
11.8
1.7
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0
5
10 mm
scale
Q
j
0.25
w
0.03
x
D
L
E
A
c
A
2
m
L
3
Q
w
M
b
p
1
d
D
Z
e
2
e
e
x
h
1
13
j
Eh
non-concave
view B: mounting base side
92-11-17
95-03-11
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
v
M
B
1997 Mar 27
12
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
MOUNTING INSTRUCTIONS FOR
13-LEAD DBS13P POWER
PACKAGE
The rise in temperature caused by
power dissipation in the circuit is
reduced by adding a heatsink with a
sufficiently low thermal resistance:
R
th(mb-h)
+ R
th(h-a)
= R
th(mb-a)
(e.g. the heatsink of Fig.5). It is
possible to attach the package to the
heatsink by screws (Fig.6) or by a
compression spring (Fig.7). A layer of
silicon grease between the heatsink
and the mounting base optimizes
thermal contact.
MHA585
18.5
10.5
86
27
27
3.5
3.5
50
1.5
M2.5
(2x)
5
22.5
63.5
10
Fig.5 Heatsink made of black-leaded Aluminium.
Dimensions in mm.
page
MHA586
,,
,,
,,
,,
,,
,,
,,
,,
,,
heatsink
PC board
Fig.6
Package and heatsink
attached by screws.
handbook, halfpage
MHA587
6
4.5
8.5
12
0.4
27
22
30
Fig.7
Compression spring for easily attaching the package to the
heatsink of Fig.5.
Dimensions in mm.
1997 Mar 27
13
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1997 Mar 27
14
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
NOTES
1997 Mar 27
15
Philips Semiconductors
Product specification
Vertical deflection circuit for monitor
applications
TDA4800
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1997
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 So Paulo, SO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2870, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Printed in The Netherlands
547047/1200/02/pp16
Date of release: 1997 Mar 27
Document order number:
9397 750 01396
PDF 
ZIP