Document Outline
- FEATURES
- GENERAL DESCRIPTION
- ORDERING INFORMATION
- BLOCK DIAGRAM
- PINNING
- LIMITING VALUES
- HANDLING
- QUALITY SPECIFICATION
- THERMAL CHARACTERISTICS
- CHARACTERISTICS
- TEST AND APPLICATION INFORMATION
- INTERNAL CIRCUITRY
- PACKAGE OUTLINE
- SOLDERING
- DATA SHEET STATUS
- DEFINITIONS
- DISCLAIMERS
DATA SHEET
Product specification
2002 Oct 18
INTEGRATED CIRCUITS
TDA6107JF
Triple video output amplifier
2002 Oct 18
2
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
FEATURES
Typical bandwidth of 5.5 MHz for an output signal of
60 V (p-p)
High slew rate of 900 V/
s
No external components required
Very simple application
Single supply voltage of 200 V
Internal reference voltage of 2.5 V
Fixed gain of 50
Black-Current Stabilization (BCS) circuit with voltage
window from 1.8 to 6 V and current window from
-
100
A to 10 mA
Thermal protection
Internal protection against positive flashover discharges
appearing on the CRT.
GENERAL DESCRIPTION
The TDA6107JF includes three video output amplifiers
and is intended to drive the three cathodes of a colour CRT
directly. The device is contained in a plastic DIL-bent-SIL
9-pin medium power (DBS9MPF) package, and uses
high-voltage DMOS technology.
To obtain maximum performance, the amplifier should be
used with black-current control.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA6107JF
DBS9MPF
plastic DIL-bent-SIL medium power package with fin; 9 leads
SOT111-1
2002 Oct 18
3
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
BLOCK DIAGRAM
handbook, full pagewidth
MBL525
TDA6107JF
VDD
6
1, 2, 3
4
9, 8, 7
Voc(3),
Voc(2),
Voc(1)
5
Io(m)
Rf
MIRROR 5
DIFFERENTIAL
STAGE
VIP
REFERENCE
CURRENT
SOURCE
Ri
Vi(1),
Vi(2),
Vi(3)
Ra
3
3
CASCODE 1
CASCODE 2
MIRROR 2
1
MIRROR 4
MIRROR 3
MIRROR 1
THERMAL
PROTECTION
CIRCUIT
1
Fig.1 Block diagram (one amplifier shown).
PINNING
SYMBOL
PIN
DESCRIPTION
V
i(1)
1
inverting input 1
V
i(2)
2
inverting input 2
V
i(3)
3
inverting input 3
GND
4
ground (fin)
I
om
5
black-current measurement output
V
DD
6
supply voltage
V
oc(3)
7
cathode output 3
V
oc(2)
8
cathode output 2
V
oc(1)
9
cathode output 1
handbook, halfpage
Vi(1)
Vi(2)
Vi(3)
GND
Iom
VDD
Voc(3)
Voc(2)
Voc(1)
1
2
3
4
5
6
7
8
9
TDA6107JF
MBL524
Fig.2 Pin configuration.
2002 Oct 18
4
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages measured with respect to pin 4
(ground); currents as specified in Fig.1; unless otherwise specified.
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see
"Handling MOS Devices").
QUALITY SPECIFICATION
Quality specification
"SNW-FQ-611 part D" is applicable and can be found in the "Quality reference Handbook".
The handbook can be ordered using the code 9397 750 00192.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
DD
supply voltage
0
250
V
V
i
input voltage at pins 1 to 3
0
12
V
V
o(m)
measurement output voltage
0
6
V
V
oc
cathode output voltage
0
V
DD
V
I
ocsm(L)
LOW non-repetitive peak cathode output current at a flashover
discharge of 100
C
0
3
A
I
ocsm(H)
HIGH non-repetitive peak cathode output current at a flashover
discharge of 100 nC
0
6
A
T
stg
storage temperature
-
55
+150
C
T
j
junction temperature
-
20
+150
C
V
es
electrostatic handling voltage
Human Body Model (HBM)
-
3000
V
Machine Model (MM)
-
300
V
2002 Oct 18
5
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
THERMAL CHARACTERISTICS
Note
1. An external heatsink is necessary.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
56
K/W
R
th(j-fin)
thermal resistance from junction to fin
note 1
11
K/W
R
th(h-a)
thermal resistance from heatsink to ambient
18
K/W
Thermal protection
The internal thermal protection circuit gives a decrease of
the slew rate at high temperatures: 10% decrease at
130
C and 30% decrease at 145
C (typical values on the
spot of the thermal protection circuit).
handbook, halfpage
-
40
Ptot
(W)
0
8
6
2
0
4
40
80
160
120
Tamb (
C)
MBH989
(1)
(2)
Fig.3 Power derating curves.
(1) Infinite heatsink.
(2) No heatsink.
handbook, halfpage
MGK279
5 K/W
outputs
fin
thermal protection circuit
6 K/W
Fig.4 Equivalent thermal resistance network.
2002 Oct 18
6
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
CHARACTERISTICS
Operating range: T
j
=
-
20 to +150
C; V
DD
= 180 to 210 V. Test conditions: T
amb
= 25
C; V
DD
= 200 V;
V
o(c1)
= V
o(c2)
= V
o(c3)
=
1
/
2
V
DD
; C
L
= 10 pF (C
L
consists of parasitic and cathode capacitance); R
th(h-a)
= 18 K/W
(measured in test circuit of Fig.8); unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
I
q
quiescent supply current
5.6
6.6
7.6
mA
V
ref(int)
internal reference voltage
(input stage)
-
2.5
-
V
R
i
input resistance
-
3.6
-
k
G
gain of amplifier
47.5
51.0
55.0
G
gain difference
-
2.5
0
+2.5
V
O(oc)
nominal output voltage at
pins 7, 8 and 9 (DC value)
I
i
= 0
A
116
129
142
V
V
O(oc)(offset)
differential nominal output
offset voltage between
pins 7 and 8, 8 and 9 and
9 and 7 (DC value)
I
i
= 0
A
-
0
5
V
V
o(c)(T)
output voltage temperature
drift at pins 7, 8 and 9
-
10
-
mV/K
V
o(c)(T)(offset)
differential output offset
voltage temperature drift
between pins 7 and 8,
8 and 9 and 7 and 9
-
0
-
mV/K
I
o(m)(offset)
offset current of measurement
output (for three channels)
I
o(c)
= 0
A;
1.5 V < V
i
< 5.5 V;
1.8 V < V
o(m)
< 6 V
-
50
-
+50
A
I
o(m)
/
I
o(c)
linearity of current transfer
(for three channels)
-
100
A < I
o(c)
< 100
A;
1.5 V < V
i
< 5.5 V;
1.8 V < V
o(m)
< 6 V
-
0.9
-
1.0
-
1.1
-
100
A
I
o(c)
< 10 mA;
1.5 V < V
i
< 5.5 V;
1.8 V < V
o(m)
< 4 V
-
0.9
-
1.0
-
1.1
I
o(c)(max)
maximum peak output current
(pins 7, 8 and 9)
50 V < V
o(c)
< V
DD
-
50 V
-
20
-
mA
V
o(c)(min)
minimum output voltage
(pins 7, 8 and 9)
V
i
= 7.0 V; at I
o(c)
= 0 mA;
note 1
-
-
10
V
V
o(c)(max)
maximum output voltage
(pins 7, 8 and 9)
V
i
= 1.0 V; at I
o(c)
= 0 mA;
note 1
V
DD
-
15
-
-
V
B
S
small signal bandwidth
(pins 7, 8 and 9)
V
o(c)
= 60 V (p-p)
-
5.5
-
MHz
B
L
large signal bandwidth
(pins 7, 8 and 9)
V
o(c)
= 100 V (p-p)
-
4.5
-
MHz
t
Pco
cathode output propagation
time 50% input to 50% output
(pins 7, 8 and 9)
V
o(c)
= 100 V (p-p) square
wave; f <1 MHz;
t
r
= t
f
= 40 ns
(pins 1, 2 and 3);
see Figs 6 and 7
-
60
-
ns
2002 Oct 18
7
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
Notes
1. See also Fig.5 for the typical DC-to-DC transfer of V
I
to V
O(oc)
.
2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.
t
Pco
difference in cathode output
propagation time 50% input to
50% output (pins 7 and 8,
7 and 9 and 8 and 9)
V
o(c)
= 100 V (p-p) square
wave; f < 1 MHz;
t
r
= t
f
= 40 ns
(pins 1, 2 and 3)
-
10
0
+10
ns
t
o(r)
cathode output rise time
10% output to 90% output
(pins 7, 8 and 9)
V
o(c)
= 50 to 150 V square
wave; f < 1 MHz; t
f
= 40 ns
(pins 1, 2 and 3); see Fig.6
67
91
113
ns
t
o(f)
cathode output fall time
90% output to 10% output
(pins 7, 8 and 9)
V
o(c)
= 150 to 50 V square
wave; f < 1 MHz; t
r
= 40 ns
(pins 1, 2 and 3); see Fig.7
67
91
113
ns
t
st
settling time 50% input to
99% < output < 101%
(pins 7, 8 and 9)
V
o(c)
= 100 V (p-p) square
wave; f < 1 MHz;
t
r
= t
f
= 40 ns
(pins 1, 2 and 3);
see Figs 6 and 7
-
-
350
ns
SR
slew rate between
50 V to (V
DD
-
50 V)
(pins 7, 8 and 9)
V
i
= 4 V (p-p) square wave;
f < 1 MHz; t
r
= t
f
= 40 ns
(pins 1, 2 and 3)
-
900
-
V/
s
O
v
cathode output voltage
overshoot (pins 7, 8 and 9)
V
o(c)
= 100 V (p-p) square
wave; f < 1 MHz;
t
r
= t
f
= 40 ns
(pins 1, 2 and 3);
see Figs 6 and 7
-
2
-
%
PSRR
power supply rejection ratio
f < 50 kHz; note 2
-
55
-
dB
ct(DC)
DC crosstalk between
channels
-
-
50
-
dB
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2002 Oct 18
8
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
handbook, halfpage
0
Vo(c)
(V)
2
2.5
4
6
Vi (V)
200
0
160
120
129
80
40
MBH988
Fig.5 Typical DC-to-DC transfer of V
I
to V
OC
.
2002 Oct 18
9
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
150
140
100
60
50
151
149
tst
Ov (in %)
t
t
3.08
4.04
2.12
to(r)
tPco
Vo(c)
(V)
Vi
(V)
MGK280
Fig.6 Output voltage (pins 7, 8 and 9) rising edge as a function of the AC input signal.
2002 Oct 18
10
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
51
49
Ov (in %)
t
t
MGK281
150
140
100
60
50
3.08
4.04
2.12
Vo(c)
(V)
Vi
(V)
tst
to(f)
tPco
Fig.7 Output voltage (pins 7, 8 and 9) falling edge as a function of the AC input signal.
2002 Oct 18
11
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
Cathode output
The cathode output is protected against peak current
(caused by positive voltage peaks during high-resistance
flash) of 3 A maximum with a charge content of 100
C
(1)
.
The cathode is also protected against peak currents
(caused by positive voltage peaks during low-resistance
flash) of 6 A maximum with a charge content of 100 nC
(1)
.
The DC voltage of V
DD
(pin 6) must be within the operating
range of 180 to 210 V during the peak currents.
Flashover protection
The TDA6107JF incorporates protection diodes against
CRT flashover discharges that clamp the cathodes output
voltage up to a maximum of V
DD
+ V
diode
.
To limit the diode current an external 1.5 k
carbon
high-voltage resistor in series with the cathode output and
a 2 kV spark gap are needed (for this resistor value, the
CRT has to be connected to the main PCB
(1)
.
V
DD
must be decoupled to GND:
1. With a capacitor >20 nF with good HF behaviour
(e.g. foil); this capacitor must be placed as close as
possible to pins 6 and 4, but definitely within 5 mm.
2. With a capacitor >3.3
F on the picture tube base
print, depending on the CRT size.
Switch-off behaviour
The switch-off behaviour of the TDA6107JF is controllable.
This is because the output pins of the TDA6107JF are still
under control of the input pins for low power supply
voltages (approximately 30 V and higher).
Bandwidth
The addition of the flash resistor produces a decreased
bandwidth and increases the rise and fall times; see
"Application Note AN96072".
Dissipation
Regarding dissipation, distinction must first be made
between static dissipation (independent of frequency) and
dynamic dissipation (proportional to frequency).
The static dissipation of the TDA6107JF is due to voltage
supply currents and load currents in the feedback network
and CRT.
The static dissipation P
stat
equals:
Where:
V
DD
= supply voltage
I
DD
= supply current
V
OC
= DC value of cathode voltage
I
OC
= DC value of cathode current.
The dynamic dissipation P
dyn
equals:
Where:
C
L
= load capacitance
C
int
= internal load capacitance (
4 pF)
f
i
= input frequency
V
oc(p-p)
= output voltage (peak-to-peak value)
= non-blanking duty cycle.
The IC must be mounted on the picture tube base print to
minimize the load capacitance C
L
.
(1)External protection against higher currents is described
in
"Application Note AN96072"
.
P
stat
V
DD
I
DD
3
V
OC
I
OC
+
=
P
dyn
3
V
DD
C
L
C
int
+
(
)
f
i
V
oc(p-p)
=
2002 Oct 18
12
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
TEST AND APPLICATION INFORMATION
handbook, full pagewidth
MBL526
2 M
C1
1
9
1
J1
22
F
22 nF
C2
4
probe 1
R1
100 k
R2
6.8 pF
C10
20 nF
C7
10
F
C8
3.2 pF
C9
136 pF
C11
VIP
REFERENCE
Vi(1)
Vof
Iom
Voc(1)
VDD
Ri
Rf
Ra
2 M
C3
2
6
8
2
J2
22
F
22 nF
C4
probe 2
R3
100 k
R4
6.8 pF
C13
3.2 pF
C12
136 pF
C14
Vi(2)
Vof
Iom
Voc(2)
Ri
Rf
Ra
2 M
C5
TDA6107JF
3
7
5
3
J3
22
F
22 nF
C6
probe 3
R5
100 k
R6
4 V
6.8 pF
C16
3.2 pF
C15
136 pF
C17
Vi(3)
Vof
Iom
Vo(m)
Voc(3)
Ri
Rf
Ra
Fig.8 Test circuit.
Current sources J1, J2 and J3 are to be tuned so that V
o(c)
of pins 9, 8 and 7 is set to 100 V.
2002 Oct 18
13
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
INTERNAL CIRCUITRY
handbook, full pagewidth
7, 8, 9
MBL527
esd
6.8 V
esd
esd
GND
VDD
esd
from
input
circuit
from
input
circuit
from
control
circuit
from black
current
measurement
circuit
from
control
circuit
to black current
measurement circuit
to black current
measurement circuit
to black current
measurement circuit
to black current
measurement circuit
esd
TDA6107JF
(1)
esd
flash
to cascode
stage
1, 2, 3
4
6
5
Vbias
(1) All pins have an energy protection for positive or negative overstress situations.
Fig.9 Internal pin configuration.
2002 Oct 18
14
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
PACKAGE OUTLINE
UNIT
A
A
3
b
1
D
1
2
b
2
b
c
D
(1)
E
(1)
Z
(1)
e
L
P
P
1
q
1
q
2
q
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
18.5
17.8
8.7
8.0
A
4
15.5
15.1
1.40
1.14
0.67
0.50
1.40
1.14
0.48
0.38
21.8
21.4
21.4
20.7
6.48
6.20
3.4
3.2
2.54
e
2.54
1.0
65
55
5.9
5.7
4.4
4.2
3.9
3.4
15.1
14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT111-1
92-11-17
95-03-11
0
5
10 mm
scale
0.25
w
D
E
A
A
c
A
2
3
A
4
q
1
q
2
L
e
2
Q
w
M
b
b
1
b
2
D
1
P
q
1
Z
e
1
9
P
seating plane
pin 1 index
o
o
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
SOT111-1
A
max.
max.
2
3.7
2002 Oct 18
15
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our
"Data Handbook IC26; Integrated Circuit
Packages" (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
2002 Oct 18
16
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
I
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2002 Oct 18
17
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
NOTES
2002 Oct 18
18
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
NOTES
2002 Oct 18
19
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
NOTES
Koninklijke Philips Electronics N.V. 2002
SCA74
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Date of release:
2002 Oct 18
Document order number:
9397 750 10545
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