1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

FEATURES

Video amplifier with clamp and white clip circuits

FM sound modulator

Asymmetrical and symmetrical RF outputs available

Symmetrical RF oscillator using only a few external
components

External adjusting of modulation depth and level of the
sound subcarrier

C-bus receiver for frequency setting and test-mode

selection

One I

C programmable output port

On-chip Phase-Locked Loop (PLL) frequency
synthesizer

On-chip power supply regulator

Bus switchable oscillator

On-chip Test Pattern Signal Generator (TPSG).

APPLICATIONS

Video recorders

Cable converters

Satellite receivers.

GENERAL DESCRIPTION

The TDA8722 is a programmable modulator which
generates an RF TV channel from a baseband video
signal and a baseband audio signal in the event of
negative video and FM sound standards (PAL B/G, I, D/K
and NTSC).

It is especially suited for satellite receivers, video
recorders and cable converters. The video carrier
frequency is set exactly to the correct channel frequency
by a PLL synthesizer which is programmed in accordance
with the I

C-bus format.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA8722T

SO20

plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

TDA8722M

SSOP20

plastic shrink small outline package; 20 leads; body width 4.4 mm

SOT266-1

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

PINNING

SYMBOL PIN

DESCRIPTION

AUDIO

audio input

SOSCA

sound oscillator A

SOSCB

sound oscillator B

UOSCB

UHF oscillator B

OGND

RF oscillator ground

UOSCA

UHF oscillator A

AMP

tuning amplifier output

charge pump output

XTAL

crystal oscillator

DGND

digital ground

DDD

digital supply voltage

SCL

serial clock input (I

C-bus)

SDA

serial data input (I

C-bus)

NPN open-collector output Port

RFB

asymmetrical RF output B

RFA

asymmetrical RF output A

ADJUST

modulation depth and picture-to-sound
distance adjustment pin

AGND

analog ground

VIDEO

video input

DDA

analog supply voltage

Fig.2 Pin configuration.

handbook, halfpage

TDA8722

MBE394

DGND

XTAL

SCL

SDA

AMP

UOSCA

RFB

OGND

RFA

UOSCB

ADJUST

SOSCB

AGND

SOSCA

VIDEO

AUDIO

VDDD

VDDA

FUNCTIONAL DESCRIPTION

The TDA8722 is a programmable modulator which can be
divided into two main blocks:

A modulator for negative video modulation and
FM sound TV standards

A programmable PLL frequency synthesizer.

The video part of the modulator consists of a clamping
circuit which sets the internal reference voltage to the
bottom of the synchronizing pulse, followed by a white clip
which avoids over modulation in case the video signal is
too strong. Typically, the IC starts to clip the video signal
when the voltage at the video input (pin 19) is
>560 mV (p-p) while the normal voltage at the video input
is 500 mV (p-p). This clipping function ensures that the
video modulation depth is not too high. The modulation
depth is adjusted in the application between at least
65 and 90% by changing the resistor value between pin 17

and ground (R17). The value can change between 47 k

and infinite (R17 removed); see Fig.10.

The video part also contains a test pattern signal generator
to simplify the adjustment of the receiving channel of the
TV set to the required channel of the modulator. The
pattern consists of a synchronization pulse and two
vertical white bars on screen (see Fig.3).

The audio part of the modulator contains an FM sound
modulator. The frequency of the sound subcarrier is set in
the application by external components (C3, L3 and R3).
The difference between the video carrier level and the
sound subcarrier level is adjusted in the application by
changing the value of the capacitor between pin 17 and
ground (C17). The value can change between
0 and 47 pF. The distance between the video carrier and
the sound subcarrier can be adjusted between at least

10 and

18 dB (see Fig.11).

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

To bias the audio input it is necessary to put a resistor in
the application between pin 1 and ground. The resistor
has a typical value of 12 k

The RF part of the oscillator consists of:

An oscillator which operates at the required video
carrier frequency. The range of the oscillator is
determined in the application by C5, C6, L5 and D5.

An RF mixer. It first combines the video signal and the
sound subcarrier to build a baseband TV channel.
Then the baseband signal is mixed with the oscillator
signal to get the RF TV channel. The mixer has two
outputs which can be used as two independent
asymmetrical outputs, or as one symmetrical output. In
the event of asymmetrical use, the unused output must
be loaded with a 75

resistor (see Fig.7).

The oscillator frequency is set by a programmable PLL
frequency synthesizer in accordance with equation:

osc

= 8

ref

Where:

osc

is the local oscillator frequency.

N is a 12-bit dividing number (10 bits are programmable
by the I

C-bus).

ref

is the crystal frequency (4 MHz) divided by 128

(31.25 kHz).

The circuit allows a step of 250 kHz but because only
10 bits are programmable, the programming steps are
1 MHz.
When the PLL loop is locked, both inputs of the phase
comparator are equal, which gives equation:

During the test mode operation, f

DIV

and f

ref

can be

monitored on the output Port pin (pin 14).

Software information

The synthesizer is controlled via a two-wire I

C-bus

receiver. For programming, the address byte (C8 HEX)
has to be sent first. Then one or two data bytes are used
to set the 10 programmable bits of the dividing number N,
the test bits (see Table 1) and the output Port state. Note
that after power-up of the IC, the two data bytes must be
sent.

DIV

osc

-------------

xtal

128

----------

ref

Fig.3 Test pattern signal.

handbook, full pagewidth

MBE395

t (

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

Table 1

Data format; notes 1 and 2

Notes

1. The 10 programmable bits of N are: b2 to b11.

2. Internal hardware sets: b1 = 0 and b0 = 1.

3. T0, T1 and T2 are bits used for test purposes (see Table 5).

4. P0 is a bit used for controlling the state of the output Port (see Table 6).

Table 2

Structure of the dividing number N

Notes

1. Bits b2 to b11 are programmable and represent the integer part of the frequency in MHz. Bits b1 and b0 are fixed

internally to b1 = 0 and b0 = 1 to get the added 0.25 MHz, common for most TV channels.

2. Bits b1 and b0 are not programmable.

3. f

osc

= 512b11 + 256b10 + 128b9 + 64b8 + 32b7 + 16b6 + 8b5 + 4b4 + 2b3 + b2 + 0.25 (MHz).

Table 3

Dividing number N for programming channel 21 (471.25 MHz)

Notes

1. Bits b1 and b0 are not programmable.

2. f

osc

= 0 + 256 + 128 + 64 + 0 + 16 + 0 + 4 + 2 + 1 + 0.25 (MHz) = 471.25 MHz.

Table 4

Content of the data bytes to program channel 21 (471.25 MHz)

It is possible to change only one data byte. The circuit will recognize which one is received with the value of MSB
(0 for data byte 1 and 1 for data byte 2). It is possible to change the frequency by 1 MHz with data byte 2. It is easy to
increment the channel frequency when its frequency width is 8 MHz by simply incrementing data byte 1.

BYTE

BIT 7

MSB

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

LSB

ACKNOWLEDGE BIT

Address byte C8

ACK

Data byte 1

b11

b10

ACK

Data byte 2

(3)

(4)

ACK

RESULT

BITS

(1)

b11

b10

(2)

Frequency (MHz)

(3)

512

256

128

0.5

0.25

RESULT

BITS

b11

b10

(1)

Value

Frequency (MHz)

(2)

256

128

0.25

BYTE

BIT 7

MSB

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

LSB

ACKNOWLEDGE BIT

Address byte C8

ACK

Data byte 1

ACK

Data byte 2

ACK

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

The bits T0 to T2 are available for test purposes and the possibilities are shown in Table 5.

Table 5

Test modes

Notes

1. In `TPSG on' mode the video carrier is modulated by the test signal consisting of a synchronization pulse and two

vertical white bars on a black screen. This mode should be selected to adjust the TV set receiving the modulated
signal to the right frequency.

2. In `RF oscillator off' mode, the RF oscillator and the RF mixer are switched-off and there is no RF carrier coming out

of the device. This mode can be selected to avoid RF radiation to other parts when the modulator output is not used.

3. In `balance test', the video carrier is over modulated. This simplifies residual carrier measurements.

4. In `f

ref

' and `f

DIV

' modes, the reference frequency f

ref

in the phase comparator or the divided RF oscillator frequency

DIV

is available on the output Port pin. This mode requires that bit P0 = 0.

5. The `high-impedance test' mode may be used to inject an external tuning voltage to the RF tank circuit, to test the

oscillator. In this mode, the phase detector is disabled and the external transistor of the tuning amplifier is
switched-off. The AMP output (pin 7) is LOW (<200 mV).

6. In the `phase detector disabled' mode, it is possible to measure the leakage current at the input of the tuning amplifier,

on the CP pin. In this mode the RF oscillator is off, and the baseband TV channel signal is present on the RF outputs
for testing the audio and video parts.

OPERATIONAL MODE

normal operation

Test Pattern Signal Generator (TPSG) on; note 1

RF oscillator off; note 2

balance test; note 3

ref

out (if p0 = 0); note 4

high-impedance test; note 5

DIV

out (if p0 = 0); note 4

phase detector disabled; baseband signals on RF outputs; note 6

The possibilities of bit P0, which controls the output Port
(pin 14) are given in Table 6.

The Port is an NPN open-collector type. For monitoring the
f

ref

or f

DIV

frequency on the output Port, the P0 bit must be

logic 0 to let the output Port free.

Table 6

Output Port programming

OUTPUT PORT STATE

off; high impedance

on; sinking current

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it
is desirable to take normal precautions appropriate to handling integrated circuits. Every pin withstands the ESD test in
accordance with

"MIL-STD-883C category B" (2000 V). Every pin withstands the ESD test in accordance with Philips

Semiconductors Machine Model (MM) 0

, 200 pF (200 V).

THERMAL RESISTANCE

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

DDA

analog supply voltage

0.3

DDD

digital supply voltage

0.3

operating supply voltage

4.5

5.5

max

maximum voltage on all pins

0.3

stg

IC storage temperature

+125

amb

operating ambient temperature

+85

SYMBOL

PARAMETER

VALUE

UNIT

th j-a

thermal resistance from junction to ambient in free air

SO20; SOT163-1

K/W

SSOP20; SOT266-1

120

K/W

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

CHARACTERISTICS
V

DDA

= V

DDD

= 5 V; T

amb

= 25

C; valid over the whole UHF band; measured in circuit of Fig.7;

unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

supply current

normal mode

RF off test mode

Video characteristics

input current (AC)

= 3.2 V

0.5

2.0

video input impedance

= 3.2 V

modulation depth

= 500 mV (p-p) EBU

colour bars; R17 = 120 k

;

see Fig.7

during clipping condition;
note 1

TPSG mode;
R17 = 120 k

balance test mode;
R17 = 120 k

110

modulation depth range

= 500 mV (p-p) EBU

colour bars;
47 k

R17

APL

variation of modulation depth with
change of APL between 10 and 90%

referenced to the value for
APL = 50%;
V

= 500 mV (p-p)

clip(p-p)

video input level where clipping starts
(peak-to-peak value)

video level on pin 19;
note 2

0.56

S/N video video signal-to-noise ratio

< 700 MHz; note 3

> 700 MHz; note 3

diff

differential gain

note 4

diff

differential phase

note 4

deg

V/S

video-to-sync ratio

= 500 mV (p-p);

V/S = 7/3

6.9/3.1

7/3

7.1/2.9

video

frequency response for the video signal

note 5

Audio characteristics (for PAL G standard; audio subcarrier at 5.5 MHz)

audio input impedance

modulation deviation

= 400 Hz;

= 0.5 V (RMS) before

pre-emphasis filter

kHz

max

maximum modulation deviation

= 400 Hz;

= 2.0 V (RMS) before

pre-emphasis filter

kHz

THD

total harmonic distortion

= 1 kHz;

= 0.5 V (RMS) before

pre-emphasis filter

0.4

1.5

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

S/N audio audio signal-to-noise ratio

note 6

audio

frequency response of the audio signal

note 7

P/S

picture-to-sound ratio

no audio signal;
FM = 5.5 MHz;
C17 = 15 pF

P/S

picture-to-sound ratio range

no audio signal;
FM = 5.5 MHz;
0 pF

C17

39 pF

Channel characteristics

RF frequency range

using tank circuit of Fig.7

471.25

855.25

MHz

output level on RFA and RFB

asymmetrical output
loaded with 75

;

f = 471.25 to 855.25 MHz

difference between the level of
modulated carrier and the level of the
unmodulated carrier

measurement is made
during synchronization
pulse for the modulated
carrier

SPO

spurious outside channel

note 8

dBc

RF second harmonic level on
asymmetrical output

= 471.25 MHz

dBc

= 855.25 MHz

dBc

sound carrier second harmonic level

= 5.5 MHz;

C17 = 15 pF;
f

< 700 MHz

dBc

= 5.5 MHz;

C17 = 15 pF;
f

> 700 MHz

dBc

sound carrier third harmonic level

= 5.5 MHz; C17 = 15 pF

dBc

video signal harmonics

note 9

dBc

ref

reference frequency spurious

+ 31.25 kHz

dBc

chrominance beat

note 10

dBc

Charge pump output (CP)

output current

100

output voltage

in lock

1.5

2.5

OFF-state leakage current

= 2 V; T0 = 1; T1 = 1;

T2 = 1

Amplifier output (AMP)

amplifier current gain

= 2 V; I

AMP

= 10

4000

7sat

output saturation voltage

= 0 V; T0 = 1; T1 = 0;

T2 = 1

140

200

Crystal oscillator characteristics (XTAL)

oscillator input impedance

500

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

Notes

1. Modulation depth when the video signal is between 560 and 1000 mV (peak-to-peak value) at pin 19. R17 = 120 k

in the application.

2. For application information only.

3. Ratio between the CCIR 17 line bar amplitude (corresponding to the level difference between black and white;

see Fig.4 and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after
demodulation for PAL G standard. Measurement is unweighted, done between 200 kHz and 5 MHz.

4. Measured for PAL G standard on 4 first steps of CCIR 330 line, corresponding to a 5 step staircase with

300 mV (peak-to-peak value) chrominance carrier when the level between synchronization pulse and white is 1 V;
see Fig.5.

5. Measured with a spectrum analyzer with `peak hold' function, applying a 500 mV (peak-to-peak value) sine wave at

the video input of the IC, with a frequency of 0.5, 2.0, 4.0 and 4.8 MHz. The reference is the value measured for
1.0 MHz.

6. Measured using CCIR 468-3 weighting filter and quasi-peak detection, with an audio frequency of 1 kHz and a

deviation of 50 kHz. Video signal is EBU colour bars of 500 mV (peak-to-peak value) on pin 19.

7. Measured in PAL G standard with no pre-emphasis on the audio input and no de-emphasis in the receiver. Audio

input level is adjusted for having a deviation of 25 kHz at 1 kHz audio frequency. Measurement is done for
frequencies between 50 Hz and 15 kHz, reference is the level measured for 1 kHz.

8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator

frequency and the sound oscillator frequency (f

+ 2f

, 2f

+ f

, etc.). This measurement includes the spurious at

the

and

9. Corresponding to the harmonics of the video signal. Measured by putting a 1 MHz sine wave of

500 mV (peak-to-peak value) at the video input (pin 19) and checking the level at f

+ 2 MHz, f

+ 3 MHz, etc.

10. Measured with a 4.43 MHz sine wave of 350 mV (peak-to-peak value) at the video input. Measurement is the

difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency
of the picture carrier plus 1.07 MHz. C17 = 15 pF in the application diagram of Fig.7.

Output Port characteristics (P0)

LOW level output voltage

P0 = 1; I

= 5 mA

150

400

OFF-state leakage current

P0 = 0; V

= 5.5 V

14(max)

maximum Port current

P0 = 1

C-bus receiver characteristics (SDA and SCL)

HIGH level input voltage

5.5

LOW level input voltage

1.5

HIGH level input current

= 5 V; V

= 0 or 5 V

LOW level input current

= 0 V; V

= 0 or 5 V

output voltage on SDA

during acknowledge
pulse; I

= 3 mA

0.4

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

Fig.9 Application using a symmetrical output with a balun transformer.

handbook, full pagewidth

220 pF

220 k

C30

10 nF

AUDIO

12 k

R18

R19

470

R17

120 k

R15

300

R20

470

22 k

15 k

12 k

22 k

12 k

22 k

56 pF

BB215

33 pF

150 nF

10 nF

BC547B

10 nF

C11

4 MHz

27 pF

33 V

GND

PORT

SCL

SDA

5 V

C20

100 nF

VIDEO

100 nF

C19

15 pF

C17

100 pF

C16

100 pF

C15

MBE404

TR1

TOKO - B4F

617DB - 1010

TDA8722

In the design of the application, it is highly recommended
to separate the part of the RF oscillator as much as
possible from the part of the RF outputs in order to avoid
parasitic coupling between these two parts.

A good solution is shielding the RF oscillator part to avoid
radiation from and to this part. The pin 5 (OGND) must be
connected to the shielding box and to ground.

RF outputs

For inexpensive applications, it is possible to use the IC
with an asymmetrical output (pins 15 or 16). In this event,
the unused output pin must be loaded with a load as

similar as possible to the load connected to the used pin,
see Fig.8.

A good improvement in performance is obtained using a
1 : 4 symmetrical to asymmetrical transformer
(balun; balance-to-unbalance) connected between the
two outputs. In this event both outputs have their loads
matched. The level of the RF second harmonic, and the
spurious outside channel is decreasing. The parasitic
coupling between RF outputs and RF oscillator is also
reduced (see Fig.9).

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

Modulation depth

With 500 mV (peak-to-peak value) video input signal, the
wanted modulation depth must be set by the value of R17
(resistor between pin 17 and ground) as shown Fig.10. For
a good accuracy, it is recommended to use a 1% type
resistor.

It is also possible to use an adjustable resistor, see Fig.8.

Depending on the layout of the PCB, it may be necessary
to slightly change the value of R17 from the one given in
Fig.10 to get the wanted modulation depth.

Sound oscillator design

The frequency of the sound subcarrier is fixed by the tank
circuit connected between pins 2 and 3. This frequency
can be adjusted between 4.5 and 6.5 MHz covering all
existing standards in the world.

The damping resistor R3 between pins 2 and 3 is
necessary to decrease the quality factor of the tank circuit
allowing the frequency to be modulated by the audio
signal. The value of this resistor is calculated for several
Q factor ranges of the coil for a sound frequency of
5.5 MHz (see Table 7).

Fig.10 Typical modulation depth as a function of

the value of R17.

handbook, halfpage

100

MBE398

R17 (k

)

modulation

depth

(%)

Table 7

Value of resistor for several Q factor ranges

The use of a coil with a quality factor <30 may result in a
non operating oscillator. For safety, it is recommended to
use a coil with a quality factor

50.

Picture-to-sound ratio

The picture-to-sound ratio can be adjusted in the
application by changing the value of C17 (capacitor
between pin 17 and ground); see Fig.11.

Figure 11 shows us that the picture-to-sound ratio will
change for a constant value of C17 when the sound
subcarrier frequency will change.

RF harmonics

This IC has been designed to have the lowest level of
unwanted RF harmonics at the frequencies where these
are the hardest to be filtered out, especially for the second
harmonic of the RF carrier at the lowest frequencies of the
UHF band.

The level of the second and third RF harmonic is shown in
Fig.12 for an asymmetrical application. This chart gives a
typical value while the level of these harmonics can vary
depending on the design of the application.

It is possible to reduce the level of the second harmonic by
using a wide band transformer at the output of the IC and
create a symmetrical application (see Fig.9).

To reduce the out-of-band harmonics and especially the
third one, it is necessary to use a low-pass filter at the
output of the IC.

COIL QUALITY

FACTOR

PROPOSED VALUE FOR R3

)

30 to 40

82 to 33

40 to 50

33 to 27

50 to 60

27 to 22

60 to 80

22 to 18

80 to >100

18 to 15

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

Fig.11 Typical picture-to-sound ratio as a function

of the value of C17.

R17 = 120 k

(1) 4.5 MHz.

(2) 5.5 MHz.

(3) 6.0 MHz.

(4) 6.5 MHz.

handbook, halfpage

MBE399

C17 (pF)

P/S

(dB)

(1)

(4)

(3)

(2)

Fig.12 Typical level of RF harmonics for an

asymmetrical application.

handbook, halfpage

450

550

MBE400

650

750

850

RF (MHz)

harmonics

(dBc)

third harmonic

second harmonic

VHF operation

This IC can operate on frequencies as low as 200 MHz
(and especially for VHF 3 band) provided the impedance
of the tuned circuit between pins 4 and 6 is >1 k

NICAM and stereo

Because of the fact that the ADJUST pin (pin 17) is an
access point to the RF mixer, it is possible to use this pin
to inject an external modulated subcarrier into the IC.

This is especially interesting when it is necessary to
transmit a second frequency modulated audio subcarrier
for stereo sound (f = 5.72 MHz) or a NICAM QPSK
modulated carrier for digital audio transmission
(f = 5.85 or 6.552 MHz).

The incoming signal must be externally modulated either
in FM with the desired signal corresponding to PAL B/G
specification for stereo sound transmission, or in QPSK in
accordance with the NICAM transmission system.

The input impedance on pin 17 is approximately 3500

the incoming signal must be capacitive coupled, the
resistor R17 between pin 17 and ground must remain to
adjust the modulation depth, the capacitor C17 between
pin 17 and ground may be changed depending on the
capacitance brought on by the incoming network. If this
capacitance is large, it is possible to remove C17.
Figure 13 shows a possible application for injecting such
kind of signal into the modulator IC.

Following this application, to get a picture-to-second
sound carrier ratio of

20 dB, it is necessary to apply a

level of approximately 800 mV (peak-to-peak value) at
the second carrier input, when the picture-to-first sound
carrier ratio is approximately

13 dB.

In addition, the internal FM sound modulator can be
switched off by short-circuiting pins 2 and 3.

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

PACKAGE OUTLINES

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

2.65

0.30
0.10

2.45
2.25

0.49
0.36

0.32
0.23

13.0
12.6

7.6
7.4

1.27

10.65
10.00

1.1
1.0

0.9
0.4

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1
0.4

SOT163-1

detail X

0.25

075E04

MS-013AC

pin 1 index

0.10

0.012
0.004

0.096
0.089

0.019
0.014

0.013
0.009

0.51
0.49

0.30
0.29

0.050

1.4

0.055

0.419
0.394

0.043
0.039

0.035
0.016

0.01

0.25

0.01

0.004

0.043
0.016

0.01

10 mm

scale

(A )

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

95-01-24
97-05-22

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all SO and
SSOP packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

The longitudinal axis of the package footprint must be
parallel to the solder flow.

The package footprint must incorporate solder thieves at
the downstream end.

SSOP

Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.

The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

ETHOD

(SO

AND

SSOP)

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

1998 Jun 23

Philips Semiconductors

Product specification

C-bus programmable modulator for

negative video modulation and FM sound

TDA8722

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

C COMPONENTS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

C components conveys a license under the Philips' I

C patent to use the

components in the I

C system provided the system conforms to the I

C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors a worldwide company

SCA60

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
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Printed in The Netherlands

545104/1200/02/pp28

Date of release: 1998 Jun 23

Document order number:

9397 750 03431

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA8722M/C2

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA8722M/C2