Document Outline
- FEATURES
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- ORDERING INFORMATION
- BLOCK DIAGRAM
- PINNING
- FUNCTIONAL DESCRIPTION
- LIMITING VALUES
- THERMAL CHARACTERISTICS
- QUALITY SPECIFICATION
- CHARACTERISTICS
- TIMING DIAGRAMS
- APPLICATION INFORMATION
- BONDING PAD LOCATIONS
- PACKAGE OUTLINE
- SOLDERING
- DATA SHEET STATUS
- DEFINITIONS
- DISCLAIMERS
DATA SHEET
Product specification
Supersedes data of 2001 Dec 17
2002 Jul 17
INTEGRATED CIRCUITS
TJA1020
LIN transceiver
2002 Jul 17
2
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
FEATURES
General
Baud rate up to 20 Kbaud
Very low ElectroMagnetic Emission (EME)
High ElectroMagnetic Immunity (EMI)
Low slope mode for an even further reduction of EME
Passive behaviour in unpowered state
Input levels compatible with 3.3 and 5 V devices
Integrated termination resistor for Local Interconnect
Network (LIN) slave applications
Wake-up source recognition (local or remote).
Low power management
Very low current consumption in sleep mode with local
and remote wake-up.
Protections
Transmit data (TXD) dominant time-out function
Bus terminal and battery pin protected against
transients in the automotive environment (ISO7637)
Bus terminal short-circuit proof to battery and ground
Thermally protected.
GENERAL DESCRIPTION
The TJA1020 is the interface between the LIN
master/slave protocol controller and the physical bus in a
Local Interconnect Network (LIN). It is primarily intended
for in-vehicle sub-networks using baud rates from 2.4 up to
20 Kbaud.
The transmit data stream of the protocol controller at the
TXD input is converted by the LIN transceiver into a bus
signal with controlled slew rate and wave shaping to
minimize EME. The LIN bus output pin is pulled HIGH via
an internal termination resistor. For a master application
an external resistor in series with a diode should be
connected between pin INH or pin BAT and pin LIN. The
receiver detects the data stream at the LIN bus input pin
and transfers it via pin RXD to the microcontroller.
In normal transceiver operation the TJA1020 can be
switched in the normal slope mode or the low slope mode.
In the low slope mode the TJA1020 lengthens the rise and
fall slopes of the LIN bus signal, thus further reducing the
already very low emission in normal slope mode.
In sleep mode the power consumption of the TJA1020 is
very low, whereas in failure modes the power consumption
is reduced to a minimum.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
V
BAT
supply voltage on pin BAT
5
12
27
V
I
BAT
supply current on pin BAT in sleep mode
1
3
8
A
supply current on pin BAT in standby mode; bus recessive
100
400
1000
A
supply current on pin BAT in normal slope mode; bus recessive
100
400
1000
A
supply current on pin BAT in normal slope mode; bus dominant
1
3.5
8.0
mA
V
LIN
DC voltage on pin LIN
-
27
-
+40
V
T
vj
virtual junction temperature
-
40
-
+150
C
V
esd(HBM)
electrostatic discharge voltage; human body model;
pins NWAKE, LIN and BAT
-
4
-
+4
kV
TYPE
NUMBER
PACKAGES
NAME
DESCRIPTION
VERSION
TJA1020T
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TJA1020U
-
bare die; die dimensions 1480
1760
375
m
-
2002 Jul 17
3
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
BLOCK DIAGRAM
handbook, full pagewidth
FILTER
RXD/
INT
BUS
TIMER
CONTROL
TJA1020T
WAKE-UP
TIMER
NWAKE
BAT
NSLP
TXD
RXD
INH
LIN
GND
MGU241
SLEEP/
NORMAL
TIMER
7
3
2
4
1
6
5
8
TEMPERATURE
PROTECTION
TXD
TIME-OUT
TIMER
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
RXD
1
receive data output (open-drain);
active LOW after a wake-up event
NSLP
2
sleep control input (active LOW);
controls inhibit output; resets
wake-up source flag on TXD and
wake-up request on RXD
NWAKE
3
local wake-up input (active LOW);
negative edge triggered
TXD
4
transmit data input; active LOW
output after a local wake-up event
GND
5
ground
LIN
6
LIN bus line input/output
BAT
7
battery supply
INH
8
battery related inhibit output for con-
trolling an external voltage regulator;
active HIGH after a wake-up event
handbook, halfpage
MGU242
TJA1020T
1
2
3
4
8
7
6
5
INH
BAT
LIN
GND
RXD
NSLP
NWAKE
TXD
Fig.2 Pinning diagram.
2002 Jul 17
4
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
FUNCTIONAL DESCRIPTION
The TJA1020 is the interface between the LIN master/slave protocol controller and the physical bus in a Local
Interconnect Network (LIN). The LIN transceiver is optimized for the maximum specified LIN transmission speed of
20 Kbaud providing optimum EMC performance due to wave shaping of the LIN output.
Operating modes
The TJA1020 provides two modes of normal operation, one intermediate mode and one very low power mode. Figure 3
shows the state diagram.
handbook, full pagewidth
SLEEP
switching on BAT
MGU243
(t(NWAKE = 0; after 1
->
0)
>
tNWAKE
or
t(LIN = 0; after 1
->
0)
>
tBUS)
and NSLP = 0
t(NSLP = 1; after 0
->
1)
>
tgotonorm
and TXD = 1
t(NSLP = 1; after 0
->
1)
>
tgotonorm
and TXD = 0
t(NSLP = 0; after 1
->
0)
>
tgotosleep
and no wake-up event
t(NSLP = 0; after 1
->
0)
>
tgotosleep
and no
wake-up event
t(NSLP = 1; after 0
->
1)
>
tgotonorm
and TXD = 0
t(NSLP = 1; after 0
->
1)
>
tgotonorm
and TXD = 1
NORMAL
SLOPE MODE
LOW
SLOPE MODE
INH = HIGH
TERM. = 30 k
RXD = LOW
trx OFF
INH = HIGH
TERM. = 30 k
RXD = LINDATA
trx ON
INH = HIGH
TERM. = 30 k
RXD = LINDATA
trx ON
INH = FLOATING
TERM. =
HIGH-OHMIC
RXD = FLOATING
trx OFF
STANDBY
trx: transmitter.
TERM.: slave termination resistor, connected between pins LIN and BAT.
Fig.3 State diagram.
2002 Jul 17
5
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
Table 1
Operating modes
Notes
1. The standby mode is entered automatically upon any local or remote wake-up event during sleep mode. Pin INH and
the 30 k
termination resistor at pin LIN are switched on.
2. The internal wake-up source flag (set if a local wake-up did occur and fed to pin TXD) will be reset when entering
normal slope or low slope mode (NSLP goes HIGH).
3. The wake-up interrupt (on pin RXD) is released when entering normal slope or low slope mode (NSLP goes HIGH).
4. The normal slope mode is entered if TXD is set HIGH (set by the microcontroller to recessive) during a positive edge
on NSLP. In the event of a short-circuit to ground on pin TXD, the transmitter will be disabled.
5. The low slope mode is entered if pin TXD is pulled LOW (actively set dominant by the microcontroller or due to a
failure on TXD) during the positive edge on NSLP.
MODE
NSLP
TXD (OUTPUT)
RXD
INH
TRANSMITTER
REMARKS
Sleep
0
weak pull-down
floating
floating off
no wake-up request detected
Standby
(1)
0
weak pull-down if
remote wake-up;
strong pull-down if
local wake-up;
note 2
LOW; note 3
HIGH
off
wake-up request detected; in
this mode the microcontroller
can read the wake-up source:
remote or local wake-up
Normal
slope
mode
1
weak pull-down
HIGH:
recessive state
LOW:
dominant state
HIGH
normal slope
mode
notes 2, 3 and 4
Low slope
mode
1
weak pull-down
HIGH:
recessive state
LOW:
dominant state
HIGH
low slope mode
notes 2, 3 and 5
Sleep mode
This mode is the most power saving mode of the TJA1020
and the default state after power-up (first battery supply).
Despite its extreme low current consumption, the TJA1020
can still be waken up remotely via pin LIN, or waken up
locally via pin NWAKE, or activated directly via pin NSLP.
Filters at the inputs of the receiver (LIN), of pin NWAKE
and of pin NSLP are preventing unwanted wake-up events
due to automotive transients or EMI. All wake-up events
have to be maintained for a certain time period (t
BUS
,
t
NWAKE
and t
gotonorm
).
The sleep mode is initiated by a falling edge on the pin
NSLP driven by the microcontroller. After a filter time
continuously driven sleep command (pin NSLP = LOW),
pin INH becomes floating.
In sleep mode the internal slave termination between
pins LIN and BAT is disabled to minimize the power
dissipation in case pin LIN is short-circuited to ground.
Only a weak pull-up between pins LIN and BAT is present.
The sleep mode can be activated independently from the
actual level on pin LIN or NWAKE. So it is guaranteed that
the lowest power consumption is achievable even in case
of a continuous dominant level on pin LIN or a continuous
LOW on pin NWAKE.
Standby mode
The standby mode is entered automatically whenever a
local or remote wake-up occurs while the TJA1020 is in its
sleep mode. These wake-up events activate pin INH and
enable the slave termination resistor at the pin LIN. As a
result of the HIGH condition on pin INH the voltage
regulator and the microcontroller can be activated.
The standby mode is signalled by a LOW level on pin RXD
which can be used as an interrupt for the microcontroller.
In the standby mode (pin NSLP is still LOW), the condition
of pin TXD (weak pull-down or strong pull-down) indicates
the wake-up source: weak pull-down for a remote wake-up
request and strong pull-down for a local wake-up request.
2002 Jul 17
6
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
Setting pin NSLP HIGH during standby mode results in the
following events:
An immediate reset of the wake-up source flag; thus
releasing the possible strong pull-down at pin TXD
before the actual mode change (after t
gotonorm
) is
performed
A change into normal slope mode if the HIGH level on
pin NSLP has been maintained for a certain time period
(t
gotonorm
) and pin TXD is HIGH
A change into low slope mode if the HIGH level on pin
NSLP has been maintained for a certain time period
(t
gotonorm
) and pin TXD is pulled LOW by the application.
In the event of a short-circuit to ground or an open-wire
on pin TXD, the LIN output remains recessive (fail safe).
A reset of the wake-up request signal on pin RXD if the
HIGH level on pin NSLP has been maintained for a
certain time period (t
gotonorm
).
Normal slope mode
In the normal slope mode the transceiver is able to
transmit and receive data via the LIN bus line. The receiver
detects the data stream at the LIN bus input pin and
transfers it via pin RXD to the microcontroller (see Fig.1):
HIGH at a recessive level and LOW at a dominant level on
the bus. The receiver has a supply voltage related
threshold with hysteresis and an integrated filter to
suppress bus line noise. The transmit data stream of the
protocol controller at the TXD input is converted by the
transmitter into a bus signal with controlled slew rate and
wave shaping to minimize EME. The LIN bus output pin is
pulled HIGH via an internal slave termination resistor. For
a master application an external resistor in series with a
diode should be connected between pin INH or BAT on
one side and pin LIN on the other side.
The normal slope mode is entered by a HIGH level on
pin TXD and a HIGH level on pin NSLP maintained for a
certain time period (t
gotonorm
), coming from the sleep or
standby mode.
The TJA1020 switches to sleep mode in case of a LOW
level on pin NSLP, maintained during a certain time period
(t
gotosleep
).
Low slope mode
The only difference between the normal slope mode and
the low slope mode is the transmitter behaviour.
In the low slope mode the transmitter output stage drives
the LIN bus line with lengthened rise and fall slopes. This
will further reduce the already outstanding EME in the
normal slope mode. The low slope mode is perfectly suited
for applications where transmission speed is not critical.
The mode selection is done by the LIN transceiver after a
positive edge on pin NSLP, maintained for a certain time
period (t
gotonorm
). If pin TXD is LOW at that time, the low
slope mode is entered, otherwise the normal mode is
entered. The transition to the low slope mode will be
executed during an open pin TXD (fail-safe), a short-circuit
from pin TXD to ground (fail-safe) or an intended LOW
level of pin TXD programmed by the microcontroller. The
transmitter is enabled after a LOW-to-HIGH transition on
pin TXD. In the event of a short-circuit to ground on pin
TXD, the transmitter will be disabled.
Wake-up
There are three ways to wake-up a TJA1020 which is in
sleep mode:
1. Remote wake-up via a dominant bus state
2. Local wake-up via a negative edge at pin NWAKE
3. Mode change (pin NSLP is HIGH) from sleep mode to
normal slope/low slope mode.
Remote and local wake-up
A falling edge at pin NWAKE followed by a LOW level
maintained for a certain time period (t
NWAKE
) results in a
local wake-up. The pin NWAKE provides an internal
pull-up towards pin BAT.
If, during power-up, pin NWAKE is LOW for a certain
period of time (t
NWAKE
) this will also result in a local
wake-up.
A falling edge at pin LIN followed by a LOW level
maintained for a certain time period (t
BUS
) and a rising
edge at pin LIN respectively (see Fig.4) results in a remote
wake-up.
After a local or remote wake-up pin INH is activated (it
goes HIGH) and the internal slave termination resistor is
switched on. The wake-up request is indicated by a LOW
active wake-up request signal on pin RXD to interrupt the
microcontroller.
2002 Jul 17
7
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
Wake-up via mode transition
It is also possible to set pin INH HIGH with a mode
transition towards normal slope/low slope mode via pin
NSLP. This is useful for applications with a continuously
powered microcontroller.
Wake-up source recognition
The TJA1020 can distinguish between a local wake-up
request on pin NWAKE and a remote wake-up request via
a dominant bus state. The wake-up source flag is set in
case the wake-up request was a local one. The wake-up
source can be read on pin TXD in the standby mode. If an
external pull-up resistor on pin TXD to the power supply
voltage of the microcontroller has been added a HIGH
level indicates a remote wake-up request (weak pull-down
at pin TXD) and a LOW level indicates a local wake-up
request (strong pull-down at pin TXD; much stronger than
the external pull-up resistor).
The wake-up request flag (signalled on pin RXD) as well
as the wake-up source flag (signalled on pin TXD) are
reset immediately, if the microcontroller sets pin NSLP
HIGH.
TXD dominant time-out function
A `TXD Dominant Time-out' timer circuit prevents the bus
line from being driven to a permanent dominant state
(blocking all network communication) if pin TXD is forced
permanently LOW by a hardware and/or software
application failure. The timer is triggered by a negative
edge on pin TXD. If the duration of the LOW level on pin
TXD exceeds the internal timer value (t
dom
), the transmitter
is disabled, driving the bus line into a recessive state. The
timer is reset by a positive edge on pin TXD.
Fail-safe features
Pin TXD provides a pull-down to GND in order to force a
predefined level on input pin TXD in case the pin TXD is
unsupplied.
Pin NSLP provides a pull-down to GND in order to force
the transceiver into sleep mode in case the pin NSLP is
unsupplied.
Pin RXD is set floating in case of lost power supply on pin
BAT.
The current of the transmitter output stage is limited in
order to protect the transmitter against short-circuit to pins
BAT or GND.
A loss of power (pins BAT and GND) has no impact to the
bus line and the microcontroller. There are no reverse
currents from the bus. The LIN transceiver can be
disconnected from the power supply without influencing
the LIN bus.
The output driver at pin LIN is protected against
overtemperature conditions. If the junction temperature
exceeds the shutdown junction temperature T
j(sd)
, the
thermal protection circuit disables the output driver. The
driver is enabled again if the junction temperature has
been decreased below T
j(sd)
and a recessive level is
present at pin TXD.
2002 Jul 17
8
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
handbook, full pagewidth
MBL371
LIN recessive
LIN dominant
sleep mode
standby mode
0.4VBAT
0.6VBAT
ground
VBAT
VLIN
tBUS
Fig.4 Wake-up behaviour.
2002 Jul 17
9
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin GND.
Notes
1. Equivalent to discharging a 100 pF capacitor through a 1.5 k
resistor.
2. Equivalent to discharging a 200 pF capacitor through a 10
resistor and a 0.75
H coil. In the event of a discharge
from pin INH to pin BAT:
-
150 V < V
esd(MM)
< +150 V.
THERMAL CHARACTERISTICS
According to IEC747-1.
QUALITY SPECIFICATION
Quality specification in accordance with
"AEC - Q100".
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
BAT
supply voltage on pin BAT
-
0.3
+40
V
V
TXD
, V
RXD
, V
NSLP
DC voltage on pins TXD, RXD and NSLP
-
0.3
+7
V
V
LIN
DC voltage on pin LIN
-
27
+40
V
V
NWAKE
DC voltage on pin NWAKE
-
1
+40
V
I
NWAKE
current on pin NWAKE (only relevant if
V
NWAKE
< V
GND
-
0.3 V; current will flow into
pin GND)
-
15
-
mA
V
INH
DC voltage on pin INH
-
0.3
V
BAT
+ 0.3
V
I
INH
output current at pin INH
-
50
+15
mA
V
trt(LIN)
transient voltage on pin LIN (ISO7637)
-
150
+100
V
T
vj
virtual junction temperature
-
40
+150
C
T
stg
storage temperature
-
55
+150
C
V
esd(HBM)
electrostatic discharge voltage; human body
model
note 1
on pins NWAKE, LIN and BAT
-
4
+4
kV
on pins RXD, NSLP, TXD and INH
-
2
+2
kV
V
esd(MM)
electrostatic discharge voltage; machine
model; all pins
note 2
-
200
+200
V
SYMBOL
PARAMETER
CONDITION
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient in
SO8 package
in free air
145
K/W
R
th(j-s)
base
thermal resistance from junction to substrate
bare die
in free air
tbf
K/W
2002 Jul 17
10
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
CHARACTERISTICS
V
BAT
= 5 to 27 V; T
vj
=
-
40 to +150
C; R
L(LIN-BAT)
= 500
; all voltages are defined with respect to ground; positive
currents flow into the IC; typical values are given at V
BAT
= 12 V; unless otherwise specified; notes 1 and 2.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
I
BAT
supply current on
pin BAT
sleep mode
(V
LIN
= V
BAT
;
V
NWAKE
= V
BAT
;
V
TXD
= 0 V; V
NSLP
= 0 V)
1
3
8
A
standby mode; bus
recessive (V
INH
= V
BAT
;
V
LIN
= V
BAT
;
V
NWAKE
= V
BAT
;
V
TXD
= 0 V; V
NSLP
= 0 V)
100
400
1000
A
standby mode; bus
dominant (V
BAT
= 12 V;
V
INH
= 12 V; V
LIN
= 0 V;
V
NWAKE
= 12 V;
V
TXD
= 0 V;
V
NSLP
= 0 V); note 3
300
900
2000
A
low slope mode; bus
recessive (V
INH
= V
BAT
;
V
LIN
= V
BAT
;
V
NWAKE
= V
BAT
;
V
TXD
= 5 V; V
NSLP
= 5 V)
100
400
1000
A
normal slope mode; bus
recessive (V
INH
= V
BAT
;
V
LIN
= V
BAT
;
V
NWAKE
= V
BAT
;
V
TXD
= 5 V; V
NSLP
= 5 V)
100
400
1000
A
low slope mode; bus
dominant (V
BAT
= 12 V;
V
INH
= 12 V;
V
NWAKE
= 12 V;
V
TXD
= 0 V;
V
NSLP
= 5 V); note 3
1
3.5
8
mA
normal slope mode; bus
dominant (V
BAT
= 12 V;
V
INH
= 12 V;
V
NWAKE
= 12 V;
V
TXD
= 0 V;
V
NSLP
= 5 V); note 3
1
3.5
8
mA
Pin TXD
V
IH
HIGH-level input voltage
2
-
7
V
V
IL
LOW-level input voltage
-
0.3
-
+0.8
V
V
hys
TXD hysteresis voltage
0.03
-
0.5
V
R
TXD
TXD pull-down resistor
V
TXD
= 5 V
125
350
800
k
2002 Jul 17
11
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
I
IL
LOW-level input current
V
TXD
= 0 V
-
5
0
+5
A
I
OL
LOW-level output current
(local wake-up request)
standby mode;
V
NWAKE
= 0 V;
V
LIN
= V
BAT
;
V
TXD
= 0.4 V
1.5
3
-
mA
Pin NSLP
V
IH
HIGH-level input voltage
2
-
7
V
V
IL
LOW-level input voltage
-
0.3
-
+0.8
V
V
hys
NSLP hysteresis voltage
0.03
-
0.5
V
R
NSLP
NSLP pull-down resistor
V
NSLP
= 5 V
125
350
800
k
I
IL
LOW-level input current
V
NSLP
= 0 V
-
5
0
+5
A
Pin RXD (open-drain)
I
OL
LOW-level output current
normal slope mode;
V
LIN
= 0 V; V
RXD
= 0.4 V
1.3
3.5
-
mA
I
LH
HIGH-level leakage
current
normal slope mode;
V
LIN
= V
BAT
; V
RXD
= 5 V
-
5
0
+5
A
Pin NWAKE
V
IH
HIGH-level input voltage
V
BAT
-
1
-
V
BAT
+ 0.3
V
V
IL
LOW-level input voltage
-
0.3
-
V
BAT
-
3.3
V
I
IL
NWAKE pull-up current
V
NWAKE
= 0 V
-
30
-
10
-
3
A
I
LH
HIGH-level leakage
current
V
NWAKE
= 27 V;
V
BAT
= 27 V
-
5
0
+5
A
Pin INH
R
sw(INH)
switch-on resistance
between pins BAT and
INH
standby; low slope or
normal slope mode;
I
INH
=
-
15 mA;
V
BAT
= 12 V
-
30
50
I
LH
HIGH-level leakage
current
sleep mode;
V
INH
= 27 V; V
BAT
= 27 V
-
5
0
+5
A
Pin LIN
V
o(reces)
LIN recessive output
voltage
V
TXD
= 5 V; I
LIN
= 0 mA
0.9V
BAT
-
V
BAT
V
V
o(dom)
LIN dominant output
voltage
V
TXD
= 0 V;
V
BAT
= 8 to 27 V
0.6
-
0.15V
BAT
V
V
TXD
= 0 V; V
BAT
= 7.3 V 0.6
-
1.2
V
I
LH
HIGH-level leakage
current
V
LIN
= V
BAT
-
1
0
+1
A
I
IL
LIN pull-up current
sleep mode; V
LIN
= 0 V;
V
NSLP
= 0 V
-
2
-
5
-
10
A
R
SLAVE
slave termination
resistance to pin BAT
standby, low slope or
normal slope mode;
V
LIN
= 0 V; V
BAT
= 12 V
20
30
47
k
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2002 Jul 17
12
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
I
o(sc)
short-circuit output
current
V
LIN
= V
BAT
= 12 V;
V
TXD
= 0 V; t < t
dom
27
40
60
mA
V
LIN
= V
BAT
= 27 V;
V
TXD
= 0 V; t < t
dom
60
90
125
mA
V
th(rx)
receiver threshold
voltage
V
BAT
= 7.3 to 27 V
0.4V
BAT
-
0.6V
BAT
V
V
cntr(rx)
receiver centre voltage
V
BAT
= 7.3 to 27 V
0.475V
BAT
0.5V
BAT
0.525V
BAT
V
V
thr(hys)
receiver threshold
hysteresis voltage
V
BAT
= 7.3 to 27 V
0.145V
BAT
0.16V
BAT
0.175V
BAT
V
Thermal shutdown
T
j(sd)
shutdown junction
temperature
160
175
190
C
AC characteristics
t
d(TXD-BUSon/off)
TXD propagation delay
failure
normal slope mode;
C
L
= 10 nF; R
L
= 500
;
(see Fig.5)
t
PropTxDom
-
t
PropTxRec
-
2
0
+2
s
t
d(TXD-BUSon/off)
TXD propagation delay
failure
low slope mode;
C
L
= 10 nF; R
L
= 500
;
(see Fig.5)
t
PropTxDom
-
t
PropTxRec
-
5
0
+5
s
t
d(BUSon/off-RXD)
RXD propagation delay
failure
normal slope mode and
low slope mode; C
L
= 0;
R
L
=
; voltage on LIN
externally forced; LIN
slope time <500 ns;
C
RXD
= 20 pF;
R
RXD
= 2.4 k
; (see
Fig.5)
t
PropRxDom
-
t
PropRxRec
-
2
0
+2
s
t
f(slope)(dom)
fall time LIN
(100% to 0%)
normal slope mode;
C
L
= 10 nF; R
L
= 500
;
V
BAT
= 12 V; transition
from recessive to
dominant; note 4; (see
Fig.5)
-
16
27
s
t
r(slope)(rec)
rise time LIN
(0% to 100%)
normal slope mode;
C
L
= 10 nF; R
L
= 500
;
V
BAT
= 12 V; transition
from dominant to
recessive; note 5; (see
Fig.5)
-
16
27
s
t
slope(norm)
normal slope symmetry
normal slope mode;
C
L
= 10 nF; R
L
= 500
;
V
BAT
= 12 V;
t
f(slope)(dom)
-
t
r(slope)(rec)
-
5
0
+5
s
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2002 Jul 17
13
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
Notes
1. All parameters are guaranteed over the virtual junction temperature by design, but only 100% tested at 125
C
ambient temperature for dies on wafer level and above this for cased products 100% tested at 25
C ambient
temperature, unless otherwise specified.
2. For bare die, all parameters are only guaranteed if the backside of the bare die is connected to ground.
3. If V
BAT
is higher than 12 V, the battery current increases due to the internal LIN termination resistor. The minimum
value of this resistor is 20 k
. The maximum current increase is therefore:
4.
; see Fig.6
5.
; see Fig.6
t
f(slope)(norm)(dom)
normal slope fall time LIN
(100% to 0%)
normal slope mode;
C
L
= 6.8 nF; R
L
= 660
;
V
BAT
= 12 V; transition
from recessive to
dominant; note 4
-
12
22.5
s
t
r(slope)(norm)(rec)
normal slope rise time
LIN (0% to 100%)
normal slope mode;
C
L
= 6.8 nF; R
L
= 660
;
V
BAT
= 12 V; transition
from dominant to
recessive; note 5
-
12
22.5
s
t
slope(norm)
normal slope symmetry
normal slope mode;
C
L
= 6.8 nF; R
L
= 660
;
V
BAT
= 12 V;
t
f(slope)(dom)
-
t
r(slope)(rec)
-
4
0
+4
s
t
f(slope)(low)(dom)
low slope fall time LIN
(100% to 0%)
low slope mode;
C
L
= 10 nF; R
L
= 500
;
V
BAT
= 12 V; note 4
-
30
62
s
t
r(slope)(low)(rec)
low slope rise time LIN
(0% to 100%)
low slope mode;
C
L
= 10 nF; R
L
= 500
;
V
BAT
= 12 V; note 5
-
30
62
s
t
BUS
dominant time for
wake-up via bus
sleep mode
30
70
150
s
t
NWAKE
dominant time for
wake-up via pin NWAKE
sleep mode
7
20
50
s
t
gotonorm
time period for mode
change from sleep or
standby mode into
normal/low slope mode
2
5
10
s
t
gotosleep
time period for mode
change from normal/low
slope mode into sleep
mode
2
5
10
s
t
dom
TXD dominant time out
V
TXD
= 0 V
6
12
20
ms
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
I
BAT increase
(
)
V
BAT
12 V
20 k
--------------------------------
=
t
f(slope)(dom)
t
VLIN
40%
=
(
)
t
VLIN
95%
=
(
)
(
)
0.55
-------------------------------------------------------------------------------------
=
t
r(slope)(rec)
t
VLIN
60%
=
(
)
t
VLIN
5%
=
(
)
(
)
0.55
---------------------------------------------------------------------------------
=
2002 Jul 17
14
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
TIMING DIAGRAMS
handbook, full pagewidth
MGW323
50%
50%
TXD
RXD
VLIN
0%
5%
50%
tPropRxDom
tPropRxRec
tPropTxDom
tPropTxRec
0.5 VBAT
0.5 VBAT
100%
95%
t
50%
Fig.5 Timing diagram for AC characteristics, bus loaded.
handbook, full pagewidth
t
tslope(Rec)
MGU433
tslope(Dom)
VLIN
60%
5%
0%
40%
95%
100%
Fig.6 Definition of slope timing.
2002 Jul 17
15
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
APPLICATION INFORMATION
handbook, full pagewidth
BATTERY
ECU
8
1
4
2
3
6
(1)
5
MICROCONTROLLER
VDD
GND
INH
GND
RXD
NWAKE
only for
master node
LIN BUS
LINE
MGU244
1 k
LIN
TXD
NSLP
RX0
TX0
Px.x
BAT
7
TJA1020T
+
5 V/
+
3.3 V
Fig.7 Typical application of the TJA1020.
More information is available in a separate application note.
(1) C
master
= 1 nF; C
slave
= 220 pF.
handbook, full pagewidth
MGT992
RL
CL
CRXD
RRXD
100 nF
NWAKE
RXD
TXD
INH
LIN
NSLP
GND
BAT
TJA1020
Fig.8 Test circuit for AC characteristics.
2002 Jul 17
16
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
handbook, full pagewidth
MGT993
10
k
10
k
500
1 nF
10
F
INH
RXD
TXD
NWAKE
LIN
5 V
5 V
TRANSIENT
GENERATOR
NSLP
GND
BAT
TJA1020
Fig.9 Test circuit for automotive transients.
The waveforms of the applied transients on pin 6 (LIN) and pin 7 (BAT) are according to ISO7637 part 1, test pulses 1, 2, 3a, 3b, 4, 5, 6 and 7.
2002 Jul 17
17
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
BONDING PAD LOCATIONS
Table 2
Bonding pad locations (dimensions in
m). All x and y co-ordinates are referenced to the bottom left hand
corner of the die.
SYMBOL
PAD
CO-ORDINATES
x
y
RXD
1
111
1570
NSLP
2
111
1395
NWAKE
3
165
424
TXD
4
134
134
GND1
5A
1075
90
GND2
5B
1185
90
GND3
5C
1295
90
LIN
6
1318
419
BAT
7
1235
1133
INH
8
1125
1490
handbook, full pagewidth
MGW322
4
5A 5B 5C
3
7
6
8
1
2
0
0
x
y
Fig.10 Bonding pad locations.
2002 Jul 17
18
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03
MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.050
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
97-05-22
99-12-27
2002 Jul 17
19
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 220
C for
thick/large packages, and below 235
C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
2002 Jul 17
20
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
"(LF)BGA Application Note" (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
not suitable
suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable
(3)
suitable
PLCC
(4)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(4)(5)
suitable
SSOP, TSSOP, VSO
not recommended
(6)
suitable
2002 Jul 17
21
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DATA SHEET STATUS
(1)
PRODUCT
STATUS
(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
2002 Jul 17
22
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all
data sheet limits up to the point of wafer sawing for a
period of ninety (90) days from the date of Philips' delivery.
If there are data sheet limits not guaranteed, these will be
separately indicated in the data sheet. There are no post
packing tests performed on individual die or wafer. Philips
Semiconductors has no control of third party procedures in
the sawing, handling, packing or assembly of the die.
Accordingly, Philips Semiconductors assumes no liability
for device functionality or performance of the die or
systems after third party sawing, handling, packing or
assembly of the die. It is the responsibility of the customer
to test and qualify their application in which the die is used.
2002 Jul 17
23
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
NOTES
Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands
04/pp
24
Date of release:
2002 Jul 17
Document order number:
9397 750 10028
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