Specifications are subject to change without notice.
Thin Film on Silicon 2DTA High Performance Memory Bus Terminator
DT
A005
24Q
0036
Features
s
18 termination channels
s
Incorporates 36 bi-directional Schottky-
based diodes
s
Small form factor replaces 18 SOT23
packages
s
Low forward voltage (2 options available)
s
Very fast reverse recovery time
Applications
s
High speed synchronous DRAM, SGRAM,
SyncLink memory bus termination
s
High speed SRAM cache
s
100 MHz PCI and AGP bus termination
s
Local bus termination for all popular
microprocessors
General Information
The Model 2DTA Series High Performance
Memory Bus Terminator is well-suited for
high speed bus termination applications
where variable bus loading and very low
terminator power dissipation are required.
This very efficient high speed terminator
array is highly integrated and is very effective
for use in space constrained applications
such as PC notebooks and motherboards,
engineering workstations and portable
battery powered devices. Two performance
options are available. The higher grade
2DTA-5 with a maximum forward voltage of
0.75 V is suited for ultra-fast and dense
memory termination configurations. The
2DTA-10, with a maximum specified forward
voltage of 0.85 V is primarily targeted to
general purpose applications where board
space is critical.
Electrical Specifications
VDD .......................................-0.3 V to +7 V
Channel Clamp Current ..................50 mA
2DTA-5 Forward Voltage (Vf)
@ lf = 16 mA..........0.4 V typ., 0.65 V max.
@ lf = 50 mA..........0.5 V typ., 0.75 V max.
2DTA-10 Forward Voltage (Vf)
@ lf = 16 mA..........0.5 V typ., 0.75 V max.
@ lf = 50 mA........0.65 V typ., 0.85 V max.
Leakage Current
@ Max. VDD = ......0.1 A typ., 5 A max.
Diode Capacitance ......................5 pF max.
Diode Power Rating ...............20 mW/diode
Diode Ohmic Resistance ..............< 5 ohms
Charge Carrier Lifetime (tl) ........100 pS typ.
ESD Protection
(Mil-Std-883 Method 3015)........4 KV min.
Environmental Specifications
Operating Temperature.-55 C to +125 C
Storage Temp. Range...-65 C to +150 C
Physical Specifications
Standard Packages and Pin Counts
QSOP.............................................24 Pin
Dispensing
QSOP .......................3,500 pcs./13 " reel
56 pcs./tube
QSOP Package Power
Temperature Derating Curve
WATTS
AMBIENT TEMPERATURE ( C )
1.0
1.25
.75
.50
.25
2QSP24
0
50
75
100
125
150
25
Package Schematic
18
7
17
8
16
9
15
10
14
11
13
12
23
24
2
1
22
3
21
4
20
5
19
6
GND
GND
VDD
VDD
GND
VDD
Typical Part Marking
Represents total content. Layout may vary.
24Q
DTA-5
YYWW
PRODUCT
FUNCTION
PIN COUNT
PACKAGE STYLE
DATE CODE
MANUFACTURER'S
TRADEMARK
PIN 1 INDICATOR
(MOLDED INDENT)
How To Order
2 DTA-5 - Q 24 R
Product Class
Thin-Film-on-Silicon
Product Function
DTA = Memory Bus Terminator
Forward Voltage (Vf)
(See specifications)
Standard Package Style
Q = QSOP
Pin Count
Q = 24
Dispensing
R = Reel T = Tube
QSOP Package Dimensions
A
.635
(.025)
TYP.
3.81 - 3.99
(.150 - .157)
PIN 1
.21 - .31
(.008 - .012)
1.35 - 1.75
(.053 - .069)
.10 - .25
(.004 - .010)
0-8
.19 - .25
(.007 - .010)
.41 - 1.27
(.016 - .050)
5.80 - 6.20
(.228 - .244)
Model
A
2QSP24
8.56 - 8.74 (.337 - .344)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
Reliable Electronic Solutions
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COPYRIGHT 2002, BOURNS, INC. LITHO IN U.S.A. REV. 9/02 e/TF0201
09/02
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