Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Cautions
Keep safety first in your circuit designs!
1.
Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire
or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i)
placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or
mishap.
Notes regarding these materials
1.
These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation
product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any
other rights, belonging to Renesas Technology Corporation or a third party.
2.
Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,
originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in
these materials.
3.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents
information on products at the time of publication of these materials, and are subject to change by Renesas Technology
Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these
inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various means, including the
Renesas Technology Corporation Semiconductor home page (http://www.renesas.com).
4.
When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and
algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of
the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other
loss resulting from the information contained herein.
5.
Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used
under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an
authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for
any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea
repeater use.
6.
The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these
materials.
7.
If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license
from the Japanese government and cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is
prohibited.
8.
Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
Notice
When using this document, keep the following in mind:
1.
This document may, wholly or partially, be subject to change without notice.
2.
All rights are reserved: No one is permitted to reproduce or duplicate, in any form,
the whole or part of this document without Hitachi's permission.
3.
Hitachi will not be held responsible for any damage to the user that may result from
accidents or any other reasons during operation of the user's unit according to this
document.
4.
Circuitry and other examples described herein are meant merely to indicate the
characteristics and performance of Hitachi's semiconductor products. Hitachi
assumes no responsibility for any intellectual property claims or other problems that
may result from applications based on the examples described herein.
5.
No license is granted by implication or otherwise under any patents or other rights of
any third party or Hitachi, Ltd.
6.
MEDICAL APPLICATIONS: Hitachi's products are not authorized for use in
MEDICAL APPLICATIONS without the written consent of the appropriate officer
of Hitachi's sales company. Such use includes, but is not limited to, use in life
support systems. Buyers of Hitachi's products are requested to notify the relevant
Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Preface
The H8/3217 Series is a family of high-performance single-chip microcomputers ideally suited for
embedded control of industrial equipment. The chips are built around an H8/300 CPU core: a
high-speed processor. On-chip supporting modules provide ROM, RAM, four types of timers, I/O
ports, a serial communication interface, I
2
C bus interface, and host interface for easy
implementation of compact, high-speed control systems.
The H8/3217 Series offers a selection of on-chip memory.
H8/3217: 60-kbyte ROM; 2-kbyte RAM
H8/3216: 48-kbyte ROM; 2-kbyte RAM
H8/3214: 32-kbyte ROM; 1-kbyte RAM
H8/3212: 16-kbyte ROM; 512-byte RAM
The H8/3217 and H8/3214 chips are available with electrically programmable ROM.
Manufacturers can use the electrically programmable ZTATTM (Zero Turn-Around Time*) version
to get production off to a fast start and make software changes quickly.
This manual describes the H8/3217 Series hardware. Refer to the H8/300 Series Programming
Manual for a detailed description of the instruction set.
Note:
* ZTAT is a trademark of Hitachi, Ltd.
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