RN731V
Diodes
PIN diode
RN731V
!Applications
VHF/UHF band variable attenuators and AGC.
!Features
1) Small surface mounting type. (UMD2)
2) Low high-frequency forward resistance (r
F
) / low
capacitance (C
T
).
3) High reliability.
!Construction
Silicon diffusion junction
!
!
!
!External dimensions
(Units : mm)
2.50.2
1.70.1
1.250.1
CATHODE MARK
-
0.1
+
0.2
0.7
+
0.1
-
0.05
0.1
0.30.2
ROHM : UMD2
EIAJ : SC - 76
JEDEC : SOD - 323
There are two different markings.
9
2.50.2
1.70.1
1.250.1
CATHODE MARK
-
0.1
+
0.2
0.7
+
0.1
-
0.05
0.1
0.30.2
9
!
!
!
!Absolute maximum ratings
(Ta=25
C)
Parameter
Symbol
Limits
Unit
DC reverse voltage
V
R
50
V
DC forward current
I
F
50
mA
Power dissipation
100
mW
Junction temperature
Tj
125
C
Storage temperature
Tstg
-
55
+
125
C
Pd
!
!
!
!Electrical characteristics
(Ta=25
C)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Forward voltage
V
F
-
-
1.0
V
I
F
=50mA
Reverse current
I
R
-
-
100
nA
V
R
=50V
Capacitance between terminals
-
-
0.4
pF
V
R
=35V, f=1MHz
Forward operating resistance
r
F
-
-
7
I
F
=10mA, f=100MHz
C
T
RN731V
Diodes
!
!
!
!Electrical characteristic curves
(Ta=25
C)
1m
10m
100m
0
0.5
1.0
75C
125C
25C
-
25C
FORWARD CURRENT : I
F
(
A)
FORWARD VOLTAGE : V
F
(V)
Fig.1 Forward characteristics
1n
0
10
20
30
40
50
60
70
1p
10p
100p
10n
100n
125C
75C
25C
10
1
REVERSE : VOLTAGE : V
R
(V)
REVERSE CURRENT : I
R
(
A)
Fig.2 Reverse characteristics
10
20
30
0.1
0.2
0.3
0.4
0.5
0.7
1.0
f=1MHz
f=10MHz
REVERSE VOLTAGE : V
R
(V)
CAPACITANCE BETWEEN TERMINALS : C
T
(
pF)
Fig.3 Capacitance between
terminals characteristics (I)
0.1
0.2
0.3
0.4
0.5
0.7
1.0
100
200
300
400
500
600
V
R
=0V
V
R
=3V
HIGH FREQUENCY : f (MHz)
CAPACITANCE BETWEEN TERMINALS : C
T
(
pF)
Fig 4 Capacitance between
terminals characteristics (II)
0.1
1.0
10
100
1.0
10
FORWARD CURRENT : I
F
(mA)
DYNAMIC FOWARD RESISTANCE : r
F
(
)
Fig.5 High frequency characteristics
f=100MHz
f=10MHz
f=1MHz
20
10
10
100
1000
I
F
=2mA
FORWARD CURRENT : f (MHz)
DYNAMIC FORWARD RESISTANCE : r
F
(
)
Fig.6 Forward operating
resistance characteristics
0
0
20
40
60
80
100
25
50
75
100
125
Io CURRENT (%)
AMBIENT TEMPERATURE : Ta (C)
Fig.7 Derating curve
(mounting on glass epoxy PCBs)
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