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Электронный компонент: SD12

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PROTECTION PRODUCTS
1
www.semtech.com
PROTECTION PRODUCTS
SD05 & SD12
Single Line TVS Diode for ESD
Protection in Portable Electronics
Description
Features
Schematic & PIN Configuration
Revision 9/2000
Applications
Mechanical Characteristics
The SDxx TVS diodes are designed to replace multilayer
varistors (MLVs) in portable applications such as cell
phones, notebook computers, and PDAs. They offer
superior electrical characteristics such as lower clamp-
ing voltage and no device degradation when compared
to MLVs. The SDxx series TVS diodes are designed to
protect sensitive semiconductor components from
damage or upset due to electrostatic discharge (ESD)
and other voltage induced transient events.
The SDxx is in a SOD-323 package and will protect one
unidirectional line. They are available with working
voltages of 5 volts (SD05) and 12 volts (SD12). These
devices will fit on the same PCB pad area as an 0805
MLV device. They give the designer the flexibility to
protect one line in applications where arrays are not
practical. Additionally, it may be sprinkled around the
board in applications where board space is at a pre-
mium.
They may may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV
contact discharge).
u
350 Watts peak pulse power (tp = 8/20s)
u
Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
IEC 61000-4-5 (Lightning) 24A (tp = 8/20s)
u
Small package for use in portable electronics
u
Suitable replacement for MLVs in ESD protection
applications
u
Protects one I/O or power line
u
Low clamping voltage
u
Working voltages: 5V & 12V
u
Low leakage current
u
Solid-state silicon-avalanche technology
u
EIAJ SOD-323 package
u
Molding compound flammability rating: UL 94V-0
u
Marking : Marking code, cathode band
u
Packaging : Tape and Reel per EIA 481
u
Cell Phone Handsets and Accessories
u
Microprocessor based equipment
u
Personal Digital Assistants (PDAs)
u
Notebooks, Desktops, & Servers
u
Portable Instrumentation
u
Pagers Peripherals
1
2
SOD-323 (Top View)
2
2000 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SD05 & SD12
Absolute Maximum Rating
Electrical Characteristics
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3
2000 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SD05 & SD12
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
0
10
20
30
40
50
60
70
80
90
100
110
0
25
50
75
100
125
150
Ambient Temperature - T
A
(
o
C)
% of Rated Power or I
PP
Clamping Voltage vs. Peak Pulse Current
0
10
20
30
40
50
60
70
80
90
100
110
0
5
10
15
20
25
30
Time (
s)
Percent of I
PP
e
-t
td = I
PP
/2
Waveform
Parameters:
tr = 8
s
td = 20
s
Pulse Waveform
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Peak Pulse Current - I
PP
(A)
Cl
am
pi
ng Vol
t
age -
V
C
(V
)
SD12
SD05
Waveform
Parameters:
tr = 8
s
td = 20
s
0.01
0.1
1
10
0.1
1
10
100
1000
Pulse Duration - tp (
s)
P
eak P
u
l
se P
o
wer - P
PP
(kW)
4
2000 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SD05 & SD12
Device Connection Options
The SDxx TVS diodes are designed to protect one data,
I/O, or power supply line. The device is designed to
replace multi-layer varistors (MLVs) in portable
applications. It is easily implemented on existing 0805
MLV pads and is only slightly larger than 0603 MLV
pads. The device is unidirectional and may be used on
lines where the signal polarity is above ground. The
cathode band should be placed towards the line that is
to be protected.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended (Refer to application note
SI99-01 for more detailed information):
l
Place the TVS near the input terminals or
connectors to restrict transient coupling.
l
Minimize the path length between the TVS and
the protected line.
l
The ESD transient return path to ground should
be kept as short as possible.
l
Place a TVS & decoupling capacitor between
power and ground of components that may be
vulnerable to electrostatic discharges to the
ground plane.
l
Minimize all conductive loops including power
and ground loops.
l
Use multilayer boards when possible.
l
Minimize interconnecting line lengths
l
Never run critical signals near board edges.
l
Fill unused portions of the PCB with ground
plane.
Device Schematic & Pin Configuration
Size Comparison to 0805 MLV
SOD-323
0805 MLV
Note: Nominal dimensions in inches
Component Placement Comparison
0805 MLV on
SOD-323 on 0805
MLV Pad
SOD-323 on Recommended
(SOD-323) Solder Pad
0805 Solder Pad
Applications Information
5
2000 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SD05 & SD12
Land Pattern - SOD-323
Outline Drawing - SOD-323