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Электронный компонент: SD12C

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PROTECTION PRODUCTS
1
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SD05C THRU SD24C
Single Line TVS Diode for ESD
Protection in Portable Electronics
Description
Features
Schematic & PIN Configuration
Revision 9/2000
Applications
Mechanical Characteristics
The SDxxC TVS diodes are designed to replace multi-
layer varistors (MLVs) in portable applications such as
cell phones, notebook computers, and PDAs. They
offer superior electrical characteristics such as lower
clamping voltage and no device degradation when
compared to MLVs. The SDxxC series TVS diodes are
designed to protect sensitive semiconductor compo-
nents from damage or upset due to electrostatic
discharge (ESD) and other voltage induced transient
events.
The SDxxC is in a SOD-323 package and will protect
one bidirectional line. They are available with working
voltages of 5 - 24 volts. These devices will fit on the
same PCB pad area as an 0805 MLV device. They give
the designer the flexibility to protect one line in applica-
tions where arrays are not practical. Additionally, it
may be sprinkled around the board in applications
where board space is at a premium.
They may may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV
contact discharge).
u
350 Watts peak pulse power (tp = 8/20s)
u
Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 24A (8/20s)
u
Small package for use in portable electronics
u
Suitable replacement for MLVs in ESD protection
applications
u
Protects one I/O or power line
u
Low clamping voltage
u
Working voltages: 5V, 12V, 15V, 24V
u
Low leakage current
u
Solid-state silicon avalanche technology
u
EIAJ SOD-323 package
u
Molding compound flammability rating: UL 94V-0
u
Marking : Marking code
u
Packaging : Tape and Reel per EIA 481
u
Cell Phone Handsets and Accessories
u
Microprocessor based equipment
u
Personal Digital Assistants (PDAs)
u
Notebooks, Desktops, & Servers
u
Portable Instrumentation
u
Pagers
u
Peripherals
SOD-323 (Top View)
1
2
2
2000 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SD05C THRU SD24C
Absolute Maximum Rating
Electrical Characteristics
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3
2000 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SD05C THRU SD24C
Electrical Characteristics (Continued)
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1
=
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0
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0
5
F
p
4
2000 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SD05C THRU SD24C
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
0
10
20
30
40
50
60
70
80
90
100
110
0
25
50
75
100
125
150
Ambient Temperature - T
A
(
o
C)
% of Rated Power or I
PP
Clamping Voltage vs. Peak Pulse Current
0
10
20
30
40
50
60
70
80
90
100
110
0
5
10
15
20
25
30
Time (
s)
Percent of I
PP
e
-t
td = I
PP
/2
Waveform
Parameters:
tr = 8
s
td = 20
s
Pulse Waveform
0.01
0.1
1
10
0.1
1
10
100
1000
Pulse Duration - tp (
s)
P
eak P
u
l
se P
o
wer - P
PP
(kW)
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Peak Pulse Current -Ipp (A)
Cl
amp
i
n
g
V
o
l
t
ag
e -
V
c
(
V
)
Waveform
Parameters:
tr = 8
s
td = 20
s
SD05C
SD12C
5
2000 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SD05C THRU SD24C
Device Connection Options
The SDxxC TVS diodes are designed to protect one
data, I/O, or power supply line. The device is designed
to replace multi-layer varistors (MLVs) in portable
applications. It is easily implemented on existing 0805
MLV pads and is only slightly larger than 0603 MLV
pads. The device is bidirectional and may be used on
lines where the signal polarity is above and below
ground. The device is symmetrical, so there is no
cathode band.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended (Refer to application note
SI99-01 for more detailed information):
l
Place the TVS near the input terminals or
connectors to restrict transient coupling.
l
Minimize the path length between the TVS and
the protected line.
l
The ESD transient return path to ground should
be kept as short as possible.
l
Place a TVS & decoupling capacitor between
power and ground of components that may be
vulnerable to electrostatic discharges to the
ground plane.
l
Minimize all conductive loops including power
and ground loops.
l
Use multilayer boards when possible.
l
Minimize interconnecting line lengths
l
Never run critical signals near board edges.
l
Fill unused portions of the PCB with ground
plane.
Device Schematic & Pin Configuration
Size Comparison to 0805 MLV
SOD-323
0805 MLV
Note: Nominal dimensions in inches
Component Placement Comparison
0805 MLV on
SOD-323 on 0805
MLV Pad
SOD-323 on Recommended
(SOD-323) Solder Pad
0805 Solder Pad
Applications Information