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Электронный компонент: SMS05C

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1
www.semtech.com
PROTECTION PRODUCTS
SMS05C THRU SMS24C
TVS Diode Array
For ESD and Latch-Up Protection
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Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 24A (8/20s)
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Small package for use in portable electronics
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Protects five I/O lines
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Working voltages: 5V, 12V, 15V and 24V
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Low leakage current
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Low operating and clamping voltages
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Solid-state silicon avalanche technology
Description
Features
Circuit Diagram
Schematic & PIN Configuration
Revision 9/2000
Applications
Mechanical Characteristics
The SMS series of TVS arrays are designed to protect
sensitive electronics from damage or latch-up due to
ESD and other voltage-induced transient events. Each
device will protect up to five lines. They are available
with operating voltages of 5V, 12V, 15V and 24V. They
are unidirectional devices and may be used on lines
where the signal polarities are above ground.
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-
sectional area junctions for conducting high transient
currents. They offer desirable characteristics for board
level protection including fast response time, low
operating and clamping voltage and no device degrada-
tion.
The SMS series devices may be used to meet the
immunity requirements of IEC 61000-4-2, level 4. The
low cost SOT23-6L package makes them ideal for use
in portable electronics such as cell phones, PDAs, and
notebook computers.
SOT23-6L (Top View)
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EIAJ SOT23-6L package
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Molding compound flammability rating: UL 94V-0
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Marking : Marking Code
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Packaging : Tape and Reel per EIA 481
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Cell phone Handsets and Accessories
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Microprocessor Based Equipment
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Personal Digital Assistants (PDAs)
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Notebooks, Desktops, and Servers
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Portable Instrumentation
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Set Top Box
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Peripherals
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MP3 Players
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Cordless Phones
2
2000 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SMS05C THRU SMS24C
Absolute Maximum Rating
Electrical Characteristics
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3
2000 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SMS05C THRU SMS24C
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Electrical Characteristics (Continued)
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4
2000 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SMS05C THRU SMS24C
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
0
10
20
30
40
50
60
70
80
90
100
110
0
5
10
15
20
25
30
Time (
s)
Percent of I
PP
e
-t
td = I
PP
/2
Waveform
Parameters:
tr = 8
s
td = 20
s
Pulse Waveform
Forward Voltage vs. Forward Current
0
10
20
30
40
50
60
70
80
90
100
110
0
25
50
75
100
125
150
Ambient Temperature - T
A
(
o
C)
%
of
R
a
t
e
d P
o
wer or I
PP
0
5
10
15
20
25
30
35
40
45
0
5
10
15
20
25
30
Peak Pulse Current - I
PP
(A)
Clamping Voltage - V
C
(V)
SMS12C
SMS05C
Waveform
Parameters:
tr = 8
s
td = 20
s
SMS15C
SMS24C
Clamping Voltage vs. Peak Pulse Current
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
5
10
15
20
25
30
35
40
45
Forward Current - I
F
(A)
Forward Voltage - V
F
(V)
Waveform
Parameters:
tr = 8
s
td = 20
s
0.01
0.1
1
10
0.1
1
10
100
1000
Pulse Duration - tp (
s)
P
eak P
u
l
se P
o
wer - P
PP
(kW)
5
2000 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
SMS05C THRU SMS24C
SMSxxC Circuit Diagram
Protection of Five Unidirectional Lines
Device Connection for Protection of Five Data Lines
The SMSxxC is designed to protect up to five unidirec-
tional data lines. The device is connected as follows:
1. Unidirectional protection of five I/O lines is
achieved by connecting pins 1, 3, 4, 5 and 6 to the
data lines. Pin 2 is connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
l
Place the SMSxxC near the input terminals or
connectors to restrict transient coupling.
l
Minimize the path length between the SMSxxC and
the protected line.
l
Minimize all conductive loops including power and
ground loops.
l
The ESD transient return path to ground should be
kept as short as possible.
l
Never run critical signals near board edges.
l
Use ground planes whenever possible.
Applications Information