GL100MN
x
MP
Series
GL100MN
x
MP Series
1. Compact and thin package
2. Surface mount type
3. 2-way mounting ; top view/side view
4. Reflow soldering
5. High output type :
GL100MN1MP
6. General purpose type :
GL100MN0MP
Pair use with
PT100MC0MP
/
PT100MF0MP
is recommended
Compact, Surface Mount Type
Infrared Emitting Diode
s
Features
1. Touch panel for ATM
2. Touch panel for Car navigation system
3. Touch panel for FA equipment
s
Applications
s
Absolute Maximum Ratings
s
Outline Dimensions
(Unit : mm)
Parameter
Symbol
Rating
Unit
Forward current
50
mA
6
V
0.5
A
75
mW
-
30 to
+
85
C
Storage temperature
-
40 to
+
95
C
240
C
Operating temperature
Reverse voltage
Power dissipation
I
F
V
R
Peak forward current
I
FM
P
T
stg
T
opr
(Ta
=
25
C)
Soldering temperature
T
sol
*1
*2
*1 Pulse width 100
s, duty 0.01
*2 Max. 10s
1
2
Anode
Cathode
3
2.2
3
3
1.5
1.5
1.1
1.1
1.4
0.85
1.7
1.1
1.1
1.5
1.5
(0.2)
0.4
2.2
1
(0.65)
0.75
R0.8
(0.56)
(1)
(1)
(0.56)
1
1
2
2
g
Unspecified tolerance :
0.2mm
g
( ) : Reference dimensions
Au-plated area
(Lens center)
Please pay attention not to make circuit pattern in area.
Pattern example seeing
from PCB (Side view)
Pattern example seeing
from PCB (Top view)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
GL100MN
x
MP Series
s
Electro-optical Characteristics
e
e
p
Peak emission wavelength
Half intensity wave length
Parameter
Symbol
Unit
Forward voltage
V
F
V
F
V
V
pF
kHz
V
FM
A
Peak forward voltage
I
R
Ct
fc
mW
mW
Reverse current
Radiant flux
MIN.
-
-
1.0
-
-
4.0
10
3.0
6.0
-
-
MAX.
-
1.4
GL100MN0MP
GL100MN1MP
TYP.
-
-
-
940
45
2.0
-
-
50
-
-
300
-
10
1.2
V
-
1.5
1.2
3.0
-
(Ta
=
25C)
GL100MN0MP
GL100MN1MP
Terminal capacitance
Response frequency
Half intensity angle
V
R
=
3V
I
F
=
20mA
I
F
=
20mA
I
F
=
20mA
I
F
=
20mA
I
F
=
5mA
V
R
=
0, f
=
1MHz
I
F
=
5mA
I
FM
=
0.5A
Conditions
-
-
nm
nm
F
o
r
w
a
r
d
c
u
r
r
e
n
t
I
F
(
m
A
)
0
10
20
30
40
50
60
-
25
0
25
75
100
85
50
Ambient temperature T
a
(
C)
P
e
a
k
f
o
r
w
a
r
d
c
u
r
r
e
n
t
I
F
M
(
m
A
)
10
100
1000
500
1
10
-
4
10
-
3
10
-
2
10
-
1
1
Duty ratio
Pulse width
<=
100
s
T
a
=
25
C
Fig.2 Peak Forward Current vs. Duty Ratio
Fig.4 Spectral Distribution
Fig.1 Forward Current vs. Ambient
Temperature
R
e
l
a
t
i
v
e
r
a
d
i
a
n
t
i
n
t
e
n
s
i
t
y
(
%
)
0
20
40
60
80
100
860
900
940
980
1020
880
920
960
1000
1040
Wavelength
(nm)
I
F
=
5mA
Ta
=
25
C
GL100MN0MP
R
e
l
a
t
i
v
e
r
a
d
i
a
n
t
i
n
t
e
n
s
i
t
y
(
%
)
0
20
40
60
80
100
860
900
940
980
1020
880
920
960
1000
1040
Wavelength
(nm)
I
F
=
5mA
Ta
=
25
C
GL100MN1MP
Fig.3 Spectral Distribution
GL100MN
x
MP Series
I
F
=
const.
R
e
l
a
t
i
v
e
r
a
d
i
a
n
t
f
l
u
x
(
%
)
0.1
1
10
-
50
-
25
-
30
0
25
50
85
75
100
Ambient temperature T
a
(
C)
GL100MN0MP
920
930
940
950
960
970
980
-
50
-
25
-
30
0
25
50
75 85 100
P
e
a
k
e
m
i
s
s
i
o
n
w
a
v
e
l
e
n
g
t
h
p
(
n
m
)
Ambient temperature T
a
(
C)
I
F
=
const.
GL100MN1MP
I
F
=
const.
R
e
l
a
t
i
v
e
r
a
d
i
a
n
t
f
l
u
x
(
%
)
0.1
1
10
-
50
-
25
-
30
0
25
50
85
75
100
Ambient temperature T
a
(
C)
GL100MN1MP
920
930
940
950
960
970
980
-
50
-
25
-
30
0
25
50
75 85 100
P
e
a
k
e
m
i
s
s
i
o
n
w
a
v
e
l
e
n
g
t
h
p
(
n
m
)
Ambient temperature T
a
(
C)
I
F
=
const.
GL100MN0MP
Fig.9 Relative Radiant Flux vs. Ambient
Temperature
Fig.10 Relative Radiant Flux vs. Ambient
Temperature
Fig.6 Peak Emission Wavelength vs.
Ambient Temperature
Fig.5 Peak Emission Wavelength vs.
Ambient Temperature
F
o
r
w
a
r
d
c
u
r
r
e
n
t
I
F
(
m
A
)
0.1
1
10
100
1000
0
0.5
1
1.5
2
2.5
3
Forward voltage V
F
(V)
T
a
=
85
C
50
C
25
C
0
C
-
30
C
GL100MN0MP
F
o
r
w
a
r
d
c
u
r
r
e
n
t
I
F
(
m
A
)
0.1
1
10
100
1000
0
0.5
1
1.5
2
2.5
3
Forward voltage V
F
(V)
T
a
=
85
C
50
C
-
30
C
0
C
25
C
GL100MN1MP
Fig.7 Forward Current vs. Forward
Voltage
Fig.8 Forward Current vs. Forward
Voltage
GL100MN
x
MP Series
Fig.12 Radiant Flux vs. Forward
Current
R
e
l
a
t
i
v
e
o
u
t
p
u
t
(
%
)
0.01
0.1
1
10
100
0.1
1
10
100
1000
Distance to detector d (mm)
I
F
=const.
T
a
=
25
C
Distance combine GL100MN0 (1) MP
and PT100MC (F) 0MP
Fig.13 Relative Output vs. Distance To
Detector
Fig.11 Radiant Flux vs. Forward
Current
0
-
10
0
+
10
+
20
-
20
-
30
-
40
-
50
-
60
-
70
-
80
-
90
+
30
+
40
+
50
+
60
+
70
+
80
+
90
Angular displacement
100
80
60
40
20
R
e
l
a
t
i
v
e
r
a
d
i
a
n
t
i
n
t
e
n
s
i
t
y
(
%
)
T
a
=
25
C
0.01
100
10
1
0.1
1
100
10
1000
Ta
=
25
C
R
a
d
i
a
n
t
f
l
u
x
e
(
m
W
)
Forward current I
F
(mA)
Pulse
(Pulse width
<=
100
s)
GL100MN0MP
0.1
100
10
1
1
100
10
1000
Ta
=
25
C
R
a
d
i
a
n
t
f
l
u
x
e
(
m
W
)
Forward current I
F
(mA)
GL100MN1MP
Pulse
(Pulse width
<=
100
s)
Fig.14 Radiation Diagram (Typical Value)
25
C
165
C
MAX.
200
C
240
C
MAX.
120s
MAX.
90s
MAX.
60s
MAX.
10s
MAX.
Only one time soldering is recommended within the temperature
profile shown below.
1 to 4
C/s
1 to 4
C/s
1 to 4
C/s
Fig.15 Reflow Soldering
115
Application Circuits
NOTICE
qThe circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
qContact and consult with a SHARP representative if there are any questions about the contents of this
publication.
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