I
F
60
mA
I
FM
A
V
R
V
T
opr
C
T
stg
C
T
sol
260
C
(Ta=25C)
(Ta=25 C)
(2.54)
0.6
1
2
V
F
I
F
= 50mA
-
V
V
FM
I
FM
= 0.5A
-
2.2
V
I
R
V
R
= 3V
-
-
10
A
I
E
I
F
= 50mA
-
mW/sr
I
F
-
-
nm
I
F
-
-
nm
f
C
-
-
I
F
= 20mA
-
-
3.8
3.0
0.15
0.8
MAX.
5.3
0.2
2
-
0.5
+
0.15
-
0.1
2
-
0.5
+
0.15
-
0.1
Features
Applications
Absolute Maximum Ratings
Outline Dimensions
(Unit : mm)
0.5
MIN.
14.2
1.0
Parameter
Symbol Rating
Unit
Forward current
Peak forward current
Reverse voltage
Operating temperature
Storage temperature
Soldering temperature
*3
I
E
: Value obtained by converting the value in power of radiant fluxes emitted at the solid angle of 0.01 sr (steradian) in the direction of mechanical axis of
the lens portion into 1 sr or all those emitted from the light emitting diode.
Parameter
Peak forward voltage
Forward voltage
Reverse voltage
Peak emission wavelength
Half intensity wavelength
Half intensity angle
Response frequency
*3
Radiant intensity
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
- 25 to + 85
- 40 to + 85
GL382
GL382
IrDA-Based SIR System-Conforming
Infrared Emitting Diode
0.5
4
*2 For 3 seconds at the position of 2.6 mm from the resin edge
*1 Pulse width <= 100
s, Duty ratio=0.01
= 50mA
= 50mA
I
F
=50mA+10mA
p-p
6
12
17
MHz
*2
*1
1. Compact 3
resin mold package
2. Peak emitting wavelength conforming to SIR system based on IrDA
(
p=880 nm [I
F
=50mA])
3. Narrow beam angle
(Half intensity angle : TYP. 17 )
4. High speed response
(Cut-off frequency fc : TYP.12MHz)
1. Portable information terminal equipment
2. Personal computers
3. Printers
1.5
18
880
40
1.7
3.8
Electro-optical Characteristics
P
2
2 Cathode
1
1 Anode
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.
"
"
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
s
s
s
s
s
*
Tolerance
:
0.2mm
3.6
100
0
20
40
60
80
120
0
25
125
50
75 85
100
100
10
10 - 3
10 - 2
50
500
10 - 1
FM
(
mA
)
- 25
10 - 4
p
(
nm
)
F
(
mA
)
F
(V)
1
Fig. 1 Forward Current vs. Ambient
Temperature
Fig. 5 Forward Current vs. Forward Voltage
Fig. 2 Peak Forward Current vs. Duty Ratio
Fig. 4 Peak Emission Wavelength vs.
Ambient Temperature
Fig. 6 Relative Radiant Flux vs. Ambient
Temperature
(
mA
)
F
Forward current I
Ambient temperature T
a
(C)
Relative radiant intensity (%)
Wavelength
(nm)
Forward current I
Forward voltage V
Peak forward current I
Duty ratio
Peak emission wavelength
Ambient temperature T
a
(C)
Ambient temperature T
a
(C)
GL382
Fig. 3 Spectral Distribution
Relative radiant flux
Pulse width
T
a
= 25C
5 000
1 000
<=100
s
750
0
50
100
800
850
900
950
- 25
0
25
50
75 85
860
870
880
890
900
910
I
F
=const
- 25C
0C
25C
50C
Ta = 75C
0
0.5
1
2
3
1.5
2.5
3.5
1
10
100
1 000
I
F
= const
- 25
25
50
75 85
0
0.1
0.2
0.5
1
2
5
10
115
Application Circuits
NOTICE
qThe circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
qContact and consult with a SHARP representative if there are any questions about the contents of this
publication.
PDF 
ZIP