Notice
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
LED
Lamp
GM4BC13300AC/GM4GC13300AC
High-luminosity(InGaN) Leadless Chip LED
GM4BC13300AC/GM4GC13300AC
(Under development)
2713 Size, 1.2mm Thickness, Side
Emitting Leadless Chip LED
s
Outline Dimensions
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,,,,
,,
(1.125)
(1.025)
(0.075)
1.2
0.2
1.05
(0.675)
(0.675)
(0.425)
1.3
2.7
(0.95)
0.5
1
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,,,
,
R0.3
,
,,,
,,
2
1
2
,
,,,
,,
,
,,
,,
,,,
,,
,,
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,,
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,,,
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,
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,
Device center
Recommended PWB pattern for soldering
White resin
Green resist
Cathode mark
1.Plating area
Resist
2.Pin connections
1
Anode
2
Cathode
3.Unspecified tolerance:
0.1
1.3
1.3
1.2
1.4
GM4GC13300AC
GM4BC13300AC
Green
Blue
InGaN
InGaN
20
20
290
290
40
40
5
5
-20 to +80
-20 to +80
-40 to +85
-40 to +85
Model No. Radiation color Radiation material
Forward current
I
F
(mA)
Peak forward current
I
FM
*1
(mA)
Operating temperature
T
opr
(C)
Storage temperature
T
stg
(C)
Soldering temperature
T
sol
*2
(C)
Reverse voltage
V
R
(V)
(T
a
=25C)
*1 Duty ratio=1/10, Pulse width=0.1ms
*2 For 3s or less at the temperature (290C) of hand soldering. Temperature of reflow soldering is shown on the page 7.
s
Absolute Maximum Ratings
GM4GC13300AC
GM4BC13300AC
3.2
3.2
523
468
(25)
(7)
(525)
(470)
--
--
(I
F
=10mA,T
a
=25C)
Model No.
Lens type
Forward voltage
V
F
(V)
p
(nm)
TYP
I
V
(mcd)
TYP
d
(nm)
TYP
Peak emission
wavelength
Luminous
intensity
Dominant
wavelength
Page for
characteristics
diagrams
TYP
Colorless
transparency
s
Electro-optical Characteristics
(Unit : mm)
General
Description
7
Notice
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
General Description of Light Emitting Diodes
s
Mounting to a PWB
Design the product so that the devices will not be mounted in the same direction
as the warp of the PWB.
s
Soldering Conditions
Solder the lead pins under the following conditions.
In manual soldering, do not move the lead pins with the soldering edge.
Avoid applying excessive solder reinforcement.
In using surface mount type numeric LEDs, please refer to the specification
sheet because conditions shall be changed.
Do not try to correct the position of the devices after soldering.
Do not warp PWB after soldering.
s
Cleaning
(1) Solvents
The package resin may be penetrated by solvents used in cleaning. Refer to the
table below for usable solvents.
TM : Acceptable
: Not acceptable
(Notes)There is a world-wide movement to restrict the use of chrolofluorocarbon (CFC)
based solvents and we recommend that you avoid their use. However, before
using a CFC substitute solvent, carefully check that it will not penetrate the
package resin.
(2) Cleaning Methods
TM : Acceptable
: Acceptability depends on device type and conditions
(Notes)The affect on the device from ultrasonic cleaning differs depending on the size
of the cleaning bath, ultrasonic output, duration, board size and device mounting
method. Test the cleaning method under actual conditions and check for
abnormalities before actual use.
Please contact our representative before using a cleaning solvent or method not
given above.
Since the device is very small, it may be damaged by excessive stress. So, pay
special attention to the transport method and handling.
Cleaning Method
Solvent cleaning
Ultrasonic cleaning
Usable
Remarks
Immersion up to one minute at room temperature
Test the cleaning under actual conditions and
check for abnormalities before actual use.
TM
v
TM
TM
Solvent
Usable
Ethyl alcohol
Isopropyl alcohol
Chlorosen
Acetone
Trichloroethylene
Not acceptable
Not acceptable
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,
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,,
,,
,
Not acceptable
Acceptable
Type of Soldering
Conditions
1. Manual soldering
2. Reflow soldering
300C
5C within 5 seconds
Preheating 100C to 150C within 2 minutes
Soldering 245C
5C within 5 seconds
Gradual cooling (Avoid quenching)
Within 5 s
Within 2 min.
30 s
245
200
150
100
0
T
emper
ature(C)
Not acceptable
Acceptable
E: Chip LED Device Type
v
115
Application Circuits
NOTICE
qThe circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
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qContact and consult with a SHARP representative if there are any questions about the contents of this
publication.
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