PQ1Xxx1M2ZP
Series
PQ1Xxx1M2ZP Series
s
Model Line-up
s
Outline Dimensions
(Unit : mm)
s
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Input voltage
9
V
350
mW
V
9
150
C
-
30 to
+
80
C
Junction temperature
V
IN
Output control voltage
V
C
300
mA
Output current
I
O
T
j
(Ta
=
25
C)
Operating temperature
Storage temperature
Soldering temperature
T
opr
-
55 to
+
150
C
T
stg
260 (10s)
C
T
sol
*1
*1
Power dissipation
P
D
*2
*3
*1 All are open except GND and applicable terminals, refer to Fig.3
*2 At mounting PCB
*3 Overheat protection may operate at the condition T
j
:125
C to 150
C
1. Cellular phones
2. Cordless phones
3. Personal information tools
4. Cameras/Camcoders
5. PCMCIA cards for notebook PCs
s
Features
s
Applications
Compact, Low Output Current
Low Power-Loss Voltage
Regulators
1. Compact surface mount package (2.9
1.6
1.1mm)
2. Low power-loss
(Dropout voltage:TYP. 0.11 V/MAX. 0.26V at I
O
=
60mA)
3. Possible to use a ceramic capacitor for an external
smoothing capacitor
4. High ripple rejection (TYP. 70dB)
5. Low dissipation current
(Dissipation current at no load:TYP. 150
A)
6. Built-in ON/OFF control function
(Dissipation current at OFF-state:MAX. 1
A)
7. Built-in overcurrent and overheat protection functions
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
0.2
MIN.
0.2
MIN.
0 to 0.1
X 3 0
(1.9)
(0.95)
(0.95)
3.3
MAX.
(2.9
TYP.
excluding
remaining gate)
(0.3)
1.3
MAX
15
MAX.
Control circuit
1
2
3
5
4
5
4
1
2
3
5-0.4
0.1
1.6
0.2
2.8
0.3
0.15
0.1
1.1
0.2
( ) : Typical dimensions
1
2
3
4
5
V
IN
GND
V
C
Nr
V
O
Output Voltage (TYP.)
Model No.
Output Voltage (TYP.)
Model No.
2.5V
2.8V
3.0V
3.3V
3.6V
PQ1X251M2ZP
PQ1X281M2ZP
PQ1X301M2ZP
PQ1X331M2ZP
PQ1X361M2ZP
3.8V
4.0V
4.2V
4.5V
5.0V
PQ1X381M2ZP
PQ1X401M2ZP
PQ1X421M2ZP
PQ1X451M2ZP
PQ1X501M2ZP
PQ1Xxx1M2ZP Series
Parameter
Symbol
Conditions
I
op
-
R
eg
L1
R
eg
L2
R
eg
L3
R
eg
I
T
C
V
O
RR
Unit
MAX.
TYP.
MIN.
-
-
-
-
-
180
-
-
-
-
I
O
=
5 to 60mA
I
O
=
5 to 100mA
I
O
=
5 to 150mA
V
IN
=
V
O
(TYP)
+
1V to V
O
(TYP)
+
6V(MAX. 9.0V)
I
O
=
10mA, T
j
=-
25 to
+
75C
Refer to Fig.2
300
10
3.0
0.05
-
0.26
0.11
-
0.4
0.20
70
50
-
-
150
20
-
(Unless otherwise specified, V
IN
=
V
O
(TYP)
+
1.0V, I
O
=
30mA, V
C
=
1.8V,
Ta=25C)
V
mA
mA
mV
-
20
100
mV
-
40
160
mV
mV
mV/
C
dB
V
Output peak current
V
O
Output voltage
Recommended output current
Load regulation
Line regulation
Temperature coefficient of output voltage
Ripple rejection
Output noise voltage
V
I-O
1
Dropout voltage
V
I-O
2
V
no (rms)
10Hz
<
f
<
100kHz, C
n
=
0.1
F, I
O
=
30mA
*6
*4
I
O
=
60mA
*5
I
O
=
150mA
*5
Refer to the following table.2
Refer to the following table.1
ON-state voltage for control
OFF-state voltage for control
Output OFF-state consumption current
ON-state current for control
V
C (ON)
I
C (ON)
V
C (OFF)
I
qs
Quiescent current
I
q
-
5
-
-
-
150
-
V
C
=1.8V
-
I
O
=0mA
V
C
=0.2V
1.8
-
-
30
0.4
200
-
V
A
V
A
V
A
-
1
*4 Output current shall be the value when output voltage lowers 0.3V from the voltage at I
O
=
30mA
*5 Input voltage when output voltage falls 0.1V from that at Vin
=
Vo(TYP)
+
1.0V.
*6 In case that the control terminal ( 3 pin) is non-connection, output voltage should be OFF state.
s
Electrical Characteristics
Model No.
Symbol MIN.
TYP.
MAX.
Unit
PQ1X251M2ZP
PQ1X281M2ZP
PQ1X301M2ZP
PQ1v331M2ZP
PQ1X361M2ZP
PQ1X381M2ZP
PQ1X401M2ZP
PQ1X421M2ZP
PQ1X451M2ZP
PQ1X501M2ZP
V
2.560
2.5
2.440
V
O
V
2.860
2.8
2.740
V
O
V
3.060
3.0
2.940
V
O
V
3.366
3.3
3.234
V
O
V
3.672
3.6
3.528
V
O
V
3.876
3.8
3.724
V
O
V
4.080
4.0
3.920
V
O
V
4.284
4.2
4.116
V
O
V
4.590
4.5
4.410
V
O
V
5.100
5.0
4.900
V
O
(V
IN
=
V
O
(TYP)
+
1.0V, I
O
=
30mA, V
C
=
1.8V, Ta
=
25
C)
Model No.
Symbol MIN.
TYP.
MAX.
Unit
PQ1X251M2ZP
PQ1X281M2ZP
PQ1X301M2ZP
PQ1X331M2ZP
PQ1X361M2ZP
PQ1X381M2ZP
PQ1X401M2ZP
PQ1X421M2ZP
PQ1X451M2ZP
PQ1X501M2ZP
V
25
V
no(rms)
V
25
V
no(rms)
V
30
V
no(rms)
V
30
V
no(rms)
V
35
V
no(rms)
V
35
V
no(rms)
V
40
V
no(rms)
V
40
V
no(rms)
V
45
V
no(rms)
V
50
V
no(rms)
(V
IN
=
V
O
(TYP)
+
1.0V, I
O
=
30mA, V
C
=
1.8V, C
n
=
0.1
F, 10Hz
<
f
<
100kHz, Ta
=
25
C)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Table.1 Output Voltage Line-up
Table.2 Output Noise Voltage Line-up
R
L
I
C (ON)
I
q
, I
qs
V
C
I
O
V
O
4.7
F
0.01
F
1
F
A
V
IN
A
A
5
4
2
3
1
V
Fig.1
Standard Test Circuit
PQ1Xxx1M2ZP Series
Fig.2
Test Circuit for Ripple Rejection
R
L
V
C
eo
10
F
1
F
V
IN
~
5
4
2
3
1
V
~
ei
+
0.1
F
f
=
400Hz (sine wave)
ei(rms)
=
100mV
V
IN
=
V
O
(TYP)
+
1.0V
V
C
=
1.8V
I
O
=
10mA
RR
=
20log(ei(rms)/eo(rms))
Fig.5
Output Voltage Fluctuation vs. Junction
Temperature (PQ1X301M2ZP)(Typical Value)
Fig.6
Output Voltage vs. Input Voltage
(PQ1X301M2ZP)(Typical Value)
Fig.3
Power Dissipation vs. Ambient
Temperature
Fig.4
Overcurrent Protection Characteristics
(Typical Value)
Power dissipation P
D
(mW)
0
100
200
300
400
-
40
-
25
0
50
100
150
25
75
125
Ambient temperature T
a
(
C)
Relative output voltage (%)
0
25
50
75
100
0
0.1
0.2
0.3
0.4
Output current I
O
(A)
Output voltage fluctuation
V
O
(mV)
-
60
-
50
-
40
-
30
-
20
-
10
0
10
20
30
40
50
60
-
30
-
20
140
120
100
80
60
40
20
0
Junction temperature T
j
(
C)
V
IN
=
3.8V
I
O
=
30mA
V
C
=
1.8V
C
O
=
4.7
F
(Ceramic capacitor)
Output voltage V
O
(V)
Input voltage V
IN
(V)
0
4
3
2
1
0
1
2
3
4
5
6
7
R
L
=
R
L
=
40
T
a
=
25
C
C
IN
=
1
F
(Ceramic capacitor)
C
O
=
4.7
F
(Ceramic capacitor)
R
L
=
20
PQ1Xxx1M2ZP Series
Fig.7
Operating Consumption Current vs. Input
Voltage (PQ1X301M2ZP)(Typical Value)
Fig.8
Dropout Voltage vs. Junction Temperature
(PQ1X301M2ZP)(Typical Value)
Circuit operating current I
BIAS
(mA)
Input voltage V
IN
(V)
0
15
10
5
0
1
2
3
4
5
6
7
R
L
=
R
L
=
40
R
L
=
20
T
a
=
25
C
C
IN
=
1
F
(Ceramic capacitor)
C
O
=
4.7
F
(Ceramic capacitor)
Dropout voltage V
I-O
(mV)
0
0.35
0.3
0.25
0.2
0.15
0.1
0.05
-
30
-
20
80
140
120
100
60
40
20
0
Junction temperature T
j
(
C)
V
IN
:Voltage when output voltage is 95%
V
I-O
2 : I
O
=
150mA
V
I-O
1 : I
O
=
60mA
Fig.11
Dropout Voltage vs. Output Current
Fig.9
Quiescent Current vs. Junction
Temperature (Typical Value)
Fig.10
Ripple Rejection vs. Input Frequency
(PQ1X281M2ZP)(Typical Value)
Quiescent current I
q
(
A)
-
30
-
20
140
120
100
80
60
40
20
0
Junction temperature T
j
(
C)
0
200
180
160
140
120
100
80
60
40
20
V
IN
=
V
O
+
1V
V
C
=
1.8V
I
O
=
0A
Ripple rejection RR (dB)
0.1
1
10
100
Input ripple frequency f (kHz)
0
90
80
70
60
50
40
30
20
10
T
a
=
25
C
V
IN
=
3.8V
V
C
=
1.8V
I
O
=
10mA
ei (rms)
=100
mV
C
O
=
10
F
C
n
=
0.1
F
C
n
=
0.01
F
No C
n
Dropout voltage V
I-O
(V)
0
0.3
0.2
0.1
0
50
100
150
Output current I
O
(mA)
T
a
=
25
C
C
IN
=
1
F
(Ceramic capacitor)
C
O
=
4.7
F
(Ceramic capacitor)
PQ1Xxx1M2ZP Series
Fig.12
Example of Application
V
IN
C
IN
C
O
Load
ON/OFF signal
High:Output ON
Low or open:Output OFF
5
4
2
3
1
0.01
F
1. External connection
(1) Please perform shortest wiring for connection between C
O
or Cin and the individual terminal. There is case that oscillation
occurs easily by kinds of capacity capacity and how to wire. Before you use this device, you should confirm output voltage in
your actual using conditions.
(2) The input terminal for ON/OFF output control is compatible with LS-TTL, and direct driving by TTL or C-MOS standard logic
(RCA 4000 series) is also available.
(3) If voltage is applied under the conditions that the device pin is connected divergently or reversely, the deterioration of
characteristics or damage may occur. Never allow improper mounting.
(4) If voltage exceeding the voltage of DC input terminal 1 is applied to
the output terminal 5 , the element may be damaged. Especially when
the DC input terminal 1 is short-circuited to the GND in ordinary
operating state, charges accumulated in the output capacitor Co flow
to the input side, causing damage to the element. In this case, connect
the ordinary silicon diode as shown in the figure.
2. Thermal protection design
Maximum power dissipation of devices is obtained by the following equation.
P
D
=
V
IN
I
IN
-
V
O
I
O
When ambient temperature T
a
and power dissipation P
D
(MAX.) during operation are determined, use a heat sink which allows the
element to operate within the safety operation area specified by the derating curve. Insufficient radiation gives an unfavorable
influence to the normal operation and reliability of the device.
In the external area of the safety operation area shown by the derating curve, the overheat protection circuit may operate to shut-
down output. However please avoid keeping such condition for a long time.
3. ESD (Electrostatic Sensitivity Discharge)
Be careful not to apply electro static discharge to the device since this device employs a bipolar IC and may be damaged by electro
static discharge. Followings are some methods against excessive voltage caused by electro static discharge.
(1) Human body must be grounded to discharge the static electricity from the body or cloth.
(2) Anything that is tn contact with the device such as workbench, inserter, or measuring instrument must be grounded.
(3) Use a solder dip basin with a minimum leak current (isolation resistance 10M
or more) from the commercial power supply.
Also the solder dip basin must be grounded.
115
Application Circuits
NOTICE
qThe circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
qContact and consult with a SHARP representative if there are any questions about the contents of this
publication.
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