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Электронный компонент: SP3232HCA

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Rev. 6/27/03 SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
1
3.3V, 460 Kbps RS-232 Transceivers
SP3222H/3232H
DESCRIPTION
Meets true EIA/TIA-232-F Standards
from a +3.0V to +5.5V power supply
Interoperable with RS-232 down to +2.7V
power source
1
A Low-Power Shutdown with Receivers
Active (SP3222H)
Enhanced ESD Specifications:
+
2kV Human Body Model
460Kbps Minimum Transmission Rate
Ideal for Handheld, Battery Operated
Applications
The SP3222H and the 3232H are 2 driver/2 receiver RS-232 transceiver solutions intended
for portable or hand-held applications such as notebook or palmtop computers.
Their data transmission rate of 460Kbps meeting the demands of high speed RS-232
applications. Both ICS have a high-efficiency, charge-pump power supply that requires only
0.1
F capacitors for 3.3V operation. The charge pump allows the SP3222H and the 3232H
series to deliver true RS-232 performance from a single power supply ranging from +3.3V
to +5.0V.
The SP3222H device has a low-power shutdown mode where the devices' driver outputs and
charge pumps are disabled. During shutdown, the supply current is less than 1
A.
SELECTION TABLE
L
E
D
O
M
s
e
i
l
p
p
u
S
r
e
w
o
P
2
3
2
-
S
R
s
r
e
v
i
r
D
2
3
2
-
S
R
s
r
e
v
i
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c
e
R
l
a
n
r
e
t
x
E
s
t
n
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n
o
p
m
o
C
n
w
o
d
t
u
h
S
L
T
T
e
t
a
t
S
-
3
f
o
.
o
N
s
n
i
P
H
2
2
2
3
P
S
V
5
.
5
+
o
t
V
0
.
3
+
2
2
4
s
e
Y
s
e
Y
0
2
,
8
1
H
2
3
2
3
P
S
V
5
.
5
+
o
t
V
0
.
3
+
2
2
4
o
N
o
N
6
1
Rev. 6/27/03
SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
2
NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation of the
device at these ratings or any other above those indicated in
the operation sections of the specifications below is not
implied. Exposure to absolute maximum rating conditions
for extended periods of time may affect reliability and cause
permanent damage to the device.
V
CC
................................................................-0.3V to +6.0V
V+ (NOTE 1)................................................-0.3V to +7.0V
V- (NOTE 1)................................................+0.3V to -7.0V
V+ + |V-| (NOTE 1)...................................................+13V
I
CC
(DC V
CC
or GND current).................................
+100mA
Electrostatic Discharge
HBM ......................................................................15kV
IEC1000-4-2-AirDischarge....................................15kV
IEC1000-4-2 Direct Contact....................................8kV
Input Voltages
TxIN, EN .....................................................-0.3V to +6.0V
RxIN.............................................................................
25V
Output Voltages
TxOUT.....................................................................
13.2V
RxOUT..............................................-0.3V to (V
CC
+ 0.3V)
Short-Circuit Duration
TxOUT...............................................................Continuous
Storage Temperature.................................-65
C to +150C
Power Dissipation Per Package
20-pin SSOP (derate 9.25mW/
o
C above +70
o
C).......750mW
18-pin PDIP (derate 15.2mW/
o
C above +70
o
C)......1220mW
18-pin SOIC (derate 15.7mW/
o
C above +70
o
C)......1260mW
20-pin TSSOP (derate 11.1mW/
o
C above +70
o
C).....890mW
16-pin SSOP (derate 9.69mW/
o
C above +70
o
C).......775mW
16-pin PDIP (derate 14.3mW/
o
C above +70
o
C)......1150mW
16-pin Wide SOIC (derate 11.2mW/
o
C above +70
o
C)....900mW
16-pin TSSOP (derate 10.5mW/
o
C above +70
o
C).....850mW
SPECIFICATIONS
Unless otherwise noted, the following specifications apply for V
CC
= +3.0V to +5.0V with T
AMB
= T
MIN
to T
MAX
PARAMETER
MIN
TYP
MAX
UNITS
CONDITIONS
DC CHARACTERISTICS
Supply Current
0.3
1.0
mA
no load, T
AMB
= +25
C,
V
CC
= +3.3V, TxIN = V
CC
or GND
Shutdown Supply Current
1.0
10
A
SHDN=GND, T
AMB
= +25
C,
V
CC
=+3.3V, TxIN=V
CC
or GND
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
0.8
V
TxIN, EN, SHDN, Note 2
Input Logic Threshold HIGH
2.0
V
V
CC
=3.3V, Note 2
2.4
V
CC
=5.0V, Note 2
Input Leakage Current
0.01
1.0
A
TxIN, EN, SHDN, T
AMB
= +25
C
Output Leakage Current
0.05
10
A
receivers disabled
Output Voltage LOW
0.4
V
I
OUT
=1.6mA
Output Voltage HIGH
V
CC
-0.6
V
CC
-0.1
V
I
OUT
=-1.0mA
DRIVER OUTPUTS
Output Voltage Swing
5.0
5.4
V
3k
load to ground at all driver outputs,
T
AMB
=+25
C
Output Resistance
300
V
CC
= V+ = V- = 0V, T
OUT
=
2V
Output Short-Circuit Current
35
60
mA
V
OUT
= 0V
Output Leakage Current
25
A
V
OUT
=
12V, V
CC
= 0V or 3.0V+5.5V,
drivers disabled
Rev. 6/27/03 SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
3
R
E
T
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M
A
R
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P
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V
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3
=
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=
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,
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2
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o
SPECIFICATIONS (continued)
Unless otherwise noted, the following specifications apply for V
CC
= +3.0V to +5.0V with T
AMB
= T
MIN
to T
MAX
.
Rev. 6/27/03
SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
4
Figure 1. Transmitter Output Voltage VS. Load
Capacitance for the SP3222H and the SP3232H
Figure 2. Slew Rate VS. Load Capacitance for the
SP3222H and the SP3232H
Figure 3. Supply Current VS. Load Capacitance when
Transmitting Data for the SP3222H and the SP3232H
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for V
CC
= +3.3V, 460Kbps data rates, all drivers
loaded with 3k
, 0.1F charge pump capacitors, and T
AMB
= +25
C.
14
12
10
8
6
4
2
0
Sle
w Rate [V/
s]
Load Capacitance [pF]
+Slew
-Slew
0
500
1000
1500
2000
2330
6
4
2
0
-2
-4
-6
T
ransmitter Output
V
o
lta
g
e
[V]
Load Capacitance [pF]
Vout+
Vout-
500
1000
1500
2000
0
0
5
10
15
20
25
30
35
40
0
500
1000
1500
2000 2500
3000
Load Capacitance (pF)
Supply Current (mA)
460Kbps
120Kbps
20Kbps
Rev. 6/27/03 SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
5
E
M
A
N
N
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I
T
C
N
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1
1
-
Table 1. Device Pin Description
Rev. 6/27/03
SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
6
V-
1
2
3
4
13
14
15
16
5
6
7
12
11
10
C1+
V+
C1-
C2+
C2-
R1IN
R2IN
GND
V
CC
T1OUT
T2IN
8
9
SP3232H
T1IN
R1OUT
R2OUT
T2OUT
Figure 5. Pinout Configuration for the SP3232H
Figure 4. Pinout Configurations for the SP3222H
V-
1
2
3
4
17
18
19
20
5
6
7
16
15
14
SHDN
C1+
V+
C1-
C2+
C2-
NC
EN
R1IN
GND
V
CC
T1OUT
NC
8
9
10
11
12
13
R2IN
R2OUT
SP3222H
T2OUT
T1IN
T2IN
R1OUT
SSOP/TSSOP
V-
1
2
3
4
15
16
17
18
5
6
7
14
13
12
SHDN
C1+
V+
C1-
C2+
C2-
EN
R1IN
GND
V
CC
T1OUT
8
9
10
11
R2IN
SP3222H
T2OUT
T2IN
T1IN
R1OUT
DIP/SO
R2OUT
Rev. 6/27/03 SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
7
SP3232H
1
3
5
4
2
6
16
GND
T1IN
T2IN
T1OUT
T2OUT
C1+
C1-
C2+
C2-
V+
V-
V
CC
11
10
0.1
F
0.1
F
0.1
F
+
C2
C5
C1
+
+
*C3
C4
+
+
0.1
F
0.1
F
14
7
RS-232
OUTPUTS
RS-232
INPUTS
LOGIC
INPUTS
V
CC
15
5k
R1IN
R1OUT
12
13
5k
R2IN
R2OUT
9
8
LOGIC
OUTPUTS
*can be returned to
either V
CC
or GND
Figure 6. SP3222H Typical Operating Circuits
Figure 7. SP3232H Typical Operating Circuit
SP3222H
2
4
6
5
3
7
19
GND
T1IN
T2IN
T1OUT
T2OUT
C1+
C1-
C2+
C2-
V+
V-
V
CC
13
12
0.1
F
0.1
F
0.1
F
+
C2
C5
C1
+
+
*C3
C4
+
+
0.1
F
0.1
F
8
17
RS-232
OUTPUTS
RS-232
INPUTS
LOGIC
INPUTS
V
CC
18
1
5k
R1IN
R1OUT
15
9
5k
R2IN
R2OUT
10
16
LOGIC
OUTPUTS
EN
20
SHDN
*can be returned to
either V
CC
or GND
SSOP
TSSOP
SP3222H
2
4
6
5
3
7
17
GND
T1IN
T2IN
T1OUT
T2OUT
C1+
C1-
C2+
C2-
V+
V-
V
CC
12
11
0.1
F
0.1
F
0.1
F
+
C2
C5
C1
+
+
*C3
C4
+
+
0.1
F
0.1
F
8
15
RS-232
OUTPUTS
RS-232
INPUTS
LOGIC
INPUTS
V
CC
16
1
5k
R1IN
R1OUT
13
9
5k
R2IN
R2OUT
10
14
LOGIC
OUTPUTS
EN
18
SHDN
*can be returned to
either V
CC
or GND
DIP/SO
Rev. 6/27/03
SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
8
DESCRIPTION
The SP3222H and SP3232H are 2-driver/
2-receiver devices ideal for portable or hand-held
applications. The SP3222H features a 1
A shut-
down mode that reduces power consumption and
extends battery life in portable systems.
Its receivers remain active in shutdown mode,
allowing external devices such as modems to be
monitored using only 1
A supply current.
The SP3222H/3232H transceivers meet the EIA/
TIA-232 and V.28/V.24 communication
protocols. They feature Sipex's proprietary
on-board charge pump circuitry that generates
2 x V
CC
for RS-232 voltage levels from a single
+3.0V to +5.5V power supply. The SP3222H/
3232H
drivers operate at a minimum data
rate of 460Kbps.
THEORY OF OPERATION
The SP3222H/3232H are made up of three basic
circuit blocks: 1. Drivers, 2. Receivers, and 3. the
Sipex proprietary charge pump.
Drivers
The drivers are inverting level transmitters that
convert TTL or CMOS logic levels to +5.0V
EIA/TIA-232 levels inverted relative to the input
logic levels. Typically, the RS-232 output voltage
swing is +5.5V with no load and at least +5V
minimum fully loaded. The driver outputs are
protected against infinite short-circuits to ground
without degradation in reliability. Driver outputs
will meet EIA/TIA-562 levels of +3.7V with
supply voltages as low as 2.7V.
The drivers have a minimum data rate of
460Kbps fully loaded with 3K
in parallel with
1000pF, ensuring compatibility with PC-to-PC
communication software.
The slew rate of the driver output is internally
limited to a maximum of 30V/
s in order to meet
the EIA standards (EIA RS-232D 2.1.7,
Paragraph 5). The transition of the loaded output
from HIGH to LOW also meets the monotonicity
requirements of the standard.
Figure 8 shows a loopback circuit used to test the
RS-232 drivers. Figure 9 shows the test results
of the loopback circuit with all drivers active at
120Kbps and RS-232 loads in parallel with
1000pF capacitors. Figure 10 shows the test
results where one driver is active at 460Kbps and
all drivers are loaded with an RS-232 receiver
in parallel with a 1000pF capacitor.
The SP3222H driver's output stages are
tri-stated in shutdown mode. When the power is
off, the SP3222H device permits the outputs to
be driven up to +12V. Because the driver's
inputs do not have pull-up resistors, unused
inputs should be connected to V
CC
or GND.
In the shutdown mode, the supply current is less
than 1
A, where SHDN = LOW. When the
SP3222H device is shut down, the device's
driver outputs are disabled (tri-stated) and the
charge pumps are turned off with V+ pulled
down to V
CC
and V- pulled to GND. The time
required to exit shutdown is typically 100
s.
SHDN is connected to V
CC
if the shutdown mode
is not used. SHDN has no effect on RxOUT or
RxOUTB. As they become active, the two driver
outputs go to opposite RS-232 levels: one driver
input is HIGH and the other LOW. Note that the
drivers are enabled only when the magnitude of
V- exceeds approximately 3V.
Rev. 6/27/03 SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
9
Figure 9. Driver Loopback Test Results at 120Kbps
Figure 10. Driver Loopback Test Results at 460Kbps
Figure 8. SP3222H/3232H Driver Loopback Test Circuit
SP3222H
SP3232H
GND
TxIN
TxOUT
C1+
C1-
C2+
C2-
V+
V-
V
CC
0.1
F
0.1
F
0.1
F
+
C2
C5
C1
+
+
C3
C4
+
+
0.1
F
0.1
F
LOGIC
INPUTS
V
CC
5k
RxIN
RxOUT
LOGIC
OUTPUTS
EN
*SHDN
1000pF
V
CC
* SP3222 only
T1 IN
T1 OUT
R1 OUT
T1 IN
T1 OUT
R1 OUT
Rev. 6/27/03
SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
10
Receivers
The receivers convert EIA/TIA-232 levels to
TTL or CMOS logic output levels. The SP3222H
receivers have an inverting tri-state
output.Receiver outputs (RxOUT) are tri-stated
when the enable control EN = HIGH. In the
shutdown mode, the receivers can be active or
inactive. EN has no effect on TxOUT. The truth
table logic of the SP3222H driver and receiver
outputs can be found in Table 2.
Since receiver input is usually from a transmis-
sion line where long cable lengths and system
interference can degrade the signal and inject
noise, the inputs have a typical hysteresis margin
of 300mV. Should an input be left unconnected,
a 5k
pulldown resistor to ground forces the
output of the receiver HIGH.
Charge Pump
The Sipex patented charge pump (5,306,954)
uses a fourphase voltage shifting technique to
attain symmetrical 5.5V power supplies and
requires four external capacitors. The internal
power supply consists of a regulated dual charge
pump that provides an output voltage of 5.5V
regardless of the input voltage (V
CC
) over the
+3.0V to +5.5V range.
In most circumstances, decoupling the power
supply can be achieved adequately using a
0.1
F bypass capacitor at C5 (refer to Figures 6
and 7). In applications that are sensitive to
power-supply noise,V
CC
and ground can be
decoupled with a capacitor of the same value
as charge-pump capacitor C1. It is always
important to physically locate bypass capacitors
close to the IC.
The charge pump operates in a discontinuous
mode using an internal oscillator. If the output
voltage is less than 5.5V, the charge pump is
enabled. If the output voltage exceeds 5.5V,
the charge pump is disabled. An oscillator
controls the four phases of the voltage shifting.
A description of each phase follows.
Phase 1: V
SS
Charge Storage
(Figure 12)
During this phase of the clock cycle, the positive
side of capacitors C
1
and C
2
are charged to V
CC
.
C
l
+
is then switched to GND and the charge in
C
1
is transferred to C
2
. Since C
2
+
is connected
to V
CC
, the voltage potential across capacitor C
2
is now 2 times V
CC
.
Phase 2: V
SS
Transfer
(Figure 13)
Phase two of the clock connects the negative
terminal of C
2
to the V
SS
storage capacitor and
the positive terminal of C
2
to GND. This
transfers a negative generated voltage to C
3
.
This generated voltage is regulated to a
minimum voltage of -5.5V. Simultaneous with
the transfer of the voltage to C
3
, the positive side
of capacitor C
1
is switched to V
CC
and the
negative side is connected to GND.
Phase 3: V
DD
Charge Storage
(Figure 15)
The third phase of the clock is identical to the
first phase -- the charge transferred in C
1
produces V
CC
in the negative terminal of C
1
,
which is applied to the negative side of capacitor
C
2
. Since C
2
+
is at V
CC
, the voltage potential
across C
2
is 2 times V
CC
.
Table 2. Truth Table Logic for Shutdown and Enable
Control
N
D
H
S
N
E
T
U
O
x
T
T
U
O
x
R
0
0
e
t
a
t
s
-
i
r
T
e
v
i
t
c
A
0
1
e
t
a
t
s
-
i
r
T
e
t
a
t
s
-
i
r
T
1
0
e
v
i
t
c
A
e
v
i
t
c
A
1
1
e
v
i
t
c
A
e
t
a
t
s
-
i
r
T
Rev. 6/27/03 SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
11
Phase 4: V
DD
Transfer
(Figure 16)
The fourth phase of the clock connects the
negative terminal of C
2
to GND, and transfers
this positive generated voltage across C
2
to C
4
,
the V
DD
storage capacitor. This voltage is
regulated to +5.5V. At this voltage, the internal
oscillator is disabled. Simultaneous with the
transfer of the voltage to C
4
, the positive side of
capacitor C
1
is switched to V
CC
and the negative
side is connected to GND, allowing the charge
pump cycle to repeat. The charge pump cycle
will continue as long as the operational
conditions for the internal oscillator are present.
Since both V
+
and V
are separately generated
from V
CC
; in a noload condition V
+
and V
will
be symmetrical. Older charge pump approaches
that generate V
from V
+
will show a decrease in
the magnitude of V
compared to V
+
due to the
inherent inefficiencies in the design.
The charge pump clock rate typically operates
at 250kHz. The external capacitors can be as low
as 0.1
F with a 16V breakdown voltage rating.
ESD Tolerance
The SP3222H/3232H series incorporates
ruggedized ESD cells on all driver output
and receiver input pins.
The Human Body Model has been the generally
accepted ESD testing method for semiconduc-
tors. This method is also specified in MIL-STD-
883, Method 3015.7 for ESD testing. The premise
of this ESD test is to simulate the human body's
potential to store electro-static energy and
discharge it to an integrated circuit. The
simulation is performed by using a test model as
shown in Figure 17. This method will test the
IC's capability to withstand an ESD transient
during normal handling such as in manufacturing
areas where the ICs tend to be handled
frequently.
For the Human Body Model, the current
limiting resistor (R
S
) and the source capacitor
(C
S
) are 1.5k
and 100pF, respectively.
V
CC
= +5V
5V
5V
+5V
V
SS
Storage Capacitor
V
DD
Storage Capacitor
C
1
C
2
C
3
C
4
+
+
+
+
Figure 12. Charge Pump -- Phase 1
Figure 13. Charge Pump -- Phase 2
V
CC
= +5V
10V
V
SS
Storage Capacitor
V
DD
Storage Capacitor
C
1
C
2
C
3
C
4
+
+
+
+
Rev. 6/27/03
SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
12
Figure 14. Charge Pump Waveforms
Figure 15. Charge Pump -- Phase 3
V
CC
= +5V
5V
+5V
5V
V
SS
Storage Capacitor
V
DD
Storage Capacitor
C
1
C
2
C
3
C
4
+
+
+
+
V
CC
= +5V
+10V
V
SS
Storage Capacitor
V
DD
Storage Capacitor
C
1
C
2
C
3
C
4
+
+
+
+
Figure 16. Charge Pump -- Phase 4
R
R
C
C
C
C
S
S
R
R
S
S
SW1
SW1
SW2
SW2
R
C
Device
Under
Test
DC Power
Source
C
S
R
S
SW1
SW2
Figure 17. ESD Test Circuit for Human Body Model
Ch1 2.00V
Ch2
2.00V M 1.00
s Ch1 5.48V
2
1
T
T
[
]
T
+6V
a) C
2+
b) C
2
-
GND
GND
-6V
Rev. 6/27/03 SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
13
D
E
H
PACKAGE: PLASTIC
SHRINK
SMALL OUTLINE
(SSOP)
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
20PIN
A
A1
L
B
e
A
A1
B
D
E
e
H
L
0.068/0.078
(1.73/1.99)
0.002/0.008
(0.05/0.21)
0.010/0.015
(0.25/0.38)
0.278/0.289
(7.07/7.33)
0.205/0.212
(5.20/5.38)
0.0256 BSC
(0.65 BSC)
0.301/0.311
(7.65/7.90)
0.022/0.037
(0.55/0.95)
0/8
(0/8)
24PIN
0.068/0.078
(1.73/1.99)
0.002/0.008
(0.05/0.21)
0.010/0.015
(0.25/0.38)
0.317/0.328
(8.07/8.33)
0.205/0.212
(5.20/5.38)
0.0256 BSC
(0.65 BSC)
0.301/0.311
(7.65/7.90)
0.022/0.037
(0.55/0.95)
0/8
(0/8)
28PIN
0.068/0.078
(1.73/1.99)
0.002/0.008
(0.05/0.21)
0.010/0.015
(0.25/0.38)
0.397/0.407
(10.07/10.33)
0.205/0.212
(5.20/5.38)
0.0256 BSC
(0.65 BSC)
0.301/0.311
(7.65/7.90)
0.022/0.037
(0.55/0.95)
0/8
(0/8)
16PIN
0.068/0.078
(1.73/1.99)
0.002/0.008
(0.05/0.21)
0.010/0.015
(0.25/0.38)
0.239/0.249
(6.07/6.33)
0.205/0.212
(5.20/5.38)
0.0256 BSC
(0.65 BSC)
0.301/0.311
(7.65/7.90)
0.022/0.037
(0.55/0.95)
0/8
(0/8)
Rev. 6/27/03
SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
14
D
ALTERNATE
END PINS
(BOTH ENDS)
D1 = 0.005" min.
(0.127 min.)
E
PACKAGE: PLASTIC
DUALINLINE
(NARROW)
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
A = 0.210" max.
(5.334 max).
E1
C
L
A2
A1 = 0.015" min.
(0.381min.)
B
B1
e = 0.100 BSC
(2.540 BSC)
e
A
= 0.300 BSC
(7.620 BSC)
A2
B
B1
C
D
E
E1
L
16PIN
0.115/0.195
(2.921/4.953)
0.014/0.022
(0.356/0.559)
0.045/0.070
(1.143/1.778)
0.008/0.014
(0.203/0.356)
0.780/0.800
(19.812/20.320)
0.300/0.325
(7.620/8.255)
0.240/0.280
(6.096/7.112)
0.115/0.150
(2.921/3.810)
0/ 15
(0/15)
18PIN
0.115/0.195
(2.921/4.953)
0.014/0.022
(0.356/0.559)
0.045/0.070
(1.143/1.778)
0.008/0.014
(0.203/0.356)
0.880/0.920
(22.352/23.368)
0.300/0.325
(7.620/8.255)
0.240/0.280
(6.096/7.112)
0.115/0.150
(2.921/3.810)
0/ 15
(0/15)
Rev. 6/27/03 SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
15
D
E
H
PACKAGE: PLASTIC
SMALL OUTLINE (SOIC)
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
A
A1
L
B
e
A
A1
B
D
E
e
H
L
16PIN
0.090/0.104
(2.29/2.649)
0.004/0.012
(0.102/0.300)
0.013/0.020
(0.330/0.508)
0.398/0.413
(10.10/10.49)
0.291/0.299
(7.402/7.600)
0.050 BSC
(1.270 BSC)
0.394/0.419
(10.00/10.64)
0.016/0.050
(0.406/1.270)
0/8
(0/8)
18PIN
0.090/0.104
(2.29/2.649))
0.004/0.012
(0.102/0.300)
0.013/0.020
(0.330/0.508)
0.447/0.463
(11.35/11.74)
0.291/0.299
(7.402/7.600)
0.050 BSC
(1.270 BSC)
0.394/0.419
(10.00/10.64)
0.016/0.050
(0.406/1.270)
0/8
(0/8)
Rev. 6/27/03
SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
16
PACKAGE:
PLASTIC THIN SMALL
OUTLINE
(TSSOP)
DIMENSIONS
in inches (mm)
Minimum/Maximum
16PIN
A
A1
L
B
e
A
A1
B
D
E
e
E2
L
- /0.043
(- /1.10)
0.002/0.006
(0.05/0.15)
0.007/0.012
(0.19/0.30)
0.193/0.201
(4.90/5.10)
0.169/0.177
(4.30/4.50)
0.026 BSC
(0.65 BSC)
0.126 BSC
(3.20 BSC)
0.020/0.030
(0.50/0.75)
0
/8
E2
D
- /0.043
(- /1.10)
0.002/0.006
(0.05/0.15)
0.007/0.012
(0.19/0.30)
0.252/0.260
(6.40/6.60)
0.169/0.177
(4.30/4.50)
0.026 BSC
(0.65 BSC)
0.126 BSC
(3.20 BSC)
0.020/0.030
(0.50/0.75)
0
/8
20PIN
E
Rev. 6/27/03 SP3222H/3232H 3.3V, 460 Kbps RS-232 Transceivers
Copyright 2003 Sipex Corporation
17
ORDERING INFORMATION
Model
Temperature Range
Package Type
SP3222HCA ............................................. 0C to +70C .......................................... 20-Pin SSOP
SP3222HCP ............................................. 0C to +70C ............................................ 18-Pin PDIP
SP3222HCT ............................................. 0C to +70C ........................................ 18-Pin
WSOIC
SP3222HCY ............................................. 0C to +70C ........................................ 20-Pin TSSOP
SP3232HCA ............................................. 0C to +70C .......................................... 16-Pin SSOP
SP3232HCP ............................................. 0C to +70C ............................................ 16-Pin PDIP
SP3232HCT ............................................. 0C to +70C ..................................
...... 16-Pin WSOIC
SP3232HCY ............................................. 0C to +70C ........................................ 16-Pin TSSOP
Please consult the factory for pricing and availability on a Tape-On-Reel option.
Corporation
SIGNAL PROCESSING EXCELLENCE
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the
application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others.
Sipex Corporation
Headquarters and
Sales Office
233 South Hillview Drive
Milpitas, CA 95035
TEL: (408) 934-7500
FAX: (408) 935-7600
Sales Office
22 Linnell Circle
Billerica, MA 01821
TEL: (978) 667-8700
FAX: (978) 670-9001
e-mail: sales@sipex.com