Skyworks Solutions, Inc. [978] 241-7000
Fax [978] 241-7906
Email sales@skyworksinc.com
www.skyworksinc.com
1
Specifications subject to change without notice. 2/00A
2528 GHz Amplifier
Features
30 dB Gain
+23 dBm Output Power
Rugged, Reliable Package
Single Voltage Operation
100% RF and DC Testing
AB026P2-14
Description
The AB026P2-14 is a broadband millimeterwave power
amplifier in a rugged package. The amplifier is designed
for use in millimeterwave communication and sensor
systems as the transmitter front-end or gain stage when
high gain and wide bandwidth are required. The robust
ceramic and metal package provides excellent electrical
performance, excellent thermal performance, and a high
degree of environmental protection for long-term reliability.
A single supply voltage simplifies bias requirements. All
amplifiers are screened at the operating frequencies prior
to shipment for guaranteed performance. Amplifier is
targeted for millimeterwave point-to-point and point-to-
multipoint wireless communications systems.
Parameter
Symbol
Min.
Typ.
Max.
Unit
Bandwidth
BW
25
2429
28
GHz
Small Signal Gain
G
26
30
dB
Input Return Loss
RL
I
9
dB
Output Return Loss
RL
O
11
dB
Output Power at Saturation
P
SAT
25
dBm
Output Power at 1 dB Gain Compression
P
1 dB
21
23
dBm
Temperature Coefficient of Gain
dG/dT
-0.054
dB/C
Electrical Specifications at 25C (V
D1
= V
D2
= V
D3
= 5.5 V)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Drain Current 1
I
D1
80
mA
Drain Current 2
I
D2
260
mA
Drain Current 3
I
D3
260
mA
Total Drain Current
I
D1
+ I
D2
+I
D3
600
800
mA
DC
RF
Pin Out
VD
2
N/C
VD
1
VD
3
N/C
N/C
RF Out
RF In
PIN 1
INDICATOR
2528 GHz Amplifier
AB026P2-14
2
Skyworks Solutions, Inc. [978] 241-7000
Fax [978] 241-7906
Email sales@skyworksinc.com
www.skyworksinc.com
Specifications subject to change without notice. 2/00A
Characteristic
Value
Operating Temperature (T
C
)
-55C to +90C
Storage Temperature (T
ST
)
-65C to +150C
Bias Voltage (V
D1
)
7 V
DC
Bias Voltage (VD
2
)
7 V
DC
Bias Voltage (VD
3
)
7 V
DC
Power In (P
IN
)
13 dBm
Absolute Maximum Ratings
Gain vs. Frequency
20
25
30
35
Frequency (GHz)
Gain (dB)
0
10
20
30
40
-55C
+85C
+25C
Output Power vs. Frequency
Frequency (GHz)
P
1 dB
(dBm)
10
15
20
25
25
26
27
28
29
30
Return Loss vs. Frequency
-15
-10
-5
0
20
25
30
35
Frequency (GHz)
Return Loss (dB)
S
22
S
11
Typical Performance Data
Outline
AB026P2-14
YYWW
0.470 (11.94 mm)
PIN 1
IDENTIFICATION
0.235
(5.60 mm)
0.008
(0.20 mm)
0.024
(0.61 mm)
0.018 (0.46 mm)
0.0265
(0.67 mm)
TO LAUNCH
SURFACE
0.057
(1.45 mm)
0.011
(0.28 mm)
0.450
(11.43 mm)
0.225
(5.72 mm)
0.025 (0.64 mm)
0.055 (1.40 mm)
2528 GHz Amplifier
AB026P2-14
Skyworks Solutions, Inc. [978] 241-7000
Fax [978] 241-7906
Email sales@skyworksinc.com
www.skyworksinc.com
3
Specifications subject to change without notice. 2/00A
Typical S-Parameters at 25C (V
D1
= V
D2
= V
D3
= 5.5 V)
Frequency
S
11
S
21
S
12
S
22
(GHz)
Mag.
Ang.
Mag.
Ang.
Mag.
Ang.
Mag.
Ang.
16.0
-5.91
174.5
-39.13
21.2
-50.93
19.5
-22.81
-49.1
18.0
-5.41
98.7
-16.67
-99.0
-66.24
8.1
-20.60
-102.1
20.0
-5.74
-3.2
7.73
74.8
-60.84
-124.7
-21.88
-107.0
21.0
-7.76
-48.3
17.98
-54.2
-63.18
118.9
-18.28
-112.8
22.0
-8.63
-70.7
23.80
161.4
-63.69
155.8
-14.12
-126.5
23.0
-7.94
-100.5
25.49
31.7
-67.28
90.3
-12.49
-160.2
24.0
-7.34
-134.1
27.15
-86.0
-62.54
-167.7
-12.51
176.3
25.0
-6.51
-160.2
30.26
152.1
-56.54
-177.8
-12.64
151.3
26.0
-5.80
158.2
32.47
19.6
-57.14
145.3
-12.38
128.9
27.0
-9.62
85.6
32.65
-122.5
-63.29
158.0
-14.67
85.7
28.0
-17.12
15.5
29.39
94.3
-54.43
90.2
-13.65
79.2
29.0
-18.20
-52.4
26.96
-33.6
-55.64
65.5
-14.22
68.1
30.0
-18.58
-99.8
24.87
-179.1
-53.84
70.1
-10.25
47.0
31.0
-13.95
-89.0
17.83
-16.4
-54.49
43.0
-12.08
8.0
32.0
-8.21
-128.9
-6.06
158.7
-70.63
-8.5
-10.03
-1.9
33.0
-6.96
-168.4
-27.77
110.3
-46.39
25.5
-6.72
-44.5
34.0
-6.62
162.3
-38.65
79.9
-46.88
-18.1
-8.50
-85.7
36.0
-3.68
118.8
-36.27
-67.2
-40.34
-130.1
-14.54
-56.3
38.0
1.24
42.4
-34.84
79.0
-54.31
104.0
-6.12
-119.1
40.0
-0.24
-51.8
-34.19
-116.1
-57.13
-118.7
-6.18
-176.1
2528 GHz Amplifier
AB026P2-14
4
Skyworks Solutions, Inc. [978] 241-7000
Fax [978] 241-7906
Email sales@skyworksinc.com
www.skyworksinc.com
Specifications subject to change without notice. 2/00A
Co-Planar Millimeterwave Package
Handling and Mounting
Millimeterwave amplifiers require careful mounting design
to maintain optimal performance.
Handling
The co-planar millimeterwave package is very rugged.
However, due to ceramic's brittle nature one should
exercise care when handling with metal tools. Do not apply
heavy pressure to the lid. Vacuum tools may be used to
pick and place this part.
Only personnel trained in both ESD precautions and
handling precautions should be allowed to handle these
packages.
Package Construction
The co-planar millimeterwave package is constructed from
metal and ceramic. The base of the package is gold-plated
copper-molybdenum-copper. The lid is unplated alumina.
The lid seal is epoxy.
Mounting Design
The co-planar millimeterwave package is mounted by
placing it in a hole cut in a printed circuit board. The RF
interface on the package should be in the same plane as
the surface of the printed circuit board. The hole should
be cut as close as possible to the outer dimensions of the
package to minimize the gap between package and
printed circuit board. The gap should be no more than
0.005" (0.127 mm). The base of the package should be
mounted directly to a surface which provides a good
ground plane for the printed circuit board and provides a
good thermal ground.
The RF connection on the printed circuit board should
include a microstrip line and two grounded pads, one on
either side of the microstrip line. The RF connection
between the package and the printed circuit board should
be accomplished with three ribbon bonds, one connecting
the RF lines on package and printed circuit board and two
connecting the ground pads on the package and printed
circuit board.
Mounting the Package
The package should be attached to its mounting surface
using a silver-filled conductive paste epoxy. Care should
be taken to ensure that there are no voids or gaps in the
epoxy underfill so that a good ground contact is
maintained.
Screw hardware attachment should be used in addition
to conductive epoxy in situations where additional
mechanical integrity is desired. Care should be exercised
when tightening screws because over-tightening could
deform the package base.
Connecting the Package
Thermosonic ribbon attachment with 0.00025" x 0.005"
(0.0064 mm x 0.127 mm) gold ribbon is used to make the
connections from the RF and DC package interfaces to
the printed circuit board. Lengths of ribbons should be
minimized.
Co-Planar Millimeterwave Package Mounting
Ribbon Bonds
Minimize RF
Gap Widths
RF In
Grounded Pad on
Printed Circuit Board
DC Lines
RF Out
Printed Circuit Board
Rogers 4003
0.008" (0.20 mm) Thick
Electrically & Thermally
Conductive Ground Plane
080 Screw
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