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DATA SHEET
SKY73009: 400 3000 MHz Direct Quadrature Demodulator
Applications
PCS, DCS, GSM/GPRS, and EDGE receivers
Third Generation (3G) wireless communications
Power amplifier feedback/linearization
Wireless Local Loops (WLLs)
Wireless Local Area Networks (WLANs)
Features
High IIP2 and IIP3
Wideband RF input frequency range (400 to 3000 MHz)
Wideband LO input frequency range (400 to 3000 MHz)
Integrated LO balun
Integrated LO amplifier
On-chip I/Q phase splitter
Differential IF output supports direct interface to A/D circuitry
AM demodulation immunity
Single +3.0 V supply
RFLGATM (32 pin, 5 x 5 mm) Pb-free package (MSL3, 260 C
per JEDEC J-STD-020)
C1469
RF+
0
180
90
I+
I
RF
Q+
Q
LO
Figure 1. SKY73009 Functional Block Diagram
Description
Skyworks SKY73009 is an integrated, broadband, high-dynamic
range quadrature demodulator for use in various wireless
communication system applications. The SKY73009 can perform
quadrature demodulation of RF input signals from 400 to
3000 MHz directly to baseband frequencies. The quadrature
outputs are differential and can be directly connected to most
commonly available A/D converters.
The high dynamic range and second order Input Intercept Point
(IIP2) value of the SKY73009 make it ideal for use in direct
conversion and low Intermediate Frequency (IF) receivers.
Figure 1 shows a functional block diagram for the SKY73009. The
device package and pinout for the 32-pin RF Land Grid Array
(RFLGA) are shown in Figure 2.
Skyworks offers lead (Pb)-free, RoHS (Restriction of
Hazardous Substances) compliant packaging.
C1468
GND
GND
GND
VCC
VCC
VCC
GND
GND
GND
25
24
23
22
21
20
19
18
17
GND
GND
GND
GND
GND
LO
GND
GND
GND
RF+
GND
GND
RF
GND
10
11
12
13
14
15
16
32
31
30
29
28
27
26
GND
IFIP
GND
IFIN
GND
IFQP
GND
IFQN
GND
1
2
3
4
5
6
7
8
9
Figure 2. SKY73009 Pinout 32-Pin RFLGA Package
(Top View)
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Table 1. SKY73009 Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1
GND Ground
17
GND Ground
2
GND
Ground
18
IFQN
Negative quadrature IF output
3
GND Ground
19
GND Ground
4
VCC
+3 VDC supply
20
IFQP
Positive quadrature IF output
5
VCC
+3 VDC supply
21
GND
Ground
6
VCC
+3 VDC supply
22
IFIN
Negative in-phase IF output
7
GND Ground
23
GND Ground
8
GND
Ground
24
IFIP
Positive in-phase IF output
9
GND Ground
25
GND Ground
10 GND
Ground
26 GND
Ground
11 GND
Ground
27 GND
Ground
12 GND
Ground
28 RF
Negative
RF
input
13 GND
Ground
29 GND
Ground
14
LO
LO input
30
RF+
Positive RF input
15 GND
Ground
31 GND
Ground
16 GND
Ground
32 GND
Ground
Table 2. SKY73009 Absolute Maximum Ratings
(T
A
= +25
C, unless otherwise noted)
Parameter Symbol
Min
Typical
Max
Units
+3 V supply voltage
VCC
2.7
3.6
V
Power dissipation
P
D
210
320
mW
RF input power
P
RFIN
18
dBm
LO input power
P
LOIN
0
6
dBm
Operating case temperature
T
OPR
40
+85
C
Storage case temperature
T
STG
40
0
+125
C
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal values.
Equivalent Input Circuits
An equivalent circuit for the RF input of the SKY73009 is shown in
Figure 3. The equivalent circuit for the Local Oscillator (LO) input
is shown in Figure 4. An internal balun is used to convert the
single-ended LO input into a differential signal before being
buffered inside the device.
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are
provided in Table 1. The absolute maximum ratings of the
SKY73009 are provided in Table 2 and the recommended
operating conditions provided in Table 3. Electrical characteristics
of the SKY73009 are provided in Table 4.
The typical performance of the SKY73009 with respect to
frequency is illustrated in Figures 5 through 54. Figure 62
provides the package dimensions for the 32-pin RFLGA, and
Figure 63 provides the tape and reel dimensions.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY73009 is rated to Moisture Sensitivity Level 3 (MSL3) at
260
C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design & SMT Assembly/Rework Guidelines for RFLGA
Packages, document number 103147.
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3
RF+
RF
S729
Figure 3. Equivalent Circuit for the RF input
1:1
LO
Input
S730
Figure 4. Equivalent Circuit for The LO input.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note Tape and Reel, document number 101568.
Electrostatic Discharge (ESD) Sensitivity
The SKY73009 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper ESD
precautions.
Table 3. SKY73009 Recommended Operating Conditions
Parameter Symbol
Min
Typical
Max
Units
+3 V supply voltage
VCC
2.7
3.0
3.3
V
Current consumption
I
CC
75 mA
Operating case temperature
T
OPR
40
+85
C
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February 13, 2006 Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice 103034F
Table 4. SKY73009 Electrical Characteristics
(VCC = 3 V, IF = 10 MHz, LO Input Power = 0 dBm, T
C
= 25
C, Z
O
= 50
, unless otherwise noted)
Parameter Symbol
Test
Conditions Min
Typical
Max Units
RF input frequency range
400
3000
MHz
LO input frequency range (Note 1)
400
3000
MHz
IF frequency range
DC
250
MHz
I/Q amplitude imbalance
0.3
+0.3
dB
I/Q phase error
1
deg
IF output impedance (Note 2)
500
LO to RF isolation
50
dB
IF output DC level
Over process and
operating temperature
0.95 1.20 1.55 V
RF Input (900 MHz)
Voltage conversion gain
0
2
dB
SSB Noise Figure
NF
14
16
dB
2
nd
Order Input Intercept Point
IIP2
60
dBm
3
rd
Order Input Intercept Point
IIP3
24
27
dBm
1 dB compression point
10
12
dBm
RF input VSWR
1.5:1
2.0:1
LO input VSWR
1.5:1
2.0:1
Noise
floor
166
dBm/Hz
RF Input (1900 MHz)
Voltage conversion gain
0.7
+1.3
dB
SSB Noise Figure
NF
15
17
dB
2
nd
Order Input Intercept Point
IIP2
60
dBm
3
rd
Order Input Intercept Point
IIP3
22
25
dBm
1 dB compression point
11
13
dBm
RF input VSWR
1.5:1
2.0:1
LO input VSWR
1.5:1
2.0:1
Noise
floor
163
dBm/Hz
Note 1: For operation at LO frequencies <550 MHz and >2500 MHz, an LO power of +3 dBm must be used.
Note 2: Differential IFI and IFQ output impedance without the use of a 9:1 impedance ratio balun.
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1
2
3
0
+1
+2
+3
400
420
440
460
480
500
Frequency (MHz)
Voltage Gain (dB)
LO = 6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 5. Voltage Conversion Gain vs Frequency: 400-500 MHz
(Mini-Circuits TC1-1 Balun on RF Port)
10.0
10.5
11.0
11.5
12.0
12.5
13.0
13.5
14.0
14.5
15.0
400
420
440
460
480
500
Frequency (MHz)
P1dB (dBm)
LO = 6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 7. 1 dB Compression Point vs Frequency: 400-500 MHz
(Mini-Circuits TC1-1 Balun on RF Port)
20
22
24
26
28
30
32
34
36
400
420
440
460
480
500
Frequency (MHz)
IIP
3
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 9. IIP3 vs Frequency: 400-500 MHz
(Mini-Circuits TC1-1 Balun on RF Port)
1
2
3
0
+1
+2
+3
400
420
440
460
480
500
Frequency (MHz)
Voltage Gain (dB)
VDD = 2.7 V
VDD = 3.0 V
VDD = 3.3 V
Figure 6. Voltage Conversion Gain vs Frequency: 400-500 MHz
(Mini-Circuits TC1-1 Balun on RF Port)
10
10.5
11
11.5
12
12.5
13
13.5
14
14.5
15
400
450
500
Frequency (MHz)
P1
d
B
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 8. 1dB Compression Point vs Frequency: 400-500 MHz
(Mini-Circuits TC1-1 Balun on RF Port)
20
22
24
26
28
30
32
34
36
400
410
420
430
440
450
460
470
480
490
500
Frequency (MHz)
IIP
3
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 10. IIP3 vs Frequency: 400-500 MHz
(Mini-Circuits TC1-1 Balun on RF Port)
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60
62
64
66
68
70
72
74
76
78
80
400
420
440
460
480
500
Frequency (MHz)
II
P2
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 11. IIP2 vs Frequency: 400-500 MHz
(Mini-Circuits TC1-1 Balun on RF Port)
10
11
12
13
14
15
16
17
18
19
20
400
420
440
460
480
500
Frequency (MHz)
NF
(
d
B)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 13. NF vs Frequency: 400-500 MHz
(Mini-Circuits TC1-1 Balun on RF Port)
0
1
2
+1
+2
+3
+4
800
840
880
920
960
1000
Frequency (MHz)
Voltage Gain (dB)
LO = 6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 15. Voltage Conversion Gain vs Frequency:
800-1000 MHz (Murata LDB15C500A0900 Balun on RF Port)
50
55
60
65
70
75
80
400
410
420
430
440
450
460
470
480
490
500
Frequency (MHz)
II
P2
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 12. IIP2 vs Frequency: 400-500 MHz
(Mini-Circuits TC1-1 Balun on RF Port)
10
11
12
13
14
15
16
17
18
19
20
400
410
420
430
440
450
460
470
480
490
500
Frequency (MHz)
NF (dB)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 14. NF vs Frequency: 400-500 MHz
(Mini-Circuits TC1-1 Balun on RF Port)
0
1
2
+1
+2
+3
+4
800
840
880
920
960
1000
Frequency (MHz)
Voltage Gain (dB)
VDD = 2.7 V
VDD = 3.0 V
VDD = 3.3 V
Figure 16. Voltage Conversion Gain vs Frequency:
800-1000 MHz (Murata LDB15C500A0900 Balun on RF Port)
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10.0
10.5
11.0
11.5
12.0
12.5
13.0
13.5
14.0
14.5
15.0
800
820
860
900
840
880
940
980
920
960
1000
Frequency (MHz)
P1dB (dBm)
LO = 6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 17. 1 dB Compression Point vs Frequency:
800-1000 MHz (Murata LDB15C500A0900 Balun on RF Port)
20
22
24
26
28
30
32
34
36
800
820
840
860
880
900
920
940
960
980
1000
Frequency (MHz)
II
P3
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 19. IIP3 vs Frequency: 800-1000 MHz
(Murata LDB15C500A0900 Balun on RF Port)
50
52
54
56
58
60
62
64
66
68
70
800
820
840
860
880
900
920
940
960
980
1000
Frequency (MHz)
II
P2
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 21. IIP2 vs Frequency: 800-1000 MHz
(Murata LDB15C500A0900 Balun on RF Port)
10
10.5
11
11.5
12
12.5
13
13.5
14
14.5
15
800
850
900
950
1000
Frequency (MHz)
P
1
d
B
(d
Bm
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 18. 1 dB Compression Point vs Frequency:
800-1000 MHz (Murata LDB15C500A0900 Balun on RF Port)
20
22
24
26
28
30
32
34
36
800
820
840
860
880
900
920
940
960
980
1000
Frequency (MHz)
II
P3
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 20. IIP3 vs Frequency: 800-1000 MHz
(Murata LDB15C500A0900 Balun on RF Port)
50
55
60
65
70
75
80
800
820
840
860
880
900
920
940
960
980
1000
Frequency (MHz)
II
P2
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 22. IIP2 vs Frequency: 800-1000 MHz
(Murata LDB15C500A0900 Balun on RF Port)
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10
11
12
13
14
15
16
17
18
19
20
800
820
840
860
880
900
920
940
960
980
1000
Frequency (MHz)
NF
(d
B)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 23. NF vs Frequency: 800-1000 MHz
(Murata LDB15C500A0900 Balun on RF Port)
1
2
3
0
+1
+2
+3
1500
1550
1600
1650
1700
Frequency (MHz)
Voltage Gain (dB)
LO = 6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 25. Voltage Conversion Gain vs Frequency:
1500-1700 MHz (Murata LDB15C500A1600 Balun on RF Port)
10
10.5
11
11.5
12
12.5
13
13.5
14
14.5
15
1500
1550
1600
1650
1700
Frequency (MHz)
P1
d
B
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 27. 1 dB Compression Point vs Frequency:
1500-1700 MHz (Murata LDB15C500A1600 Balun on RF Port)
10
11
12
13
14
15
16
17
18
19
20
800
820
840
860
880
900
920
940
960
980
1000
Frequency (MHz)
NF
(d
B)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 24. NF vs Frequency: 800-1000 MHz
(Murata LDB15C500A0900 Balun on RF Port)
1
2
3
0
+1
+2
+3
1500
1550
1600
1650
1700
Frequency (MHz)
Voltage Gain (dB)
VDD = 2.7 V
VDD = 3.0 V
VDD = 3.3 V
Figure 26. Voltage Conversion Gain vs Frequency:
1500-1700 MHz (Murata LDB15C500A1600 Balun on RF Port)
10
10.5
11
11.5
12
12.5
13
13.5
14
14.5
15
1500
1550
1600
1650
1700
Frequency (MHz)
P1
d
B
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 28. 1 dB Compression Point vs Frequency:
1500-1700 MHz (Murata LDB15C500A1600 Balun on RF Port)
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9
20
22
24
26
28
30
32
34
36
1500
1550
1600
1650
1700
Frequency (MHz)
II
P3
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 29. IIP3 vs Frequency: 1500-1700 MHz
(Murata LDB15C500A1600 Balun on RF Port)
50
52
54
56
58
60
62
64
66
68
70
1500
1550
1600
1650
1700
Frequency (MHz)
II
P2
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 31. IIP2 vs Frequency: 1500-1700 MHz
(Murata LDB15C500A1600 Balun on RF Port)
10
11
12
13
14
15
16
17
18
19
20
1500
1550
1600
1650
1700
Frequency (MHz)
NF
(d
B)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 33. NF vs Frequency: 1500-1700 MHz
(Murata LDB15C500A1600 Balun on RF Port)
20
22
24
26
28
30
32
34
36
1500
1550
1600
1650
1700
Frequency (MHz)
II
P3
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 30. IIP3 vs Frequency: 1500-1700 MHz
(Murata LDB15C500A1600 Balun on RF Port)
50
55
60
65
70
75
80
1500
1550
1600
1650
1700
Frequency (MHz)
II
P2
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 32. IIP2 vs Frequency: 1500-1700 MHz
(Murata LDB15C500A1600 Balun on RF Port)
10
11
12
13
14
15
16
17
18
19
20
1500
1550
1600
1650
1700
Frequency (MHz)
NF
(d
B)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 34. NF vs Frequency: 1500-1700 MHz
(Murata LDB15C500A1600 Balun on RF Port)
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1
2
3
0
+1
+2
+3
1800
1850
1900
1950
2000
Frequency (MHz)
Voltage Gain (dB)
LO = 6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 35. Voltage Conversion Gain vs Frequency:
1800-2000 MHz (Murata LDB15C500A1900 Balun on RF Port)
10
10.5
11
11.5
12
12.5
13
13.5
14
14.5
15
1800
1850
1900
1950
2000
Frequency (MHz)
P1
d
B
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 37. 1 dB Compression Point vs Frequency:
1800-2000 MHz (Murata LDB15C500A1900 Balun on RF Port)
20
22
24
26
28
30
32
34
36
1800
1850
1900
1950
2000
Frequency (MHz)
II
P
3
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 39. IIP3 vs Frequency: 1800-2000 MHz
(Murata LDB15C500A1900 Balun on RF Port)
1
2
3
0
+1
+2
+3
1800
1850
1900
1950
2000
Frequency (MHz)
Voltage Gain (dB)
VDD = 2.7 V
VDD = 3.0 V
VDD = 3.3 V
Figure 36. Voltage Conversion Gain vs Frequency:
1800-2000 MHz (Murata LDB15C500A1900 Balun on RF Port)
10
11
12
13
14
15
16
17
18
19
20
1800
1850
1900
1950
2000
Frequency (MHz)
P1
d
B
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 38. 1 dB Compression Point vs Frequency:
1800-2000 MHz (Murata LDB15C500A1900 Balun on RF Port)
20
22
24
26
28
30
32
34
36
1800
1850
1900
1950
2000
Frequency (MHz)
II
P
3
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 40. IIP3 vs Frequency: 1800-2000 MHz
(Murata LDB15C500A1900 Balun on RF Port)
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11
50
52
54
56
58
60
62
64
66
68
70
1800
1850
1900
1950
2000
Frequency (MHz)
IIP
2
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 41. IIP2 vs Frequency: 1800-2000 MHz
(Murata LDB15C500A1900 Balun on RF Port)
12
13
14
15
16
17
18
19
20
1800
1850
1900
1950
2000
Frequency (MHz)
NF
(
d
B)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 43. NF vs Frequency: 1800-2000 MHz
(Murata LDB15C500A1900 Balun on RF Port)
1
2
3
0
+1
+2
+3
2300
2350
2400
2450
2500
Frequency (MHz)
Voltage Gain (dB)
LO = 6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 45. Voltage Conversion Gain vs Frequency:
2300-2500 MHz (Murata LDB15C500A2400 Balun on RF Port)
50
55
60
65
70
75
80
1800
1850
1900
1950
2000
Frequency (MHz)
IIP
2
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 42. IIP2 vs Frequency: 1800-2000 MHz
(Murata LDB15C500A1900 Balun on RF Port)
10
11
12
13
14
15
16
17
18
19
20
1800
1850
1900
1950
2000
Frequency (MHz)
NF
(
d
B)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 44. NF vs Frequency: 1800-2000 MHz
(Murata LDB15C500A1900 Balun on RF Port)
1
2
3
0
+1
+2
+3
2300
2350
2400
2450
2500
Frequency (MHz)
Voltage Gain (dB)
VDD = 2.7 V
VDD = 3.0 V
VDD = 3.3 V
Figure 46. Voltage Conversion Gain vs Frequency:
2300-2500 MHz (Murata LDB15C500A2400 Balun on RF Port)
DATA SHEET SKY73009 DEMODULATOR
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10
10.5
11
11.5
12
12.5
13
13.5
14
14.5
15
2300
2350
2400
2450
2500
Frequency (MHz)
P1
d
B
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 47. 1 dB Compression Point vs Frequency:
2300-2500 MHz (Murata LDB15C500A2400 Balun on RF Port)
15
17
19
21
23
25
27
29
2300
2350
2400
2450
2500
Frequency (MHz)
II
P3
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 49. IIP3 vs Frequency: 2300-2500 MHz
(Murata LDB15C500A2400 Balun on RF Port)
50
52
54
56
58
60
62
64
66
68
70
2300
2350
2400
2450
2500
Frequency (MHz)
II
P
2
(
d
B
m
)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 51. IIP2 vs Frequency: 2300-2500 MHz
(Murata LDB15C500A2400 Balun on RF Port)
10
11
12
13
14
15
16
17
18
19
20
2300
2350
2400
2450
2500
Frequency (MHz)
P1
d
B
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 48. 1 dB Compression Point vs Frequency:
2300-2500 MHz (Murata LDB15C500A2400 Balun on RF Port)
20
21
22
23
24
25
26
27
28
29
30
2300
2350
2400
2450
2500
Frequency (MHz)
II
P3
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 50. IIP3 vs Frequency: 2300-2500 MHz
(Murata LDB15C500A2400 Balun on RF Port)
50
55
60
65
70
75
80
2300
2350
2400
2450
2500
Frequency (MHz)
II
P
2
(
d
B
m
)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 52. IIP2 vs Frequency: 2300-2500 MHz
(Murata LDB15C500A2400 Balun on RF Port)
DATA SHEET SKY73009 DEMODULATOR
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13
12
13
14
15
16
17
18
19
20
2300
2350
2400
2450
2500
Frequency (MHz)
NF
(d
B)
LO = -6 dBm
LO = 0 dBm
LO = +3 dBm
Figure 53. NF vs Frequency: 2300-2500 MHz
(Murata LDB15C500A2400 Balun on RF Port)
10
11
12
13
14
15
16
17
18
19
20
2300
2350
2400
2450
2500
Frequency (MHz)
NF
(d
B)
Vdd = 2.7V
Vdd = 3.0V
Vdd = 3.3V
Figure 54. NF vs Frequency: 2300-2500 MHz
(Murata LDB15C500A2400 Balun on RF Port)
Evaluation Board Description
The SKY73009 Evaluation Board is used to test the performance
of the SKY73009 direct quadrature demodulator. There are three
Evaluation Boards for this device, each configured for a specific
frequency range. Schematic diagrams and Bills of Materials
(BOMs) for each board are presented in the following Figures and
Tables:
Figure 55 and Table 5 (800-1000 MHz)
Figure 56 and Table 6 (1500-2500 MHz)
Figure 57 and Table 7 (custom frequency)
The Evaluation Board assembly diagram is shown in Figure 58
(800-1000 MHz), Figure 59 (1500-2500 MHz), and Figure 60
(custom frequency).
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration.
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY73009 direct quadrature
demodulator has special electrical and thermal grounding
requirements. This pad is the main thermal conduit for heat
dissipation. Since the circuit board acts as the heat sink, it
must shunt as much heat as possible from the device. As
such, design the connection to the ground pad to dissipate the
maximum wattage produced to the circuit board.
3. Two external output bypass capacitors are required on the
VCC pin. The values of these capacitors will change with
respect to the desired RF frequency. One capacitor should be
used for low frequency bypassing and the other capacitor for
high frequency bypassing. Special attention should be given
so that the smaller value capacitor does not go into self-
resonance at the desired RF frequency.
4. The RF input must be driven differentially. A 1:1 impedance
ratio balun is recommended with a center tap on the
secondary side that is DC grounded.
Testing Procedure
Use the following procedure to set up the SKY73009 Evaluation
Board for testing. Refer to Figure 61 for guidance:
1. Connect a +3.0 VDC power supply using an insulated supply
cable. If available, enable the current limiting function of the
power supply to 100 mA.
2. Connect a signal generator to the RF signal input port. Set it to
the desired RF frequency at a power level of 0 dBm to the
Evaluation Board but do NOT enable the RF signal.
3. Connect a signal generator to the LO signal input port. Set to
the desired LO frequency at a power level of 0 dBm, but do
not enable.
4. Connect a spectrum analyzer to the IFI signal output port and
terminate the IFQ signal input port in 50
.
5. Enable the power supply.
6. Enable the LO input signal.
7. Enable the RF signal.
8. Take measurements and repeat these steps for channel Q.
CAUTION: If any of the input signals exceed the rated maximum
values, the SKY73009 Evaluation Board can be
permanently damaged.
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S181
J1
2-Pin Header
T2
T1
T3
J5
SMA
I_IF
Q_IF
J2
SMA
GND
C1
33 pF
R1
0
C2
1000 pF
GND
GND
GND
VCC
VCC
VCC
GND
GND
GND
GND
IFIP
GND
IFIN
GND
IFQP
GND
IFQN
GND
GND
RF+
RF
GND
U1
SKY73009
GND
GND
1
2
1
5
2
1
J3
SMA
1
J4
SMA
1
4
32
1
2
3
4
5
6
7
8
9
25
3
2
1
6
4
3
2
1
6
4
24
23
22
21
20
19
18
17
31
30
29
28
27
26
GND
GND
GND
LO
GND
GND
GND
10
11
12
13
14
15
16
1
3
6
Figure 55. SKY73009 Evaluation Board Schematic (800-1000 MHz)
Table 5. SKY73009 Evaluation Board Component Values (800-1000 MHz)
Reference
Designator
Quantity Value
Manufacturer
Part
Number
C1
1
33 pF (0603)
C2
1
1000 pF (0603)
J1
1
Two-pin header connector
J2 1
SMA
connector
J3 1
SMA
connector
J4 1
SMA
connector
J5 1
SMA
connector
R1 1
0
(0603)
T1
1
1:1 (800-1000 MHz)
Murata
LDB31900M05C-417
T2 1
9:1
Mini-Circuits
TCM-9-1
T3 1
9:1
Mini-Circuits
TCM-9-1
U1 1
Skyworks
SKY73009-11
DATA SHEET SKY73009 DEMODULATOR
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15
S731
J1
2-Pin Header
T2
T1
T3
J5
SMA
I_IF
Q_IF
J2
SMA
GND
C1
33 pF
R1
0
C2
1000 pF
GND
GND
GND
VCC
VCC
VCC
GND
GND
GND
GND
IFIP
GND
IFIN
GND
IFQP
GND
IFQN
GND
GND
RF+
RF
GND
U1
SKY73009
GND
GND
1
2
2, 5
1
1
J3
SMA
1
J4
SMA
1
3
32
1
2
3
4
5
6
7
8
9
25
3
2
1
6
4
3
2
1
6
4
24
23
22
21
20
19
18
17
31
30
29
28
27
26
GND
GND
GND
LO
GND
GND
GND
10
11
12
13
14
15
16
1
4
Figure 56. SKY73009 Evaluation Board Schematic (1500-2500 MHz)
Table 6. SKY73009 Evaluation Board Component Values (1500-2500 MHz)
Reference
Designator
Quantity Value
Manufacturer
Part
Number
C1
1
33 pF (0603)
C2
1
1000 pF (0603)
J1
1
Two-pin header connector
J2 1
SMA
connector
J3 1
SMA
connector
J4 1
SMA
connector
J5 1
SMA
connector
R1 1
0
(0603)
T1
1
1:1 (1500-1700 MHz), or
1:1 (1800-2000 MHz), or
1:1 (2300-2500 MHz)
Murata LDB211G6005C-001
LDB211G9005C-001
LDB211G4005C-001
T2 1
9:1
Mini-Circuits
TCM-9-1
T3 1
9:1
Mini-Circuits
TCM-9-1
U1 1
Skyworks
SKY73009-11
DATA SHEET SKY73009 DEMODULATOR
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February 13, 2006 Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice 103034F
S732
J1
2-Pin Header
T2
L1
L2
T1
ETC1-1-13
T3
J5
SMA
I_IF
Q_IF
J2
SMA
GND
C1
33 pF
C3
1000 pF
R1
0
C2
1000 pF
GND
GND
GND
VCC
VCC
VCC
GND
GND
GND
GND
IFIP
GND
IFIN
GND
IFQP
GND
IFQN
GND
GND
RF+
RF
GND
U1
SKY73009
GND
GND
1
2
4
5
3
1
1
J3
SMA
1
J4
SMA
1
32
1
2
3
4
5
6
7
8
9
25
3
2
1
6
4
3
2
1
6
4
24
23
22
21
20
19
18
17
31
30
29
28
27
26
GND
GND
GND
LO
GND
GND
GND
10
11
12
13
14
15
16
1
Figure 57. SKY73009 Evaluation Board Schematic (Custom Frequency)
Table 7. SKY73009 Evaluation Board Component Values (Custom Frequency)
Reference
Designator
Quantity Value
Manufacturer
Part
Number
C1
1
33 pF (0603)
C2
1
1000 pF (0603)
C3
1
33 pF (0603)
J1
1
Two-pin header connector
J2 1
SMA
connector
J3 1
SMA
connector
J4 1
SMA
connector
J5 1
SMA
connector
L1
1
Adjusted for best match at
desired frequency
L2
1
Adjusted for best match at
desired frequency
R1 1
0
(0603)
T1
1
1:1 (4.5-3000 MHz)
M/A-Com
ETC1-1-13
T2 1
9:1
Mini-Circuits
TCM-9-1
T3 1
9:1
Mini-Circuits
TCM-9-1
U1 1
Skyworks
SKY73009-11
DATA SHEET SKY73009 DEMODULATOR
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17
S733
J2
J1
C3
J3
J4
J5
Component Placement
Top Layer
Bottom Layer
C1 C2
T1
T2
T3
Figure 58. SKY73009 Evaluation Board Assembly Diagram 800-1000 MHz
DATA SHEET SKY73009 DEMODULATOR
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February 13, 2006 Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice 103034F
Component Placement
Top Layer
Bottom Layer
S734
J2
J3
J4
J5
J1
C1 C2
T1
T2
T3
C3
Figure 59. SKY73009 Evaluation Board Assembly Diagram 1500-2500 MHz
DATA SHEET SKY73009 DEMODULATOR
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19
Component Placement
Top Layer
Bottom Layer
S735
J2
J3
J4
J5
J1
C1
R1
T3
T2
T1
C2
C3
L2
L1
Figure 60. SKY73009 Evaluation Board Assembly Diagram Custom Frequency
DATA SHEET SKY73009 DEMODULATOR
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20
February 13, 2006 Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice 103034F
RF
VCC GND
LO
IFI
IFQ
SKY73009
Evaluation Board
C1471
50
Power
Supply
Spectrum
Analyzer
Signal
Generator
Signal
Generator
Figure 61. SKY73009 Evaluation Board Testing Configuration
C1285a
Top View
Side View
Bottom View
Detail A
5.04 0.05
Solder Mask
2.480
To Metal Pad Edge
2.480
T
o
Metal P
ad Edge
2.350
0.300
2.000
Detail A
Mold
Substrate
0.150 Pin #1 Mark
Downset Paddle
Exposed Metal
Solder Mask
0.040 Ref.
Package Edge
Pin #1
5.04 0.05
1.00 0.10
0.30 0.05
0.38 0.05
(32x)
0.300 0.02
(32x)
0.400 0.05
(32x)
4.200
2.350
0.500
0.500
All measurements are in millimeters
Figure 62. SKY73009 32-Pin RFLGA Package Dimensions
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21
S461
Notes:
1. Carrier tape: black conductive polystyrene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
4. All dimensions are in millimeters
A
B
2.00 0.05
1.55 0.05
0.30 0.05
5
o
Max.
5
o
Max.
5.35
1.75 0.10
1.50 Min.
5.50 0.05
8.00
4.00
A
B
B
A
1.70
12.00 0.30
5.35
Pin #1
Indicator
Figure 63. SKY73009 32-Pin RFLGA Tape and Reel Dimensions
DATA SHEET SKY73009 DEMODULATOR
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February 13, 2006 Skyworks Proprietary and Confidential information Products and Product Information are Subject to Change Without Notice 103034F
Ordering Information
Model Name
Manufacturing Part Number
Evaluation Kit Part Number
SKY73009 400-3000 MHz Direct Quadrature Modulator
SKY73009-11
TW11-D982 (tuned for 800 to 1000 MHz)
TW11-D992 (tuned for 1800 to 2000 MHz)
TW12-D275 (custom frequency board)
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by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
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THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR
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Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
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