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Электронный компонент: CXG1194UR

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1
CXG1194UR
14 pin UQFN (Plastic)
SP4T Antenna Switch for GSM
Description
The CXG1194UR is a high power SP4T antenna
switch for GSM applications. The low insertion loss on
transmit means increased talk time as the Tx power
amplifier can be operated at a lower output level. On-
chip logic reduces component count and simplifies the
PCB layout by allowing direct connection of the switch
to digital baseband control lines with the CMOS logic
levels. This switch is SP4T, one antenna can be
routed to either of the 2Tx or 2Rx ports. It requires 2
CMOS control lines. The Sony GaAs JPHEMT MMIC
process is used for low insertion loss.
Features
Insertion loss (Tx):
0.35dB (Typ.) at 34dBm (GSM900)
0.45dB (Typ.) at 32dBm (GSM1800)
Small package size: 14-pin UQFN (2.5mm
2.5mm
0.6mm (Max.))
Applications
GSM dual-band handsets
GSM/UMTS dual-mode handsets
Structure
GaAs JPHEMT MMIC
Absolute Maximum Ratings
Bias voltage
V
DD
7V (Ta = 25C)
Control voltage
Vctl
5V (Ta = 25C)
Input power max. (ANT, RF1, RF4)
37dBm (Ta = 25C)
Input power max. (RF2, RF3)
15dBm (Ta = 25C)
Operating temperature
35 to +85
C
Storage temperature
65 to +150
C
GaAs MMICs are ESD sensitive devices. Special handling precautions are required.
The actual ESD test data will be available later.
E04712-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
2
CXG1194UR
Block Diagram
Pin Configuration
F6
F7
F8
F5
RF1 (Tx)
RF2 (Rx)
RF3 (Rx)
RF4 (Tx)
ANT
F1
F2
F3
F4
1
2
3
10
11
12
13
7
6
5
9
8
14
4
ANT
GND
GND
CTLB
GND
RF4
GND
RF3
CTLA
V
DD
GND
RF2
GND
RF1
3
CXG1194UR
Truth Table
F8
ON
ON
ON
OFF
F7
ON
ON
OFF
ON
F6
ON
OFF
ON
ON
F5
OFF
ON
ON
ON
F4
OFF
OFF
OFF
ON
F3
OFF
OFF
ON
OFF
F2
OFF
ON
OFF
OFF
F1
ON
OFF
OFF
OFF
CTLB
L
L
H
H
CTLA
L
H
L
H
Path
ANT RF1
ANT RF2
ANT RF3
ANT RF4
Electrical Characteristics
(Ta = 25C)
Unit
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
--
--
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
A
mA
Max.
0.50
0.65
0.60
0.70
0.60
0.70
0.50
0.65
28
28
30
33
30
30
30
34
40
0.23
Typ.
0.35
0.45
0.45
0.55
0.45
0.55
0.35
0.45
30
26
35
30
35
30
35
30
1.2
1.2
33
34
35
37
34
35
35
38
15
0.12
Min.
25
22
30
25
30
25
30
25
36
34
Condition
824 to 960MHz
1710 to 1990MHz
824 to 960MHz
1710 to 1990MHz
824 to 960MHz
1710 to 1990MHz
824 to 960MHz
1710 to 1990MHz
824 to 960MHz
1710 to 1990MHz
824 to 960MHz
1710 to 1990MHz
824 to 960MHz
1710 to 1990MHz
824 to 960MHz
1710 to 1990MHz
824 to 960MHz
1710 to 1990MHz
1
2
1
2
1
2
Vctl = 2.8V
V
DD
= 2.8V
Port
ANT RF1
ANT RF2
ANT RF3
ANT RF4
ANT RF1
ANT RF2
ANT RF3
ANT RF4
ANT RF1
ANT RF4
ANT RF1, 4
ANT RF1, 4
Symbol
IL
ISO.
VSWR
2fo
3fo
2fo
3fo
2fo
3fo
2fo
3fo
P
1dB
Ictl
I
DD
Item
Insertion loss
Isolation
VSWR
Harmonics
P
1dB
compression input
power
Control current
Supply current
4
CXG1194UR
Electrical Characteristics are measured with all the RF ports terminated in 50
.
Harmonics measured with Tx inputs harmonically matched. It is recommended that the harmonic matching is
used to ensure optimum performance.
1
Pin = 34dBm, 824 to 915MHz, V
DD
= 2.8V
2
Pin = 32dBm, 1710 to 1910MHz, V
DD
= 2.8V
DC Bias Condition
(Ta = 25C)
Item
Vctl (H)
Vctl (L)
V
DD
Min.
2.0
0
2.6
Typ.
2.8
--
2.8
Max.
3.6
0.4
3.6
Unit
V
V
V
5
CXG1194UR
Recommended Circuit
When using this IC, the following external components should be used:
C
RF
: This capacitor is used for RF decoupling and must be used all applications.
Cbypass: This capacitor is used for DC line filtering. 100pF is recommended.
C
RF
C
RF
C
RF
C
RF
C
RF
1
2
3
10
11
12
13
7
6
5
9
8
14
4
CTLB
Cbypass
Cbypass
Cbypass
CTLA
V
DD
GND
GND
RF2
RF4
GND
RF3
GND
ANT
GND
GND
RF1
6
CXG1194UR
Package Outline Unit: mm
Sony Corporation
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
COPPER ALLOY
SOLDER COMPOSITION
Sn-Bi Bi:1-4wt%
PLATING THICKNESS
5-18m
SPEC.
SONY CODE
EIAJ CODE
JEDEC CODE
UQFN-14P-01
14PIN UQFN (PLASTIC)
TERMINAL SECTION
Note:Cutting burr of lead are 0.05mm MAX.
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
PACKAGE STRUCTURE
PACKAGE MASS
C
S
S
3
A
B
C
A-B
S
C
S
A-B
M
S
PIN 1 INDEX
10
11
14
1
4
7
2.5
8
2.5
0.55 0.05
0.4 0.08
x4
0.05
4-R0.2
8-C0.1
0.24
0.5
1.1
0.05
0.05
0.1 MIN
0.1
0.24
+0.09
-0.03
0.23 0.025
0.018 MAX
Solder Plating
0.02g