1
E01X23-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ICX423AL
20 pin DIP (Ceramic)
Diagonal 11mm (Type 2/3) CCD Image Sensor for CCIR B/W Video Cameras
Description
The ICX423AL is an interline CCD solid-state image
sensor suitable for CCIR B/W video cameras with a
diagonal 11mm (Type 2/3) system. Compared with the
current product ICX083AL, basic characteristics such
as sensitivity and smear are improved drastically and
high saturation characteristics are realized.
This chip features a field period readout system and
an electronic shutter with variable charge-storage
time. This chip is compatible with the pins of the
ICX083AL and has the same drive conditions.
Features
High sensitivity (+3.0dB compared with the ICX083AL)
Low smear (10.0dB compared with the ICX083AL)
High saturation signal (+2.0dB compared with the ICX083AL)
High resolution and Low dark current
Excellent antiblooming characteristics
Continuous variable-speed shutter
Device Structure
Interline CCD image sensor
Optical size:
Diagonal 11mm (Type 2/3)
Number of effective pixels: 752 (H)
582 (V) approx. 440K pixels
Total number of pixels:
795 (H)
596 (V) approx. 470K pixels
Chip size:
10.25mm (H)
8.5mm (V)
Unit cell size:
11.6m (H)
11.2m (V)
Optical black:
Horizontal (H) direction: Front 3 pixels, rear 40 pixels
Vertical (V) direction:
Front 12 pixels, rear 2 pixels
Number of dummy bits:
Horizontal 22
Vertical 1 (even fields only)
Substrate material:
Silicon
Optical black position
(Top View)
2
12
V
H
Pin 1
Pin 11
40
3
2
ICX423AL
Block Diagram and Pin Configuration
(Top view)
Horizontal Register
Output Unit
Note)
Note) : Photo sensor
GND
V
DD
SUB
RG
H
1
V
e
r
tical Register
HIS
V
OUT
V
4
V
3
V
2
V
1
V
L
GND
V
GG
V
SS
GND
RD
H
2
V
L
7
9
10
11
12
13
14
15
16
17
18
19
20
6
5
4
3
2
1
Pin Description
Pin No. Symbol
Description
1
2
3
4
5
6
7
8
9
10
V
4
V
3
V
2
SUB
GND
V
1
V
L
NC
GND
V
DD
Signal output
Output amplifier gate bias
Output amplifier source
GND
Reset drain
Reset gate clock
Protective transistor bias
Horizontal register transfer clock
Horizontal register transfer clock
Horizontal register input source bias
Description
Pin No.
Symbol
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Substrate (overflow drain)
GND
Vertical register transfer clock
Protective transistor bias
GND
Output amplifier drain power
11
12
13
14
15
16
17
18
19
20
V
OUT
V
GG
V
SS
GND
RD
RG
V
L
H
1
H
2
HIS
3
ICX423AL
Absolute Maximum Ratings
Item
HIS, V
DD
, RD, V
OUT
, V
SS
GND
HIS, V
DD
, RD, V
OUT
, V
SS
SUB
Vertical clock input pins GND
Vertical clock input pins SUB
Substrate voltage SUB GND
Supply voltage
Vertical clock input
voltage
Voltage difference between vertical clock input pins
Voltage difference between horizontal clock input pins
H
1
, H
2
V
4
H
1
, H
2
, RG, V
GG
GND
H
1
, H
2
, RG, V
GG
SUB
V
L
SUB
V
1
, V
3
, HIS, V
DD
, RD, V
OUT
V
L
RG V
L
V
2
, V
4
, V
GG
, V
SS
, H
1
, H
2
VL
Storage temperature
Operating temperature
0.3 to +55
0.3 to +20
55 to +10
15 to +20
to +10
to +15
to +17
17 to +17
10 to +15
55 to +10
65 to +0.3
0.3 to +30
0.3 to +24
0.3 to +20
30 to +80
10 to +60
V
V
V
V
V
V
V
V
V
V
V
V
V
V
C
C
1
Ratings
Unit
Remarks
1
27V (Max.) when clock width < 10s, clock duty factor < 0.1%.
Output amplifier drain voltage
Reset drain voltage
Output amplifier gate voltage
Output amplifier source
Substrate voltage adjustment range
Substrate voltage adjustment precision
Reset gate clock voltage adjustment range
Reset gate clock voltage adjustment precision
Protective transistor bias
Horizontal register input source bias
Item
V
DD
V
RD
V
GG
V
SS
V
SUB
V
SUB
V
RGL
V
RGL
V
L
V
HIS
Symbol
14.7
14.7
3.8
9
3
0
3
11
14.7
Min.
V
V
V
V
%
V
%
V
V
Unit
V
RD
= V
DD
5%
2
2
3
V
HIS
= V
DD
Remarks
Typ.
Max.
15.0
15.0
4.2
10.5
15.0
15.3
15.3
4.6
19
+3
3.0
+3
10
15.3
Bias Conditions
Ground with 750
resistor
4
ICX423AL
DC Characteristics
Output amplifier drain current
Input current
Input current
Item
I
DD
I
IN1
I
IN2
Symbol
6
Min.
Unit
Remarks
Typ.
Max.
mA
A
A
1
10
2
Indications of substrate voltage (V
SUB
) and reset gate clock voltage (V
RGL
) setting value
The setting value of the substrate voltage and reset gate clock voltage are indicated on the back of the
image sensor by a special code. Adjust the substrate voltage (V
SUB
) and reset gate clock voltage (V
RGL
) to
the indicated voltage. The adjustment precision is 3%.
V
SUB
code -- one character indication
V
RGL
code -- one character indication
V
RGL
code
V
SUB
code
"Code" and optimal setting correspond to each other as follows.
<Example> "5K"
V
RGL
= 2.0V
V
SUB
= 12.0V
V
SUB
code
Optimal setting
D
9.0
4
5
E
9.5
f
10.0
G
10.5
h
11.0
J
11.5
K
12.0
L
12.5
m
13.0
N
13.5
P
14.0
Q
14.5
R
15.0
S
15.5
T
16.0
U
16.5
V
17.0
W
17.5
X
18.0
Y
18.5
Z
19.0
V
RGL
code
Optimal setting
1
0
2
0.5
3
1.0
4
1.5
5
2.0
6
2.5
7
3.0
3
This must no exceed the V
VL
voltage of the vertical clock waveform.
4
1) Current to each pin when 20V is applied to V
DD
, RD, V
OUT
, V
SS
, HIS and SUB pins, while pins that are
not tested are grounded.
2) Current to each pin when 20V is applied sequentially to V
1
, V
2
, V
3
and V
4
pins, while pins that are
not tested are grounded. However, 20V is applied to SUB pin.
3) Current to each pin when 15V is applied sequentially to H
1
, H
2
, RG and V
GG
pins, while pins that are
not tested are grounded. However, 15V is applied to SUB pin.
4) Current to V
L
pin when 30V is applied to V
1
, V
3
, HIS, V
DD
, RD and V
OUT
pins or when, 24V is applied
to RG pin or when, 20V is applied to V
2
, V
4
, V
GG
, V
SS
, H
1
and H
2
pins, while V
L
pin is grounded.
However, GND and SUB pins are left open.
5
Current to SUB pin when 55V is applied to SUB pin, while pins that are not tested are grounded.
5
ICX423AL
Clock Voltage Conditions
1
The reset gate clock voltage need not be adjusted when the reset gate clock is driven when the
specifications are as given below. In this case, the reset gate clock voltage setting indicated on the back of
the image sensor has not significance.
Readout clock voltage
Vertical transfer clock
voltage
Horizontal transfer
clock voltage
Reset gata clock
voltage
Substrate clock voltage
Item
V
VT
V
VH1
, V
VH2
,
V
VH3
, V
VH4
V
VL1
, V
VL2
,
V
VL3
, V
VL4
V
V
| V
VH1
V
VH2
|
V
VH3
V
VH
V
VH4
V
VH
V
VHH
V
VHL
V
VLH
V
VLL
V
H
V
HL
V
RG
V
RGL
V
SUB
Symbol
14.5
0.6
8.9
0.5
0.5
6.0
3.5
6.0
0
27.0
Min.
15.0
9.6
Typ.
15.5
0
0.2
0
0
0.8
1.0
0.8
0.8
8.0
3.0
13.0
3.0
32.0
Max.
Unit
1
2
2
2
2
2
2
2
2
2
2
3
3
3
3
4
Waveform
diagram
V
VH
= (V
VH1
+ V
VH2
)/2
V
VL
= (V
VL3
+ V
VL4
)/2
V
V
=
V
VH
n
V
VL
n (n = 1 to 4)
High-level coupling
High-level coupling
Low-level coupling
Low-level coupling
1
Remarks
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Reset gate clock
voltage
Item
V
RGL
V
RG
Symbol
0.2
8.5
Min.
0
9.0
Typ.
0.2
9.5
Max.
Unit
3
3
Waveform
diagram
Remarks
V
V
6
ICX423AL
Horizontal transfer clock equivalent circuit
Vertical transfer clock equivalent circuit
H
1
H
2
C
H1
C
H2
C
HH
R
H
R
H
V
1
C
V12
V
2
V
4
V
3
C
V34
C
V23
C
V41
C
V13
C
V24
C
V1
C
V2
C
V4
C
V3
R
GND
R
4
R
1
R
3
R
2
Clock Equivalent Circuit Constant
C
V1
, C
V3
C
V2
, C
V4
C
V12
, C
V34
C
V23
, C
V41
C
V13
C
V24
C
H1
, C
H2
C
HH
C
RG
C
SUB
R
1
, R
2
, R
3
, R
4
R
GND
R
H
Symbol
Capacitance between vertical transfer
clock and GND
Capacitance between vertical transfer
clocks
Capacitance between horizontal
transfer clock and GND
Capacitance between horizontal
transfer clocks
Capacitance between reset gate clock
and GND
Capacitance between substrate clock
and GND
Vertical transfer clock series resistor
Vertical transfer clock ground resistor
Horizontal transfer clock series resistor
Item
Min.
2700
2700
2600
950
1000
500
47
58
7
800
22
3
10
Typ.
Max.
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Unit
Remarks
7
ICX423AL
Drive Clock Waveform Conditions
(1) Readout clock waveform
(2) Vertical transfer clock waveform
V
VH
= (V
VH1
+ V
VH2
)/2
V
VL
= (V
VL3
+ V
VL4
)/2
V
V
= V
VH
n V
VL
n (n = 1 to 4)
100%
90%
10%
0%
tr
tf
0V
twh
M
2
M
V
VT
V
VH1
V
VHH
V
VHL
V
VH
V
VLH
V
VL1
V
VLL
V
VHL
V
VHH
V
VL
V
VHH
V
VH
V
VLH
V
VLL
V
VL
V
VHL
V
VL3
V
VHL
V
VH3
V
VHH
V
VH2
V
VHH
V
VHH
V
VHL
V
VHL
V
VH
V
VLH
V
VL2
V
VLL
V
VL
V
VH
V
VL
V
VHL
V
VLH
V
VLL
V
VHL
V
VH4
V
VHH
V
VHH
V
VL4
V
1
V
3
V
2
V
4
8
ICX423AL
(3) Horizontal transfer clock waveform Reset gate clock waveform
(4) Substrate clock waveform
100%
90%
10%
0%
V
SUB
tr
tf
twh
M
2
M
V
SUB
tr
twh
tf
90%
10%
twl
V
H
, V
RG
V
HL
, V
RGL
Clock Switching Characteristics
Min.
twh
Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
twl
tr
tf
2.3
11
1.5
2.5
62.6
1.3
20
5.38
13
1.8
0.74
62.1
20
5.38
51
0.5
0.1
0.1
15
0.01
0.01
2.0
19
0.5
0.5
0.1
0.1
15
0.01
0.01
2.0
19
0.5
Unit
s
s
s
ns
s
s
ns
s
Remarks
During readout
During imaging
During imaging
During drain
charge
Item
Readout clock
Vertical transfer
clock
Horizontal
transfer clock
Reset gate
clock
Substrate clock
Symbol
V
T
V
1
, V
2
V
3
, V
4
H
H
1
H
2
RG
SUB
During
parallel-serial
conversion
9
ICX423AL
Image Sensor Characteristics
(Ta = 25C)
Item
Sensitivity
Saturation signal
Smear
Video signal shading
Dark signal
Dark signal shading
Flicker
Lag
Symbol
S
Vsat
Sm
SH
Vdt
Vdt
F
Lag
Min.
700
1000
Typ.
1000
130
Max.
120
25
2
1
5
0.5
Unit
mV
mV
dB
%
mV
mV
%
%
Measurement method
1
2
3
4
5
6
7
8
Remarks
Ta = 60C
Ta = 60C
Ta = 60C
Image Sensor Characteristics Measurement Method
Measurement conditions
1) In the following measurements, the substrate voltage and the reset gate clock voltage are set to the values
indicated on the device, and the device drive conditions are at the typical values of the bias and clock
voltage conditions.
2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical
black (OB) level is used as the reference for the signal output, and the value measured at point [
A] in the
drive circuit example is used.
Definition of standard imaging conditions
1) Standard imaging condition
I
:
Use a pattern box (luminance 706cd/m
2
, color temperature of 3200K halogen source) as a subject. (Pattern
for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.00mm) as an IR cut filter
and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the
standard sensitivity luminous intensity.
2) Standard imaging condition
II
:
Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens with CM500S (t = 1.00mm) as an IR cut filter. The luminous intensity is adjusted
to the value indicated in each testing item by the lens diaphragm.
1. Sensitivity
Set to standard imaging condition
I
. After selecting the electronic shutter mode with a shutter speed of 1/250s,
measure the signal output (Vs) at the center of the screen and substitute the value into the following formula.
S = Vs
[mV]
2. Saturation signal
Set to standard imaging condition
II
. After adjusting the luminous intensity to 10 times the intensity with
average value of signal output, 350mV, measure the minimum value of the signal output.
250
50
10
ICX423AL
Light
Signal output 350mV
Vlag (lag)
FLD
V1
Strobe light
timing
Output
1
10
1
500
VSm
350
3. Smear
Set to standard imaging condition
II
. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to
500 times the intensity with average value of the signal output, 350mV. When the readout clock is stopped
and the charge drain is executed by the electronic shutter at the respective H blankings, measure the
maximum value (VSm [mV]) of the signal output and substitute the value into the following formula.
Sm = 20
log
100 [dB] (1/10V method conversion value)
4. Video signal shading
Set to standard imaging condition
II
. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so
that the average value of the signal output is 350mV. Then measure the maximum (Vmax [mV]) and
minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula.
SH = (Vmax Vmin)/350
100 [%]
5. Dark signal
Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and
the device in the light-obstructed state, using the horizontal idle transfer level as a reference.
6. Dark signal shading
After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark
signal output and substitute the values into the following formula.
Vdt = Vdmax Vdmin [mV]
7. Flicker
Set to standard imaging condition
II
. Adjust the luminous intensity so that the average value of the signal
output is 350mV, and then measure the difference in the signal level between fields (
Vf [mV]). Then
substitute the value into the following formula.
F = (
Vf/350)
100 [%]
8. Lag
Adjust the signal output value generated by strobe light to 350mV. After setting the strobe light so that it
strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following
formula.
Lag = (Vlag/350)
100 [%]
11
ICX423AL
Drive Cir
cuit
30V
15V
XSUB
9V
5V
XV1
XSG1
XV2
XV4
XSG2
XV3
11V
H2
H1
RG
6V
0.1
0.01
22/20V
3.3/25V
56k
27k
3.3/
16V
270k
15k
15k
47k
3.3/35V
0.01
1000P
10k
15
15
22k
3.3/35V
2200P
1M
V
4
V
3
V
2
V
1
SUB
GND
V
L
NC
GND
V
DD
HIS
H
2
H
1
V
L
RG
RD
GND
V
SS
V
GG
V
OUT
3.3/16V
39k
3.3/16V
100k
100
CCD OUT
100k
10k
47k
10/10V
0.1
10
10
100k
100k
1/16V
33k
91k
0.1
0.1
0.1
0.1
2.2/16V
CXD1268M
33k
0.01
3.3/25V
3.3/
16V
750
3.3k
ICX423AL (BO
T
T
OM
VIEW)
39k
74A
C04
[
A]
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
11
12
13
14
15
16
17
18
19
20
12
ICX423AL
Spectral Sensitivity Characteristics (includes lens characteristics, excludes light source characteristics)
Sensor Readout Clock Timing Chart
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
500
600
700
800
900
1000
400
Wave Length [nm]
Relativ
e Response
Unit: s
Odd Field
Even Field
V1
V2
V3
V4
V1
V2
V3
V4
2.5
2.6 2.5 2.5
33.6
1.5
0.2
13
ICX423AL
Drive Timing
Char
t
(V
er
tical
Sync)
FLD
VD
BLK
HD
V1
V2
V3
V4
CCD
OUT
620
625
1
2
3
4
5
15
20
310
320
335
330
340
581
582
13
5
24
6
135
246
582
581
2
1
4
3
6
5
10
315
325
2
1
4
3
6
5
25
14
ICX423AL
Drive
Timing Char
t (Horizontal Sync)
745
750
1
3
5
10
20
30
40
1
2
3
5
10
20
22
1
2
3
1
2
3
10
20
752
HD
BLK
H1
H2
RG
V1
V2
V3
V4
SUB
15
ICX423AL
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering iron
with a ground wire and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero cross On/Off type and connect it to ground.
3) Dust and dirt protection
Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and
dirt. Clean glass plates with the following operation as required, and use them.
a) Operate in clean environments (around class 1000 is appropriate).
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces.
Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity
ionized air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
e) When a protective tape is applied before shipping, just before use remove the tape applied for
electrostatic protection. Do not reuse the tape.
4) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition
exceeding the normal using condition, consult our company.
5) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage
in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to too much mechanical
shocks.
16
ICX423AL
Sony Corporation
P
a
c
k
ag
e Outline
Unit:
mm
P
A
CKA
GE MA
TERIAL
LEAD TREA
TMENT
LEAD MA
TERIAL
P
A
CKA
GE MASS
DRA
WING NUMBER
Cer
amic
GOLD PLA
TING
5.90g
42 ALLO
Y
AS-A11(E)
P
A
CKA
GE STR
UCTURE
M
0.3
0.25
0.35
13.15
5.0
R3.0
6.0
2.54
1.27
0.46
5.5 0.2
26.0 0.25
3.2 0.3
20.32
20.2 0.3
0.5
1.0
2-
2-
D
A
(AT STAND OFF)
11
20
1
10
31.0 0.4
27.0 0.3
2-
2.50
+ 0.25
0
2.00
+ 0.15
0
(Reference Hole)
1Pin Index
(Elongated Hole)
2.00
+ 0.15
0
2.5
C
B
0 to 9
~
~
20 pin DIP (800mil)
1.
"
A
"
is the center of the effective image area.
2
.
The str
aight line
"
B
"
which passes through the center of the ref
erence hole and the elongated
hole is the ref
erence axis of v
e
r
tical direction (V).
3
.
The str
aight line
"
C
"
which passes through the center of the ref
erence hole at r
ight angle to v
e
r
tical
ref
erence line
"
B
"
is the ref
erence axis of hor
iz
ontal direction (H).
4
.
The bottom
"
D
"
is the height ref
erence
.(T
w
o
points are specified.)
5.
The center of the eff
ectiv
e image area specified relativ
e to the ref
erence hole
is (H,
V) = (13.15, 5.0) 0.15mm.
6
.
The angle of rotation relativ
e to the ref
erence line
"
B
"
is less than 1
7
.
The height from the bottom
"
D
"
to the eff
ectiv
e image area is 1.46 0.15mm.
8
.
The tilt of the eff
ectiv
e image area relativ
e to the bottom
"
D
"
is less than 60m.
9
.
The thic
kness of the co
v
er glass is 0.75mm and the refr
activ
e inde
x is 1.5.
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