1
E01Z29A25-PS
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ICX424AQ
16 pin DIP (Plastic)
Optical black position
(Top View)
2
8
V
H
Pin 1
Pin 9
31
2
Diagonal 6mm (Type 1/3) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras
Description
The ICX424AQ is a diagonal 6mm (Type 1/3) interline
CCD solid-state image sensor with a square pixel
array which supports VGA format. Progressive scan
allows all pixels signals to be output independently
within approximately 1/60 second. This chip features
an electronic shutter with variable charge-storage
time which makes it possible to realize full-frame still
images without a mechanical shutter. High sensitivity
and low dark current are achieved through the
adoption of the HAD (Hole-Accumulation Diode)
sensors.
This chip is suitable for applications such as FA
and surveillance cameras.
Features
Progressive scan allows individual readout of the image signals
from all pixels.
High vertical resolution still images without a mechanical shutter
Square pixel
Supports VGA format
Horizontal drive frequency: 24.54MHz
No voltage adjustments (reset gate and substrate bias are not
adjusted.)
R, G, B primary color mosaic filters on chip
High resolution, high color reproductivity, high sensitivity, low dark
current
Continuous variable-speed shutter
Low smear
Excellent anti-blooming characteristics
Horizontal register: 5.0V drive
16-pin high precision plastic package (enables dual-surface standard)
Device Structure
Interline CCD image sensor
Image size:
Diagonal 6mm (Type 1/3)
Number of effective pixels: 659 (H)
494 (V) approx. 330K pixels
Total number of pixels:
692 (H)
504 (V) approx. 350K pixels
Chip size:
5.79mm (H)
4.89mm (V)
Unit cell size:
7.4m (H)
7.4m (V)
Optical black:
Horizontal (H) direction: Front 2 pixels, rear 31 pixels
Vertical (V) direction:
Front 8 pixels, rear 2 pixels
Number of dummy bits:
Horizontal 16
Vertical 5
Substrate material:
Silicon
Wfine CCD is trademark of Sony corporation.
Represents a CCD adopting progressive scan, primary color filter and square pixel.
2
ICX424AQ
Block Diagram and Pin Configuration
(Top View)
Pin No.
Symbol
Description
Pin No.
Symbol
Description
1
2
3
4
5
6
7
8
V
3
V
2
V
1
NC
GND
C
GG
GND
V
OUT
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
GND
Output amplifier gate
1
GND
Signal output
9
10
11
12
13
14
15
16
V
DD
SUBCIR
GND
SUB
V
L
RG
H
1
H
2
Supply voltage
Supply voltage for the substrate
voltage generation
GND
Substrate clock
Protective transistor bias
Reset gate clock
Horizontal register transfer clock
Horizontal register transfer clock
Pin Description
1
DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance
of 1000pF.
Note)
Note) : Photo sensor
8
7
6
5
4
3
2
1
V
OUT
GND
C
GG
GND
NC
V
1
V
2
V
3
11
12
13
14
15
16
GND
10
SUBCIR
9
V
DD
SUB
V
L
RG
H
1
H
2
Horizontal register
V
e
r
tical register
B
G
B
G
B
G
G
R
G
R
G
R
B
G
B
G
B
G
G
R
G
R
G
R
3
ICX424AQ
Absolute Maximum Ratings
Item
V
DD
, V
OUT
, C
GG
, SUBCIR GND
V
DD
, V
OUT
, C
GG
, SUBCIR
SUB
V
1
, V
2
, V
3
GND
V
1
, V
2
, V
3
SUB
Substrate clock
SUB GND
Supply voltage
Clock input voltage
Voltage difference between vertical clock input pins
Voltage difference between horizongal clock input pins
H
1
, H
2
V
3
H
1
, H
2
GND
H
1
, H
2
SUB
V
L
SUB
V
2
, V
3
V
L
RG GND
V
1
, H
1
, H
2
, GND VL
Storage temperature
Performance guarantee temperature
Operating temperature
0.3 to +36
0.3 to +18
22 to +9
15 to +16
to +10
to +15
to +16
16 to +16
10 to +15
55 to +10
65 to +0.3
0.3 to +27.5
0.3 to +20.5
0.3 to +17.5
30 to +80
10 to +60
10 to +75
V
V
V
V
V
V
V
V
V
V
V
V
V
V
C
C
C
2
Ratings
Unit
Remarks
2
+24V (Max.) when clock width < 10s, clock duty factor < 0.1%.
+16V (Max.) is guaranteed for power-on and power-off.
4
ICX424AQ
Clock Voltage Conditions
Bias Conditions
1
V
L
setting is the V
VL
voltage of the vertical transfer clock waveform, or the same voltage as the V
L
power
supply for the V driver should be used.
2
Set SUBCIR pin to open when applying a DC bias to the substrate clock pin.
3
Do not apply a DC bias to the reset gate clock pins, because a DC bias is generated within the CCD.
DC Characteristics
Supply current
Item
I
DD
Symbol
7
Min.
Unit
Remarks
Typ.
Max.
mA
Readout clock voltage
Vertical transfer clock
voltage
Horizontal transfer
clock voltage
Reset gate clock
voltage
Substrate clock voltage
Item
V
VT
V
VH02
V
VH1
, V
VH2
, V
VH3
V
VL1
, V
VL2
, V
VL3
V
VL1
, V
VL2
, V
VL3
V
1
, V
2
, V
3
| V
VL1
V
VL3
|
V
VHH
V
VHL
V
VLH
V
VLL
V
H
V
HL
V
CR
V
RG
V
RGLH
V
RGLL
V
RGL
V
RGLm
V
SUB
Symbol
14.55
0.05
0.2
7.8
8.0
6.8
4.75
0.05
0.8
4.5
21.5
Min.
15.0
0
0
7.5
7.5
7.5
5.0
0
2.5
5.0
22.5
Typ.
15.45
0.05
0.05
7.2
7.0
8.05
0.1
1.0
2.3
1.0
1.0
5.25
0.05
5.5
0.8
0.5
23.5
Max.
Unit
1
2
2
2
2
2
2
2
2
2
2
3
3
3
4
4
4
5
Waveform
Diagram
V
VH
= V
VH02
V
VL
= V
VL1
(V
VL3
)/2
(During 24.54MHz)
V
VL
= V
VL1
(V
VL3
)/2
(During 12.27MHz)
High-level coupling
High-level coupling
Low-level coupling
Low-level coupling
Cross-point voltage
Low-level coupling
Low-level coupling
Remarks
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Supply voltage
Protective transistor bias
Substrate clock
Reset gate clock
Item
V
DD
V
L
SUB
RG
Symbol
15.0
1
2
3
Min.
V
Unit
Remarks
Typ.
Max.
14.55
15.45
9
5
ICX424AQ
Clock Equivalent Circuit Constants
C
V1
C
V2
C
V3
C
V12
C
V23
C
V31
C
H1
, C
H2
C
HH
C
RG
C
SUB
R
1
, R
2
R
3
R
GND
R
H1
, R
H2
R
RG
Symbol
Capacitance between vertical transfer clock and GND
Capacitance between vertical transfer clocks
Capacitance between horizontal transfer clock and GND
Capacitance between horizontal transfer clocks
Capacitance between reset gate clock and GND
Capacitance between substrate clock and GND
Vertical transfer clock series resistor
Vertical transfer clock ground resistor
Horizontal transfer clock series resistor
Reset gate clock series resistor
Item
Min.
3900
3300
3300
1000
1000
1000
47
30
6
560
33
18
100
10
39
Typ.
Max.
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Unit
Remarks
Horizontal transfer clock equivalent circuit
Reset gate clock equivalent circuit
Vertical transfer clock equivalent circuit
V
3
R
GND
C
V3
C
V1
C
V2
C
V23
C
V31
C
V12
R
3
R
1
R
2
V
2
V
1
H
1
H
2
C
H1
C
H2
C
HH
R
H2
R
H1
RG
R
RG
C
RG
6
ICX424AQ
Drive Clock Waveform Conditions
(1) Readout clock waveform
(2) Vertical transfer clock waveform
100%
90%
10%
0%
tr
tf
0V
twh
M
2
M
V
VT
Note) Readout clock is used by composing vertical transfer clocks V
2
and V
3
.
V
VLH
V
VL03
V
VLL
V
VH
= V
VH02
V
VL
= (V
VL01
+ V
VL03
)/2
V
VL3
= V
VL03
V
VL
V
VH1
V
VHH
V
VH
V
VHL
V
VLH
V
VL1
V
VL01
V
VL
V
VLL
V
VH3
V
VHH
V
VH
V
VHL
V
VLH
V
VL2
V
VLL
V
VL
V
VH
V
VHH
V
VH02
V
VH2
V
VHL
V
V1
= V
VH1
V
VL01
V
V2
= V
VH02
V
VL2
V
V3
= V
VH3
V
VL03
V
1
V
T
V
2
V
3
7
ICX424AQ
H
2
H
1
two
twh
tr
tf
90%
10%
twl
V
CR
V
HL
V
H
V
H
2
RG waveform
V
RGLH
V
RGLL
V
RGLm
V
RGH
tr
tf
twh
twl
V
RGL
Point A
V
RG
V
SUB
(A bias generated within the CCD)
100%
90%
10%
0%
tr
tf
twh
M
2
M
V
SUB
(3) Horizontal transfer clock waveform
Cross-point voltage for the H
1
rising side of the horizontal transfer clocks H
1
and H
2
waveforms is V
CR
.
The overlap period for twh and twl of horizontal transfer clocks H
1
and H
2
is two.
(4) Reset gate clock waveform
V
RGLH
is the maximum value and V
RGLL
is the minimum value of the coupling waveform during the period from
Point A in the above diagram until the rising edge of RG.
In addition, V
RGL
is the average value of V
RGLH
and V
RGLL
.
V
RGL
= (V
RGLH
+ V
RGLL
)/2
Assuming V
RGH
is the minimum value during the interval twh, then:
V
RG
= V
RGH
V
RGL
Negative overshoot level during the falling edge of RG is V
RGLm
.
(5) Substrate clock waveform
H
1
, H
2
RG
SUB
8
ICX424AQ
1
The overlap period of twh and twl of horizontal transfer clocks H
1
and H
2
is two.
Clock Switching Characteristics (Horizontal drive frequency: 24.54MHz)
Min.
twh
Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
twl
tr
tf
2.3
10.5
10.5
6
0.75
2.5
14.6
14.6
8
0.9
10.5
10.5
14.6
14.6
25.8
0.5
6.4
6.4
4
10.5
10.5
0.5
15
0.5
6.4
6.4
3
250
10.5
10.5
0.5
Unit
s
ns
ns
ns
s
Remarks
During
readout
When using
CXD3400N
tf
tr 2ns
During drain
charge
Item
Readout clock
Vertical transfer
clock
Horizontal
transfer clock
Reset gate clock
Substrate clock
Symbol
V
T
V
1
, V
2
,
V
3
H
1
H
2
RG
SUB
Min.
two
Typ. Max.
10.5 14.6
Unit
ns
Remarks
Item
Horizontal transfer clock
Symbol
H
1
, H
2
1
Clock Switching Characteristics (Horizontal drive frequency: 12.27MHz)
Min.
twh
Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
twl
tr
tf
4.6
24
26.5
11
1.5
5.0
30
31.5
13
1.8
25
25
31.5
30
62.5
0.5
10
10
3
17.5
15
0.5
15
0.5
10
10
3
350
17.5
15
0.5
Unit
s
ns
ns
ns
s
Remarks
During
readout
When using
CXD3400N
tf
tr 2ns
During drain
charge
Item
Readout clock
Vertical transfer
clock
Horizontal
transfer clock
Reset gate clock
Substrate clock
Symbol
V
T
V
1
, V
2
,
V
3
H
1
H
2
RG
SUB
Min.
two
Typ. Max.
21.5 25.5
Unit
ns
Remarks
Item
Horizontal transfer clock
Symbol
H
1
, H
2
1
9
ICX424AQ
Image Sensor Characteristics
(Ta = 25C)
Zone Definition of Video Signal Shading
Measurement System
Note) Adjust the amplifier gain so that the gain between [
A] and [
B], and between [
A] and [
C] equals 1.
Item
G Sensitivity
Sensitivity
comparison
Saturation signal
Smear
Video signal shading
Uniformity between
video signal channels
Dark signal
Dark signal shading
Line crawl G
Line crawl R
Line crawl B
Lag
Symbol
Sg
Rr
Rb
Vsat
Sm
SHg
Srg
Sbg
Vdt
Vdt
Lcg
Lcr
Lcb
Lag
Min.
600
0.4
0.3
500
Typ.
750
0.55
0.45
100
Max.
0.7
0.6
92
20
25
8
8
2
0.5
3.8
3.8
3.8
0.5
Unit
mV
mV
dB
%
%
%
%
mV
mV
%
%
%
%
Measurement
method
1
1
1
2
3
4
4
5
5
6
7
8
8
8
9
Remarks
1/30s accumulation
Ta = 60C
Zone 0 and
I
Zone 0 to
II
'
Ta = 60C
Ta = 60C
Note) All image sensor characteristic data noted above is for operation in 1/60s progressive scan mode.
12
V
10
12
12
10
Ignored region
Effective pixel region
Zone 0,
I
Zone
II
,
II
'
V
10
H
8
H
8
659 (H)
494 (V)
CCD
C.D.S
S/H
S/H
AMP
CCD signal output [
A]
Gr/Gb channel signal output [
B]
R/B channel signal output [
C]
Gr/Gb
R/B
10
ICX424AQ
Image Sensor Characteristics Measurement Method
Measurement conditions
(1) In the following measurements, the device drive conditions are at the typical values of the bias and clock
voltage conditions.
(2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical
black level (OB) is used as the reference for the signal output, which is taken as the value of the Gr/Gb
channel signal output or the R/B channel signal output of the measurement system.
Color coding of this image sensor & Readout
The primary color filters of this image sensor are arranged in
the layout shown in the figure on the left (Bayer arrangement).
Gr and Gb denote the G signals on the same line as the R
signal and the B signal, respectively.
Gb
B
Gb
B
R
Gr
R
Gr
Gb
B
Gb
B
R
Gr
R
Gr
Horizontal register
Color Coding Diagram
All pixels signals are output successively in a 1/60s period.
The R signal and Gr signal lines and Gb signal and B signal lines are output successively.
11
ICX424AQ
1. Progressive scan mode
In this mode, all pixel signals are output in non-interlace format in 1/60s.
All pixel signals within the same exposure period are read out simultaneously, making this mode suitable for
high resolution image capturing.
Image sensor readout mode
The diagram below shows the output methods for the following two readout modes.
(1) Progressive scan mode
2. Center scan mode
This is the center scan mode using the progressive scan method.
The undesired portions are swept by vertical register high-speed transfer, and the picture center portion is
cut out.
There are the mode (120 frames/s) which outputs 222 lines of an output line portion, and the mode
(240 frames/s) which outputs 76 lines.
(2) Center scan mode
Undesired portions (Swept by vertical register high-speed transfer)
Picture center cut-out portion
V
OUT
R
G
R
R
G
G
B
B
G
G
12
ICX424AQ
Definition of standard imaging conditions
(1) Standard imaging condition
I
:
Use a pattern box (luminance: 706cd/m
2
, color temperature of 3200K halogen source) as a subject.
(Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR
cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined
as the standard sensitivity testing luminous intensity.
(2) Standard imaging condition
II
:
Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted
to the value indicated in each testing item by the lens diaphragm.
1. G Sensitivity,sensitivity comparison
Set to standard imaging condition
I
. After setting the electronic shutter mode with a shutter speed of
1/100s, measure the signal outputs (V
Gr,
V
Gb,
V
R
and
V
B
) at the center of each Gr, Gb, R and B channel
screens, and substitute the values into the following formula.
V
G
= (V
Gr
+ V
Gb
)/2
Sg = V
G
[mV]
Rr = V
R
/V
G
Rb = V
B
/V
G
2. Saturation signal
Set to standard imaging condition
II
. After adjusting the luminous intensity to 20 times the intensity with the
average value of the Gr signal output, 150mV, measure the minimum values of the Gr, Gb, R and B signal
outputs.
3. Smear
Set to standard imaging condition
II
. With the lens diaphragm at F5.6 to F8, first adjust the average value of
the Gr signal output to 150mV. Measure the average values of the Gr signal output, Gb signal output, R
signal output and B signal output (Gra, Gba, Ra and Ba), and then adjust the luminous intensity to 500
times the intensity with average value of the Gr signal output, 150mV. After the readout clock is stopped and
the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum
value (V
sm
[mV]), independent of the Gr, Gb, R and b signal outputs, and substitute the values into the
following formula.
Sm = 20
log
(
Vsm
)
[dB] (1/10V method conversion value)
4. Video signal shading
Set to standard imaging condition
II
. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so
that the average value of the Gr signal output is 150mV. Then measure the maximum (Grmax [mV]) and
minimum (Grmin [mV]) values of the Gr signal output and substitute the values into the following formula.
SHg = (Grmax Grmin)/150
100 [%]
100
30
1
500
Gra + Gba + Ra + Ba
4
1
10
13
ICX424AQ
5. Uniformity between video signal channels
After measuring 4, measure the maximum (Rmax [mV]) and minimum (Rmin [mV]) values of the R signal
and the maximum (Bmax [mV]) and minimum (Bmin [mV]) values of the B signal, and substitute the values
into the following formula.
Srg = | (Rmax Rmin)/150 |
100 [%]
Sbg = | (Bmax Bmin)/150 |
100 [%]
6. Dark signal
Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and
the device in the light-obstructed state, using the horizontal idle transfer level as a reference.
7. Dark signal shading
After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark
signal output and substitute the values into the following formula.
Vdt = Vdmax Vdmin [mV]
8. Line crawls
Set to standard imaging condition
II
. Adjust the luminous intensity so that the average value of the Gr signal
output is 150mV, and then insert R, G, and B filters and measure the difference between G signal lines
(
Glr, Glg, Glb [mV]).as well as the average value of the G signal output (Gar, Gag, Gab). Substitute the
values into the following formula.
Lci =
100 [%] (i = w, r, g, b)
9. Lag
Adjust the Gr signal output value generated by strobe light to 150mV. After setting the strobe light so that it
strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following
formula.
Lag = (Vlag/150)
100 [%]
Light
Signal output 150mV
Vlag (lag)
VD
V2
Strobe light
timing
Output
Gli
Gai
14
ICX424AQ
Drive Cir
cuit
XSUB
XV3
XSG3
XV2
XSG2
XV1
H
2
H
1
RG
CCD
OUT
7.5V
0.1
0.1
0.1
1000p
0.1
0.01
2200p
3.3/16V
3.3/20V
0.1
1/35V
100k
1M
4.7k
2SC4250
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
ICX424
(BO
TT
OM VIEW)
V
3
V
2
V
1
NC
GND
C
GG
GND
V
OUT
H
2
H
1
RG
V
L
SUB
GND
SUBCIR
V
DD
11
12
13
14
15
16
17
18
19
20
10
9
8
7
6
5
4
3
2
1
CXD3400N
15V
3.3V
15
ICX424AQ
Spectral Sensitivity Characteristics (Includes lens characteristics, excludes light source characteristics)
400
1.0
B
G
R
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
450
500
550
Wave Length [nm]
Relativ
e Response
600
650
700
16
ICX424AQ
Drive
Timing Char
t (V
e
r
tical Sync) Pr
ogressive Scan Mode
494
1
2
6
5
494
1
2
7
8
1
2
3
4
6
5
7
8
1
2
3
4
1
2
3
VD
HD
"a"
V1
V2
V3
OUT
525
510
1
7
508
510
1
525
7
17
ICX424AQ
Drive
Timing Char
t (V
e
r
tical Sync "a" Enlar
g
ed) Pr
ogressive Scan Mode/Center Scand Mode
"a" Enlar
g
e
d
12
12
12
12
12
12
12
12
12
12
12
12
50
62
520
582
H1
V1
V2
V3
18
ICX424AQ
Drive
Timing Char
t (Horizontal Sync) Pr
ogressive Scan Mode
1
1
36
36
1
1
12
1
36
24
12
12
1
1
24
36
1
1
1
12
3
780
1
1
35
1
123
125
107
72
1
16
CLK
H1
H2
SHP
SHD
V1
V2
V3
SUB
RG
37
19
ICX424AQ
Drive
Timing Char
t (V
e
r
tical Sync) Center Scan Mode 1
356
357
136
137
1
356
357
1
VD
HD
"d"
"
b"
"c"
V1
V2
V3
OUT
"a"
"d"
"
b"
"a"
246
245
261
262
1
2
3
4
5
6
7
8
20
21
24
246
245
261
262
1
2
3
4
5
6
7
8
20
ICX424AQ
Drive
Timing Char
t (Horizontal Sync) Center Scan Mode 1 (Frame Shift) ("b")
12
12
12
12
#1
12
12
12
12
12
12
12
12
H1
H2
V1
V2
V3
#142
35
72
10920 bits = 14H
21
ICX424AQ
Drive
Timing Char
t (Horizontal Sync) Center Scan Mode 1 (High-speed Sweep) ("d")
12
12
12
12
#1
12
12
12
12
12
12
12
12
H1
H2
V1
V2
V3
#167
35
72
12480 bits = 16H
22
ICX424AQ
Drive
Timing Char
t (V
e
r
tical Sync) Center Scan Mode 2
283
284
209
210
1
283
284
1
VD
HD
"d"
"
b"
"c"
V1
V2
V3
OUT
"a"
"d"
"
b"
"a"
106
105
130
131
1
2
3
4
5
6
7
8
30
27
26
129
106
105
130
131
1
2
3
4
5
6
7
8
129
23
ICX424AQ
Drive
Timing Char
t (Horizontal Sync) Center Scan Mode 2 (Frame Shift) ("b")
12
12
12
12
#1
12
12
12
12
12
12
12
12
H1
H2
V1
V2
V3
#215
35
72
15600 bits = 20H
24
ICX424AQ
Drive
Timing Char
t (Horizontal Sync) Center Scan Mode 2 (High-speed Sweep) ("d")
12
12
12
12
#1
12
12
12
12
12
12
12
12
H1
H2
V1
V2
V3
#255
35
72
18720 bits = 24H
25
ICX424AQ
Plactic package
Cover glass
Compressive strength
50N
50N
1.2Nm
Torsional strength
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensors.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W
soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount,
cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero-cross On/Off type and connect it to ground.
3) Dust and dirt protection
Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and
dirt. Clean glass plates with the following operations as required, and use them.
a) Perform all assembly operations in a clean room (class 1000 or less).
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
e) When a protective tape is applied before shipping, just before use remove the tape applied for
electrostatic protection. Do not reuse the tape.
4) Installing (attaching)
a) Remain within the following limits when applying a static load to the package. Do not apply any load
more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to
limited portions. (This may cause cracks in the package.)
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the
package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for
installation, use either an elastic load, such as a spring plate, or an adhesive.
26
ICX424AQ
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to other locations as a precaution.
d) The notch of the package is used for directional index, and that can not be used for reference of fixing.
In addition, the cover glass and seal resin may overlap with the notch of the package.
e) If the leads are bent repeatedly and metal, etc., clash or rub against the package, the dust may be
generated by the fragments of resin.
f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-
acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives.
(reference)
5) Others
a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high
luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the
image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a
case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off
mode should be properly arranged. For continuous using under cruel condition exceeding the normal
using condition, consult our company.
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
c) Brown stains may be seen on the bottom or side of the package. But this does not affect the CCD
characteristics.
27
ICX424AQ
Sony Corporation
P
a
c
k
ag
e Outline
Unit:
mm
0.3
16 pin DIP (450mil)
H
V
2.5
2.5
8.4
0.5
1.2
5.7
6.1
10.3
12.2
0.1
9.5
11.4 0.1
11.43
0.25
0 to 9
8
1
16
9
2-R0.5
2.5
11.6
9.2
2.5
1.2
3.35 0.15
3.1
1.27
3.5 0.3
0.46
0.3
1.27
0.69
(F
or the first pin only)
1.
"A"
is the center of the eff
e
ctiv
e image area.
2.
The tw
o points
"B"
of the pac
kage are the hor
iz
ontal ref
e
rence
.
The point
"B'"
of the pac
k
age is the v
e
r
tical ref
e
rence
.
3.
The bottom
"C"
of the pac
kage
, and the top of the co
v
e
r glass
"D"
are the height ref
e
rence
.
4.
The center of the eff
e
ctiv
e image area relativ
e to
"B"
and
"B'"
is (H,
V) = (6.1, 5.7) 0.15mm.
5.
The rotation angle of the eff
ectiv
e image area relativ
e to H and
V is 1
.
6.
The height from the bottom
"C"
to the eff
ectiv
e image area is 1.41 0.10mm.
The height from the top of the co
v
e
r glass
"D"
to the eff
ectiv
e image area is 1.94 0.15mm.
7.
The tilt of the eff
e
ctiv
e image area relativ
e to the bottom
"C"
is less than 50m.
The tilt of the eff
e
ctiv
e image area relativ
e to the top
"D"
of the co
v
e
r glass is less than 50m.
8.
The thic
kness of the co
v
er glass is 0.75mm, and the refr
activ
e inde
x is 1.5.
9.
The notches on the bottom of the pac
kage are used only f
o
r directional inde
x, the
y
m
u
st
not be used f
o
r ref
e
rence of fixing.
C
B
A
D
M
B'
~
~
~
P
A
CKA
GE STR
UCTURE
P
A
CKA
GE MA
TERIAL
LEAD TREA
TMENT
LEAD MA
TERIAL
P
A
CKA
GE MASS
DRA
WING NUMBER
Plastic
GOLD PLA
TING
42 ALLO
Y
AS-C2.2-01(E)
0.90g
PDF 
ZIP