STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
10135 - Rev A
DESCRIPTION
The CX-2-SM quartz crystals are leadless devices designed
for surface mounting on printed circuit boards or hybrid
substrates. They are hermetically sealed in a rugged,
miniature ceramic package. They are manufactured using
the STATEK-developed photolithographic process, and
were designed utilizing the experience acquired by
producing millions of crystals for industrial, commercial,
military and medical applications. Maximum process
temperature should not exceed 260
O
C.
FEATURES
Extensional mode
Ideal for use with microprocessors
Designed for low power applications
Compatible with hybrid or PC board
Low aging
Full military testing available
Ideal for battery operated applications
Designed and manufactured in the USA
CX-2-SM CRYSTAL
760 kHz to 1.35 MHz
Low Profile Miniature Surface Mount Quartz Crystal
TM
TYP.
MAX.
DIM
INCHES
mm
INCHES
mm
A
.260
6.60
.275
6.99
B
.094
2.39
.108
2.74
C
-
-
see below
D
.035
0.89
.045
1.14
E
.059
1.50
.069
1.75
F
.050
1.27
.060
1.52
G
.105
2.67
.115
2.92
H
.155
3.94
.165
4.19
I
.210
5.33
.220
5.59
DIM "C"
GLASS LID
CERAMIC LID
MAX
INCHES
mm
INCHES
mm
SM1
.065
1.65
.075
1.91
SM2
.067
1.70
.077
1.96
SM3
.070
1.78
.080
2.03
C
B
1
2
3
D
F
G
E
H
I
A
PACKAGE DIMENSIONS
SUGGESTED LAND PATTERN
C
0
C
1
R
1
2
1
L
1
EQUIVALENT CIRCUIT
R
1
Motional Resistance L
1
Motional Inductance
C
1
Motional Capacitance C
0
Shunt Capacitance
GRID
COURTYARD
.113
[2.87]
. 060[1.
INCHES (mm)
52]
.105[2.67]
.060[1.52]
1
2
Note: Terminal 1 is electrically connected internally to terminal 3
actual size
side view
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
10135 - Rev A
SPECIFICATIONS
Specifications are typical at 25
O
C unless otherwise noted.
Specifications are subject to change without notice.
Frequency Range
760 kHz - 1.35 MHz
Functional Mode
Extensional
Calibration Tolerance*
A
0.05% ( 500ppm)
B
0.1%
C 1.0%
Load Capacitance
7 pF
Motional Resistance (R
1
)
5 k
MAX
Motional Capacitance (C
1
)
1.2fF
Quality Factor (Q)
150 k
Shunt Capacitance (C
0
)
1.0 pF
Drive Level
3 W MAX.
Turning Point (T
O
)**
35
O
C
Temperature Coefficient (k) -0.035 ppm/
O
C
2
Note: Frequency (f) deviation from frequency (f
O
) @ turning
point temperature (T
O
);
Aging, first year
5ppm MAX.
Shock
1000g peak, 0.3 msec.,1/2 sine
Vibration, survival
10g rms, 20-1,000 Hz random
Operating Temperature
-10
O
C to +70
O
C Commercial
-40
O
C to +85
O
C Industrial
-55
O
C to +125
O
C Military
Storage Temperature
-55
O
C to +125
O
C
Max Process Temperature
260
O
C for 20 sec.
* Tighter frequency calibration available.
** Other turning point available.
+
_
+
_
+
_
+
_
f-f
O =
k(T-T
O
)
2
f
O
TERMINATIONS
Designation
Termination
SM1
Gold Plated
SM2
Nickel, Solder Plated
SM3
Nickel, Solder Plated and Solder Dipped
PACKAGING
CX-2-SM - Tray Pack (Standard)
-16mm tape, 7" or 13" reels (Optional)
Per EIA 481 (see data sheet 10109)
HOW TO ORDER CX-2-SM CRYSTALS
CX-2
-SM1
1.0 MHz
( A /
I
)
"S" if special
SM1
Calibration
Temp. Range:
or custom
SM2
Tolerance*
C = Commercial
design.
SM3
@ 25
0
C
I = Industrial
Blank if Std.
Frequency
(A)
M = Military
(B)
S = Specify
(C)
*Other calibration fill in ppm.
Blank = Glass Lid
C=Ceramic Lid
TYPICAL APPLICATION
FOR A PIERCE OSCILLATOR
The low profile CX miniature surface mount crystal is ideal
for small, high density, battery operated portable products.
The CX crystal designed in a Pierce oscillator (single
inverter) circuit provides very low current consumption and
high stability. A conventional CMOS Pierce oscillator
circuit is shown below. The crystal is effectively inductive
and in a PI-network circuit with C
D
and C
G
provides the
additional phase shift necessary to sustain oscillation. The
oscillation frequency (f
O
) is 15 to 150 ppm above the
crystal's series resonant frequency (f
s
).
Drive Level
R
A
is used to limit the crystal's drive level by forming a
voltage divider between R
A
and C
D
. R
A
also stabilizes the
oscillator against changes in the amplifiers output
resistance (R
0
). R
A
should be increased for higher
voltage operation.
Load Capacitance
The CX crystal calibration tolerance is influenced by the
effective circuit capacitances, specified as the load
capacitance (C
L
). C
L
is approximately equal to:
NOTE: C
D
and C
G
include stray layout to ground and C
s
is the stray shunt capacitance between the crystal
terminal. In practice, the effective value of C
L
will be less
than that calculated from C
D
, C
G
and C
S
values because
of the effect of the amplifier output resistance. C
S
should
be minimized.
The oscillation frequency (f
O
) is approximately equal to:
CONVENTIONAL CMOS
PIERCE OSCILLATOR CIRCUIT
AMPLIFIER
BUFFER
C
G
C
D
R
A
CX-1
Contact factory for
design guidelines
OSC
Freq (f )
O
R
f
C
S
CX-2
f
O
=
f
S
[
1
+
C
1
]
2(C
0
+ C
L
)
(2)
Where f
S
= Series resonant frequency of the crystal
C
1
= Motional Capacitance
C
0
= Shunt Capacitance
C
L
=
C
D
x C
G
+
C
S
C
D
+ C
G
(1)
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