BYT 11-600
1000
FAST RECOVERY RECTIFIER DIODES
SOFT RECOVERY
VERY HIGH VOLTAGE
SMALL RECOVERY CHARGE
APPLICATIONS
ANTISATURATION DIODES FOR TRANSIS-
TOR BASE DRIVE
SNUBBER DIODES
November 1994
F 126
(Plastic)
Symbol
Parameter
Value
Unit
I
FRM
Repetive Peak Forward Current
t
p
20
s
20
A
I
F (AV)
Average Forward Current *
T
a =
75
C
= 0.5
1
A
I
FSM
Surge non Repetitive Forward Current
t
p
= 10ms
Sinusoidal
35
A
P
tot
Power Dissipation *
T
a
=
55
C
1.25
W
T
stg
T
j
Storage and Junction Temperature Range
- 55 to + 150
- 55 to + 150
C
T
L
Maximum Lead Temperature for Soldering during 10s at 4mm
from Case
230
C
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
R
th (j - a)
Junction-ambient*
60
C/W
THERMAL RESISTANCE
Symbol
Parameter
BYT 11-
Unit
600
800
1000
V
RRM
Repetitive Peak Reverse Voltage
600
800
1000
V
* On infinite heatsink with 10mm lead length.
1/4
2/4
Synbol
Test Conditions
Min.
Typ.
Max.
Unit
I
R
T
j
= 25
C
V
R
= V
RRM
20
A
V
F
T
j
= 25
C
I
F
= 1A
1.3
V
STATIC CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
t
rr
T
j
= 25
C I
F
= 0.5A I
R
= 1A I
rr
= 0.25A
100
ns
RECOVERY CHARACTERISTICS
To evaluate the conduction losses use the following equations:
V
F
= 1.1 + 0.075 I
F
P
=
1.1
x
I
F(AV)
+ 0.075 I
F
2
(RMS)
F i gu re 1. M a xi mu m av era ge power
dissipation versus average forward current.
Figure 2. Average forward current versus
ambient temperature.
Figure 3. Thermal resistance versus lead
length.
Mounting n1
INFINITE HEATSINK
Mounting n2
PRINTED CIRCUIT
Test point of
t
lead
Soldering
BYT11-600
1000
Figure 4. Transient thermal impedance
junction-ambient for mounting n2 versus
pulse duration (L = 10 mm).
Figure 5. Peak forward current
versus peak forward voltage drop
(maximum values).
Figure 6. Capacitance versus reverse applied
voltage
Figure 7. Non repetitive surge peak current
versus number of cycles
3/4
BYT 11-600
1000
4/4
F 126 (Plastic)
PACKAGE MECHANICAL DATA
Cooling method: by convection (method A)
Marking: type number ring at cathode end
Weight: 0.4g
note 2
B
A
B
C
note 1
note 1
D
D
O
/
O
/
O
/
E
E
REF.
DIMENSIONS
NOTES
Millimeters
Inches
Min.
Max.
Min.
Max.
A
6.05
6.35
0.238
0.250
1 - The lead diameter
D is not controlled over zone E
2 - The minimum axial lengh within which the device may be
placed with its leads bent at right angles is 0.59"(15 mm)
B
26
1.024
C
2.95
3.05
0.116
0.120
D
0.76
0.86
0.029
0.034
E
1.27
0.050
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
1994 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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BYT11-600
1000
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