GSF32-16x16/90
32 MByte SIMM FLASH
MEMORY MODULE
TENTATIVE DATA
80 PINS JEDEC 21-C package
FAST ACCESS TIME: 90ns
5V
10% single power supply operation
BYTE PROGRAMMING TIME: 10
s typical
ERASE TIME
Sector: 1.0 sec typical
Bulk: 32 sec typical
PROGRAM/ERASE CONTROLLER (P/E.C.)
Program Byte-by-Byte
Data Polling and Toggle Protocol for P/E.C.
Status
MEMORY ERASE in SECTORS
32 Sectors of 64K Bytes each
Sector Protection
Multisector Erase
ERASE SUSPEND and RESUME MODES
100,000 PROGRAM/ERASE CYCLES per
SECTOR
DEPOPULATED VERSIONS AVAILABLE:
16 Mbyte => GSF16-8x16/90
8 Mbyte => GSF8-4x16/90
A0-A20
Address Inputs
DQ0-DQ31
Data Input / Outputs
CE0-CE3
Chip Enable
OE
Output Enable
WE0-WE3
Write Enable
PD1-PD4
Presence & Module Type Detect
PD5-PD7
Module Speed Detect
VCC-VSS
Power Supply - Ground
Table 1. Signal Names
29 October 1997
1/4
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
DESCRIPTION
The GSF32-16x16/90 is a 32 Mbyte SIMM memory
module built around 16 x 29F016 FLASH memory
chips (please see relevant data sheet for all de-
tailed informations about the chip performances).
The devices are mounted on a Jedec 21-C stand-
ardized SIMM printed circuit.
Organisation
Figure 1 shows the block diagram. The FLASH
module is organized as 16 x 2M x 8 bits with
address lines A0-A20 and Data Inputs/Outputs
DQ0 to 7, DQ8 to 15, DQ16 to 23 and DQ24 to 31.
Memory control is provided by 4 Chip Enable (CE0,
1,2,3) inputs used to address the 4 memory banks
and by 4 Write Enable inputs used to select through
the four DQ0-7, DQ8-15, DQ16-23, DQ24-31
groups. An Output Enable input is used to read the
stored data.
Erase and Program Functions are performed
through the internal Program/Erase Controller
(P/E.C.).
Configuration & speed pins
PD1-PD4 pins are used by the SIMM module to
inform the motherboard about its relevant configu-
ration while PD5 to PD7 are used to inform about
the speed of the chips used.
As the module allocates 32Mbyte memory, using
90 ns chips, configuration is the following:
PD1 : Vss PD2 : Vss PD3 : Vss PD4 : Vss
PD5 : Vss PD6 : Vss PD7 : Vss
OTHER CONFIGURATIONS
The 32 Mbyte module can be also depopulated in
order to achieve 16 M and 8 Mbyte configurations.
Part numbers are as follows:
16MByte : GSF16-8x16/70
8 Mbyte : GSF8-4x16/90
Depopulation consists in removing banks 3 and 4
to achieve the 16 M and also bank 2 to achieve the
8 Mbyte configuration. Configuration pins PD1 to
PD4 becomes as follows:
16 MByte:
PD1 : Open PD2 : Vss PD3 : Vss PD4 : Vss
8 Mbyte:
PD1 : Vss PD2 : Open PD3 : Vss PD4 : Vss
OE
Addr
DQ0-7
CE
WE
OE
Addr
CE
WE
OE
Addr
CE
WE
OE
Addr
DQ0-7
DQ0-7
DQ0-7
CE
WE
OE
Addr
DQ0-7
CE
WE
OE
Addr
CE
WE
OE
Addr
CE
WE
OE
Addr
DQ0-7
DQ0-7
DQ0-7
CE
WE
OE
Addr
DQ0-7
CE
WE
OE
Addr
CE
WE
OE
Addr
CE
WE
OE
Addr
DQ0-7
DQ0-7
DQ0-7
CE
WE
OE
Addr
DQ0-7
CE
WE
OE
Addr
CE
WE
OE
Addr
CE
WE
OE
Addr
DQ0-7
DQ0-7
DQ0-7
CE
WE
WE3
WE2
WE1
WE0
OE
A0 - A20
DQ0 - DQ7
DQ8 - DQ15
DQ16 - DQ23
DQ24 - DQ31
CE0
CE1
CE2
CE3
BANK 1
BANK 2
BANK 3
BANK 4
Fig. 1. Block diagram
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GSF32-16x16/90
Pin
Name
Pin
Name
Pin
Name
Pin
Name
1
VSS
21
CE3
41
A11
61
DQ9
2
VCC
22
CE2
42
A10
62
DQ8
3
Pin 71
23
CE1
43
A9
63
DQ7
4
OE
24
CE0
44
A8
64
DQ6
5
WE0
25
VSS
45
A7
65
DQ5
6
WE1
26
DQ29
46
A6
66
DQ4
7
NC
27
DQ30
47
A5
67
DQ3
8
DQ16
28
DQ31
48
A4
68
DQ2
9
DQ17
29
WE2
49
A3
69
DQ1
10
DQ18
30
NC
50
A2
70
DQ0
11
DQ19
31
NC
51
A1
71
Pin 3
12
DQ20
32
A20
52
A0
72
VCC
13
DQ21
33
A19
53
WE3
73
PD1
14
DQ22
34
A18
54
VSS
74
PD2
15
DQ23
35
A17
55
DQ15
75
PD3
16
DQ24
36
A16
56
DQ14
76
PD4
17
DQ25
37
A15
57
DQ13
77
PD5
18
DQ26
38
A14
58
DQ12
78
PD6
19
DQ27
39
A13
59
DQ11
79
PD7
20
DQ28
40
A12
60
DQ10
80
VSS
Table 1. Pin configuration
118
10.16
6.35
2.0
111.35
3.175
1
40
41
80
31
3.90
3.175
1.27
COMPONENTS AREA
2.54
0.25
3.18
R 1.6
1.27
Figure 2. Mechanical dimensions
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GSF32-16x16/90
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
1997 SGS-THOMSON Microelectronics - All Rights Reserved
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GSF32-16x16/90
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