1/5
SM15T6V8A/220A
SM15T6V8CA/220CA
TRANSIL
TM
s
PEAK PULSE POWER : 1500 W (10/1000
s)
s
BREAKDOWN VOLTAGE RANGE :
From 6.8 V to 220 V
s
UNI AND BIDIRECTIONAL TYPES
s
LOW CLAMPING FACTOR
s
FAST RESPONSE TIME
s
UL RECOGNIZED
FEATURES
SMC
Symbol
Parameter
Value
Unit
P
PP
Peak pulse power dissipation (see note1)
Tj initial = T
amb
1500
W
P
Power dissipation on infinite heatsink
T
amb
= 50C
6.5
W
I
FSM
Non repetitive surge peak forward
current for unidirectional types
tp = 10ms
Tj initial = T
amb
200
A
T
stg
T
j
Storage temperature range
Maximum junction temperature
- 65 to + 175
150
C
C
T
L
Maximum lead temperature for soldering during 10 s.
260
C
Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit.
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25C)
DESCRIPTION
Transil diodes provide high overvoltage protection
by
clamping
action.
Their
instantaneous
response to transient overvoltages makes them
particularly suited to protect voltage sensitive
devices such as MOS Technology and low
voltage supplied IC's.
September 2001 Ed : 3B
Symbol
Parameter
Value
Unit
R
th (j-l)
Junction to leads
15
C/W
R
th (j-a)
Junction to ambient on printed circuit on recommended pad
layout
75
C/W
THERMAL RESISTANCES
SM15Txx
2/5
I
I F
V F
V
VCL
VBR
VRM
I PP
I RM
V
Symbol
Parameter
V
RM
Stand-off voltage
V
BR
Breakdown voltage
V
CL
Clamping voltage
I
RM
Leakage current @ V
RM
I
PP
Peak pulse current
T
Voltage temperature coefficient
V
F
Forward Voltage drop
ELECTRICAL CHARACTERISTICS
(T
amb
= 25C)
Types
I
RM
@ V
RM
V
BR
@
I
R
V
CL
@ I
PP
V
CL
@ I
PP
T
C
max
min
nom
max
max
max
max
typ
note2
10/1000
s
8/20
s
note3 note4
Uni
directional
Mar-
king
Bi
directional
Mar-
king
A
V
V
V
V
mA
V
A
V
A
10
-4
/C
pF
SM15T6V8A MDE
SM15T6V8CA
BDE
1000
5.8
6.45
6.8
7.14
10
10.5
143
13.4
746
5.7
9500
SM15T7V5A MDG
SM15T7V5CA
BDG
500
6.4
7.13
7.5
7.88
10
11.3
132
14.5
690
6.1
8500
SM15T10A
MDP
SM15T10CA
BDP
10 8.55
9.5
10
10.5
1
14.5
103
18.6
538
7.3
7000
SM15T12A
MDT
SM15T12CA
BDT
5 10.2
11.4
12
12.6
1
16.7
90
21.7
461
7.8
6000
SM15T15A
MDX
SM15T15CA
BDX
1 12.8
14.3
15
15.8
1
21.2
71
27.2
368
8.4
5000
SM15T18A
MEE
SM15T18CA
BEE
1 15.3
17.1
18
18.9
1
25.2
59.5
32.5
308
8.8
4300
SM15T22A
MEK
SM15T22CA
BEK
1 18.8
20.9
22
23.1
1
30.6
49
39.3
254
9.2
3700
SM15T24A
MEM
SM15T24CA
BEM
1 20.5
22.8
24
25.2
1
33.2
45
42.8
234
9.4
3500
SM15T27A
MEP
SM15T27CA
BEP
1 23.1
25.7
27
28.4
1
37.5
40
48.3
207
9.6
3200
SM15T30A
MER
SM15T30CA
BER
1 25.6
28.5
30
31.5
1
41.5
36
53.5
187
9.7
2900
SM15T33A
MET
SM15T33CA
BET
1 28.2
31.4
33
34.7
1
45.7
33
59.0
169
9.8
2700
SM15T36A
MEV
SM15T36CA
BEV
1 30.8
34.2
36
37.8
1
49.9
30
64.3
156
9.9
2500
SM15T39A
MEX
SM15T39CA
BEX
1 33.3
37.1
39
41.0
1
53.9
28
69.7
143
10.0
2400
SM15T68A
MFP
SM15T68CA
BFP
1 58.1
64.6
68
71.4
1
92
16.3
121
83
10.4
1550
SM15T75A
MFO
SM15T75CA
BFO
1 64.1
71.3
-
78.8
1
103
14.6
134
75
10.5
1450
SM15T100A MFX
SM15T100CA
BFX
1 85.5
95.0
100
105
1
137
11
178
56
10.6
1150
SM15T150A MGK
SM15T150CA
BGK
1 128
143
150
158
1
207
7.2
265
38
10.8
850
SM15T200A MGV
SM15T200CA
BGV
1 171
190
200
210
1
274
5.5
353
28
10.8
675
SM15T220A MGX
SM15T220CA
BGX
1 188
209
220
231
1
328
4.6
388
26
10.8
625
Note 2 :
Pulse test: tp < 50 ms.
Note 3 :
VBR =
T * (Tamb - 25) * VBR(25C).
Note 4 :
VR = 0 V, F = 1 MHz. For bidirectional types,
capacitance value is divided by 2.
Fig. 1: Peak pulse power dissipation versus initial
junction temperature (printed circuit board).
10 s
1000 s
% I
PP
50
0
t
PULSE WAVEFORM 10/1000
s
100
SM15Txx
3/5
Fig. 2 : Peak pulse power versus exponential pulse duration.
Fig. 3 :
Clamping voltage versus peak pulse current.
Exponential waveform t
p
= 20
s
t
p
= 1 ms -------------
t
p
= 10 ms ...............
Note : The curves of the figure 3 are specified for a junction temperature of 25
C before surge.
The given results may be extrapolated for other junction temperatures by using the following formula :
V
BR
=
T
*
[T
amb
-25]
*
V
BR
(25C).
For intermediate voltages, extrapolate the given results.
SM15Txx
4/5
Fig. 6 : Transient thermal impedance junc-
tion-ambient versus pulse duration.
Mounting on FR4 PC Board with recommended
pad layout.
Fig. 5 : Peak forward voltage drop versus peak
forward current (typical values for unidirectional
types).
Fig. 4b : Capacitance versus reverse applied
voltage for bidirectional types (typical values).
Fig. 4a : Capacitance versus reverse applied
voltage for unidirectional types (typical values).
Fig. 7 : Relative variation of leakage current
versus junction temperature.
SM15Txx
5/5
Packaging : standard packaging is in tape and reel.
PACKAGE MECHANICAL DATA
SMC (Plastic)
ORDER CODE
SM 15 T 100
C A
Weight = 0.25 g.
BIDIRECTIONAL
SURFACE MOUNT
BREAKDOWN VOLTAGE
MARKING : Logo, Date Code, Type Code, Cathode Band (for unidirectional types only).
1500 WATT
FOOTPRINT DIMENSIONS (Millimeters)
SMC
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
2.90
3.2
0.114
0.126
c
0.15
0.41
0.006
0.016
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
D
5.55
6.25
0.218
0.246
L
0.75
1.60
0.030
0.063
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
2001 STMicroelectronics - Printed in Italy - All rights reserved.
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http://www.st.com
2.0
4.2
2.0
3.3
E
C
L
E2
E1
D
A1
A2
b
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