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February 2003
STC6NF30V
N-CHANNEL 30V - 0.020
- 6A TSSOP8
2.5V-DRIVE STripFETTM II POWER MOSFET
s
TYPICAL R
DS
(on) = 0.020
@ 4.5 V
s
TYPICAL R
DS
(on) = 0.025
@ 2.5 V
s
ULTRA LOW THRESHOLD
GATE DRIVE (2.5 V)
s
STANDARD OUTLINE FOR EASY
AUTOMATED SURFACE MOUNT ASSEMBLY
s
DOUBLE DICE IN COMMON DRAIN
CONFIGURATION
DESCRIPTION
This Power MOSFET is the latest development of
STMicroelectronis unique "Single Feature SizeTM"
strip-based process. The resulting transistor
shows extremely high packing density for low on-
resistance.
APPLICATIONS
s
DC MOTOR DRIVE
s
DC-DC CONVERTERS
s
BATTERY SAFETY UNIT FOR NOMADIC
EQUIPMENT
s
POWER MANAGEMENT IN
PORTABLE/DESKTOP PCs
TYPE
V
DSS
R
DS(on)
I
D
STC6NF30V
30 V
< 0.025
( @ 4.5 V )
< 0.030
( @ 2.5 V )
6 A
TSSOP8
ABSOLUTE MAXIMUM RATINGS
(
)
Pulse width limited by safe operating area.
Symbol
Parameter
Value
Unit
V
DS
Drain-source Voltage (V
GS
= 0)
30
V
V
DGR
Drain-gate Voltage (R
GS
= 20 k
)
30
V
V
GS
Gate- source Voltage
12
V
I
D
Drain Current (continuous) at T
C
= 25C
6
A
I
D
Drain Current (continuous) at T
C
= 100C
3.8
A
I
DM
(
)
Drain Current (pulsed)
24
A
P
tot
Total Dissipation at T
C
= 25C
1.5
W
INTERNAL SCHEMATIC DIAGRAM
STC6NF30V
2/8
THERMAL DATA
(*)
When Mounted on FR-4 board with 1 inch
2
pad, 2 oz of Cu and t
[
10 sec
(**)
When Mounted on minimum recommended footprint
ELECTRICAL CHARACTERISTICS (T
j
= 25 C unless otherwise specified)
OFF
ON
(*)
DYNAMIC
Rthj-pcb
Rthj-pcb
T
j
T
stg
Thermal Resistance Junction-PCB (**)
Thermal Resistance Junction-PCB (*)
Operating Junction Temperature
Storage temperature
Max
Max
100
83.5
-55 to 150
-55 to 150
C/W
C/W
C
C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
D
= 250 A, V
GS
= 0
30
V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
= 0)
V
DS
= Max Rating
V
DS
= Max Rating T
C
= 125C
1
10
A
A
I
GSS
Gate-body Leakage
Current (V
DS
= 0)
V
GS
= 12 V
100
nA
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
I
D
= 250 A
0.6
V
R
DS(on)
Static Drain-source On
Resistance
V
GS
= 4.5 V
I
D
= 3 A
V
GS
= 2.5 V
I
D
= 3 A
0.020
0.025
0.025
0.030
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
g
fs (*)
Forward Transconductance
V
DS
= 10 V
I
D
= 6 A
18
S
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS
= 25V f = 1 MHz, V
GS
= 0
800
180
32
pF
pF
pF
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STC6NF30V
SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
(*)
Pulsed: Pulse duration = 300 s, duty cycle 1.5 %.
(
)
Pulse width limited by safe operating area.
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
t
d(on)
t
r
Turn-on Delay Time
Rise Time
V
DD
= 15 V
I
D
= 3 A
R
G
= 4.7
V
GS
= 2.5 V
(Resistive Load, Figure 1)
20
25
ns
ns
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DD
= 15V I
D
= 6A V
GS
=2.5V
(see test circuit, Figure 2)
6.8
2.0
3.4
9
nC
nC
nC
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
t
d(off)
t
f
Turn-off Delay Time
Fall Time
V
DD
= 15 V
I
D
= 3 A
R
G
= 4.7
,
V
GS
= 2.5 V
(Resistive Load, Figure 1)
32
13
ns
ns
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
I
SD
I
SDM
(
)
Source-drain Current
Source-drain Current (pulsed)
6
24
A
A
V
SD
(*)
Forward On Voltage
I
SD
= 6 A
V
GS
= 0
1.2
V
t
rr
Q
rr
I
RRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
SD
= 6 A
di/dt = 100A/s
V
DD
= 15 V
T
j
= 150C
(see test circuit, Figure 3)
25
21
1.7
ns
nC
A
ELECTRICAL CHARACTERISTICS (continued)
Safe Operating Area.
Thermal Impedance.
STC6NF30V
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Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
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STC6NF30V
Normalized Gate Threshold Voltage vs Temperature
Normalized on Resistance vs Temperature
Source-drain Diode Forward Characteristics
Normalized Breakdown Voltage Temperature
Thermal resistance and max power
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