1/9
September 2003
NEW DATASHEET ACCORDING TO PCN DSG/CT/2C13 MARKING:D40NF3LL @
STD40NF3LL
N-CHANNEL 30V - 0.009
- 40A DPAK
LOW GATE CHARGE STripFETTMII POWER MOSFET
s
TYPICAL R
DS
(on) = 0.009
@ 10V
s
OPTIMAL R
DS(on)
x Qg TRADE-OFF
s
CONDUCTION LOSSES REDUCED
s
SWITCHING LOSSES REDUCED)
s
SURFACE-MOUNTING DPAK (TO-252)
POWER PACKAGE IN TAPE & REEL
(SUFFIX "T4")
DESCRIPTION
This application specific Power MOSFET is the third
genaration of STMicroelectronis unique "Single Feature
SizeTM" strip-based process. The resulting transistor
shows the best trade-off between on-resistance and gate
charge. When used as high and low side in buck
regulators, it gives the best performance in terms of both
conduction and switching losses. This is extremely
important for motherboards where fast switching and
high efficiency are of paramount importance.
APPLICATIONS
s
SPECIFICALLY DESIGNED AND OPTIMISED
FOR HIGH EFFICIENCY CPU CORE DC/DC
CONVERTERS
s
AUTOMOTIVE SWITCHING APPLICATIONS
Ordering Information
TYPE
V
DSS
R
DS(on)
I
D
STD40NF3LL
30 V
<0.011
40 A
SALES TYPE
MARKING
PACKAGE
PACKAGING
STD40NF3LLT4
D40NF3LL@
TO-252
TAPE & REEL
DPAK
TO-252
(Suffix "T4")
1
3
ABSOLUTE MAXIMUM RATINGS
(
)
Current limited by the package
(
)
Pulse width limited by safe operating area.
(1) I
SD
40A, di/dt
350A/s, V
DD
V
(BR)DSS
, T
j
T
JMAX
(2) Starting T
j
= 25
o
C, I
D
= 20A, V
DD
= 25V
Symbol
Parameter
Value
Unit
V
DS
Drain-source Voltage (V
GS
= 0)
30
V
V
DGR
Drain-gate Voltage (R
GS
= 20 k
)
30
V
V
GS
Gate- source Voltage
16
V
I
D
(
)
Drain Current (continuous) at T
C
= 25C
40
A
I
D
Drain Current (continuous) at T
C
= 100C
28
A
I
DM
(
)
Drain Current (pulsed)
160
A
P
tot
Total Dissipation at T
C
= 25C
80
W
Derating Factor
0.53
W/C
dv/dt
(1)
Peak Diode Recovery voltage slope
5.5
V/ns
E
AS (2)
Single Pulse Avalanche Energy
850
mJ
T
stg
Storage Temperature
-55 to 175
C
T
j
Operating Junction Temperature
INTERNAL SCHEMATIC DIAGRAM
STD40NF3LL
2/9
THERMAL DATA
ELECTRICAL CHARACTERISTICS (T
case
= 25 C unless otherwise specified)
OFF
ON
(*)
DYNAMIC
Rthj-case
Rthj-amb
T
l
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Maximum Lead Temperature For Soldering Purpose
Max
Max
Typ
1.88
100
300
C/W
C/W
C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
D
= 250 A, V
GS
= 0
30
V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
= 0)
V
DS
= Max Rating
V
DS
= Max Rating T
C
= 125C
1
10
A
A
I
GSS
Gate-body Leakage
Current (V
DS
= 0)
V
GS
= 16 V
100
nA
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
I
D
= 250 A
1
V
R
DS(on)
Static Drain-source On
Resistance
V
GS
= 10 V
I
D
= 20 A
V
GS
= 4.5 V
I
D
= 10 A
0.0090
0.0115
0.0110
0.0135
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
g
fs (*)
Forward Transconductance
V
DS
= 15 V
I
D
= 20 A
23
S
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS
= 25V, f = 1 MHz, V
GS
= 0
1650
540
130
pF
pF
pF
3/9
STD40NF3LL
SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
(*)
Pulsed: Pulse duration = 300 s, duty cycle 1.5 %.
(
)
Pulse width limited by safe operating area.
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
t
d(on)
t
r
Turn-on Delay Time
Rise Time
V
DD
= 15 V
I
D
= 20 A
R
G
= 4.7
V
GS
= 4.5 V
(Resistive Load, Figure 3)
23
156
ns
ns
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DD
=15 V I
D
=40 A V
GS
=4.5 V
24
8.5
12
33
nC
nC
nC
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
t
d(off)
t
f
Turn-off Delay Time
Fall Time
V
DD
= 15 V
I
D
= 20 A
R
G
= 4.7
,
V
GS
= 4.5 V
(Resistive Load, Figure 3)
27
28
ns
ns
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
I
SD
I
SDM
(
)
Source-drain Current
Source-drain Current (pulsed)
40
160
A
A
V
SD
(*)
Forward On Voltage
I
SD
= 40 A
V
GS
= 0
1.3
V
t
rr
Q
rr
I
RRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
SD
= 40 A
di/dt = 100A/s
V
DD
= 15 V
T
j
= 150C
(see test circuit, Figure 5)
40
50
2.5
ns
nC
A
ELECTRICAL CHARACTERISTICS (continued)
Safe Operating Area
Thermal Impedance
STD40NF3LL
4/9
Output Characteristics
Transfer Characteristics
Source-drain Diode Forward Characteristics
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
5/9
STD40NF3LL
.
.
Normalized Gate Threshold Voltage vs Temperature
Normalized on Resistance vs Temperature
Normalized Breakdown Voltage vs Temperature.
.
.
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