1/12
October 2003
STD60NH03L
N-CHANNEL 30V - 0.0075
- 60A DPAK/IPAK
STripFETTM III POWER MOSFET
s
TYPICAL R
DS
(on) = 0.0075
@ 10 V
s
TYPICAL R
DS
(on) = 0.009
@ 5 V
s
R
DS(ON)
* Qg INDUSTRY's BENCHMARK
s
CONDUCTION LOSSES REDUCED
s
SWITCHING LOSSES REDUCED
s
LOW THRESHOLD DEVICE
s
THROUGH-HOLE IPAK (TO-251) POWER
PACKAGE IN TUBE (SUFFIX "-1")
s
SURFACE-MOUNTING DPAK (TO-252)
POWER PACKAGE IN TAPE & REEL
(SUFFIX "T4")
DESCRIPTION
The STD60NH03L utilizes the latest advanced design
rules of ST's proprietary STripFETTM technology. This is
suitable fot the most demanding DC-DC converter
application where high efficiency is to be achieved.
APPLICATIONS
s
SPECIFICALLY DESIGNED AND OPTIMISED
FOR HIGH EFFICIENCY DC/DC CONVERTES
Ordering Information
TYPE
V
DSS
R
DS(on)
I
D
STD60NH03L
30 V
< 0.009
60 A
SALES TYPE
MARKING
PACKAGE
PACKAGING
STD60NH03LT4
D60NH03L
TO-252
TAPE & REEL
STD60NH03L-1
D60NH03L
TO-251
TUBE
3
2
1
1
3
IPAK
TO-251
(Suffix "-1")
DPAK
TO-252
(Suffix "T4")
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
DS
Drain-source Voltage (V
GS
= 0)
30
V
V
DGR
Drain-gate Voltage (R
GS
= 20 k
)
30
V
V
GS
Gate- source Voltage
20
V
I
D
Drain Current (continuous) at T
C
= 25C
60
A
I
D
Drain Current (continuous) at T
C
= 100C
43
A
I
DM(1)
Drain Current (pulsed)
240
A
P
tot
Total Dissipation at T
C
= 25C
70
W
Derating Factor
0.47
W/C
E
AS (2)
Single Pulse Avalanche Energy
300
mJ
T
stg
Storage Temperature
-55 to 175
C
T
j
Max. Operating Junction Temperature
INTERNAL SCHEMATIC DIAGRAM
STD60NH03L
2/12
THERMAL DATA
(#)
When Mounted on 1 inch
2
FR-4 board, 2 oz of Cu.
ELECTRICAL CHARACTERISTICS (T
CASE
= 25 C UNLESS OTHERWISE SPECIFIED)
OFF
ON
(4)
DYNAMIC
Rthj-case
Rthj-amb
Rthj-pcb
T
l
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Thermal Resistance Junction-pcb
(#)
Maximum Lead Temperature For Soldering Purpose
Max
Max
Max
2.14
100
43
275
C/W
C/W
C/W
C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
D
= 250 A, V
GS
= 0
30
V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
= 0)
V
DS
= Max Rating
V
DS
= Max Rating T
C
= 125C
1
10
A
A
I
GSS
Gate-body Leakage
Current (V
DS
= 0)
V
GS
= 20V
100
nA
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
I
D
= 250 A
1
V
R
DS(on)
Static Drain-source On
Resistance
V
GS
= 10 V
I
D
= 30 A
V
GS
= 5 V
I
D
= 30 A
0.0075
0.009
0.009
0.017
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
g
fs (4)
Forward Transconductance
V
DS
= 15 V
I
D
= 18 A
25
S
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS
= 10V f = 1 MHz V
GS
= 0
2200
380
49
pF
pF
pF
R
G
Gate Input Resistance
f = 1 MHz Gate DC Bias = 0
Test Signal Level = 20 mV
Open Drain
1.5
3/12
STD60NH03L
SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
(1)
Pulse width limited by safe operating area
(3)
Pulsed: Pulse duration = 300 s, duty cycle 1.5 %.
(
2
) Starting T
j
= 25
o
C, I
D
= 30A, V
DD
= 20V
(4)
Gate charge for synchronous operation
.
See Appendix A
.
.
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
t
d(on)
t
r
Turn-on Delay Time
Rise Time
V
DD
= 15 V
I
D
= 30 A
R
G
= 4.7
V
GS
= 5 V
(Resistive Load, Figure 3)
21
95
ns
ns
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DD
= 15 V I
D
= 60 A V
GS
= 5 V
15.7
8.3
3.4
21
nC
nC
nC
Q
gls(4)
Third-quadrant Gate Charge
V
DS
< 0 V V
GS
= 10 V
15
nC
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
t
d(off)
t
f
Turn-off Delay Time
Fall Time
V
DD
= 15 V
I
D
= 30 A
R
G
= 4.7
,
V
GS
= 5 V
(Resistive Load, Figure 3)
19
15
ns
ns
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
I
SD
I
SDM
Source-drain Current
Source-drain Current (pulsed)
60
240
A
A
V
SD
Forward On Voltage
I
SD
= 30 A V
GS
= 0
1.4
V
t
rr
Q
rr
I
RRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
SD
= 60 A
di/dt = 100A/s
V
DD
= 20 V
T
j
= 150C
(see test circuit, Figure 5)
32
51
3.2
ns
nC
A
ELECTRICAL CHARACTERISTICS (continued)
Safe Operating Area
Thermal Impedance
STD60NH03L
4/12
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
5/12
STD60NH03L
Normalized Gate Threshold Voltage vs Temperature
Normalized on Resistance vs Temperature
Source-drain Diode Forward Characteristics
Normalized Breakdown Voltage vs Temperature
.
.
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