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September 2005
STP6NK70Z
STF6NK70Z
N-CHANNEL 700V - 1.5
- 5A TO-220/TO-220FP
Zener-Protected SuperMESHTMMOSFET
Table 1: General Features
s
TYPICAL R
DS
(on) = 1.5
s
EXTREMELY HIGH dv/dt CAPABILITY
s
IMPROVED ESD CAPABILITY
s
100% AVALANCHE RATED
s
GATE CHARGE MINIMIZED
s
VERY LOW INTRINSIC CAPACITANCES
s
VERY GOOD MANUFACTURING
REPEATIBILITY
DESCRIPTION
The SuperMESHTM series is obtained through an
extreme optimization of ST's well established
stripbased PowerMESHTM layout. In addition to
pushing on-resistance significantly down, special
care is taken to ensure a very good dv/dt capability
for the most demanding applications. Such series
complements ST full range of high voltage MOS-
FETs including revolutionary MDmeshTM products.
APPLICATIONS
s
HIGH CURRENT, HIGH SPEED SWITCHING
s
IDEAL FOR OFF-LINE POWER SUPPLIES,
ADAPTORS AND PFC
Table 2: Order Codes
Figure 1: Package
Figure 2: Internal Schematic Diagram
TYPE
V
DSS
R
DS(on)
I
D
Pw
STP6NK70Z
STF6NK70Z
700 V
700 V
< 1.8
< 1.8
5 A
5 A (*)
110 W
30 W
TO-220FP
TO-220
1
2
3
1
2
3
SALES TYPE
MARKING
PACKAGE
PACKAGING
STP6NK70Z
P6NK70Z
TO-220
TUBE
STF6NK70Z
F6NK70Z
TO-220FP
TUBE
Rev. 3
STP6NK70Z - STF6NK70Z
2/12
Table 3: Absolute Maximum ratings
( ) Pulse width limited by safe operating area
(1) I
SD
5A, di/dt
100A/s, V
DD
V
(BR)DSS
, T
j
T
JMAX.
(*) Limited only by maximum temperature allowed
Table 4: Thermal Data
Table 5: Avalanche Characteristics
Table 6: Gate-Source Zener Diode
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device's
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device's integrity. These integrated Zener diodes thus avoid the
usage of external components.
Symbol
Parameter
Value
Unit
STP6NK70Z
STF6NK70Z
V
DS
Drain-source Voltage (V
GS
= 0)
700
V
V
DGR
Drain-gate Voltage (R
GS
= 20 k
)
700
V
V
GS
Gate- source Voltage
30
V
I
D
Drain Current (continuous) at T
C
= 25C
5
5 (*)
A
I
D
Drain Current (continuous) at T
C
= 100C
3.15
3.15 (*)
A
I
DM
( )
Drain Current (pulsed)
20
20 (*)
A
P
TOT
Total Dissipation at T
C
= 25C
110
30
W
Derating Factor
0.87
0.24
W/C
V
ESD(G-S)
Gate source ESD(HBM-C=100pF, R=1.5K
)
4000
V
dv/dt (1)
Peak Diode Recovery voltage slope
4.5
V/ns
V
ISO
Insulation Withstand Voltage (DC)
-
2500
V
T
j
T
stg
Operating Junction Temperature
Storage Temperature
-55 to 150
-55 to 150
C
C
TO-220
TO-220FP
Rthj-case
Thermal Resistance Junction-case Max
1.14
4.2
C/W
Rthj-amb
Thermal Resistance Junction-ambient Max
62.5
C/W
T
l
Maximum Lead Temperature For Soldering Purpose
300
C
Symbol
Parameter
Max Value
Unit
I
AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
j
max)
5
A
E
AS
Single Pulse Avalanche Energy
(starting T
j
= 25 C, I
D
= I
AR
, V
DD
= 50 V)
200
mJ
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
BV
GSO
Gate-Source Breakdown
Voltage
Igs= 1mA (Open Drain)
30
V
3/12
STP6NK70Z - STF6NK70Z
ELECTRICAL CHARACTERISTICS (T
CASE
=25C UNLESS OTHERWISE SPECIFIED)
Table 7: On /Off
Table 8: Dynamic
Table 9: Source Drain Diode
(1) Pulsed: Pulse duration = 300 s, duty cycle 1.5 %.
(2) Pulse width limited by safe operating area.
(3) C
oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C
oss
when V
DS
increases from 0 to 80% V
DSS
.
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
(BR)DSS
Drain-source Breakdown
Voltage
I
D
= 1 mA, V
GS
= 0
700
V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
= 0)
V
DS
= Max Rating
V
DS
= Max Rating, T
C
= 125C
1
50
A
A
I
GSS
Gate-body Leakage
Current (V
DS
= 0)
V
GS
= 20 V
10
A
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 100 A
3
3.75
4.5
V
R
DS(on
Static Drain-source On
Resistance
V
GS
= 10 V, I
D
= 2.5 A
1.5
1.8
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
g
fs
(1)
Forward Transconductance V
DS
= 15 V , I
D
= 2.5 A
4.4
S
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS
= 25 V, f = 1 MHz, V
GS
= 0
930
105
22
pF
pF
pF
C
OSS eq
(3)
.
Equivalent Output
Capacitance
V
GS
= 0 V, V
DS
= 0 to 560 V
70
pF
t
d(on)
t
r
t
d(off)
t
f
Turn-on Delay Time
Rise Time
Turn-off-Delay Time
Fall Time
V
DD
= 350 V, I
D
= 2.5 A,
R
G
= 4.7
,
V
GS
= 10 V
(see Figure 17)
17
18
45
30
ns
ns
ns
ns
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DD
= 560 V, I
D
= 5 A,
V
GS
= 10 V
(see Figure 20)
34
6.5
17
47
nC
nC
nC
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
I
SD
I
SDM
(2)
Source-drain Current
Source-drain Current (pulsed)
5
20
A
A
V
SD
(1)
Forward On Voltage
I
SD
= 5 A, V
GS
= 0
1.6
V
t
rr
Q
rr
I
RRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
SD
= 5 A, di/dt = 100 A/s
V
DD
= 35V
(see Figure 18)
432
2.37
11
ns
C
A
t
rr
Q
rr
I
RRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
SD
= 5 A, di/dt = 100 A/s
V
DD
= 35V, T
j
= 150C
(see Figure 18)
588
3.38
11.5
ns
C
A
STP6NK70Z - STF6NK70Z
4/12
Figure 3: Safe Operating Area
Figure 4: Safe Operating Area for TO-220FP
Figure 5: Output Characteristics
Figure 6: Thermal Impedance
Figure 7: Thermal Impedance for TO-220FP
Figure 8: Transfer Characteristics
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STP6NK70Z - STF6NK70Z
Figure 9: Transconductance
Figure 10: Gate Charge vs Gate-source Voltage
Figure 11: Source-Drain Diode Forward Char-
acteristics
Figure 12: Static Drain-source On Resistance
Figure 13: Capacitance Variations
Figure 14: Normalizzed BVdss vs Temperature
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