STPS15L25D/G
June 1999 - Ed : 4B
LOW DROP POWER SCHOTTKY RECTIFIER
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
25
V
I
F(RMS)
RMS forward current
30
A
I
F(AV)
Average forward current
Tc = 145C
= 0.5
15
A
I
FSM
Surge non repetitive forward current
tp = 10ms Sinusoidal
250
A
I
RRM
Repetitive peak reverse current
tp=2
s square F=1kHz
1
A
I
RSM
Non repetitive peak reverse current
tp = 100
s square
4
A
T
stg
Storage temperature range
- 65 to + 150
C
Tj
Maximum operating junction temperature *
150
C
dV/dt
Critical rate of rise of reverse voltage
10000
V/
s
ABSOLUTE RATINGS (limiting values)
TO-220AC
STPS15L25D
VERY LOW FORWARD VOLTAGE DROP
FOR LESS POWER DISSIPATION AND RE-
DUCED HEATSINK
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS
FEATURES
Single Schottky rectifier suited for Switched Mode
Power Supplies and high frequency DC to DC con-
verters (VRM
S
).
Packaged in TO-220AC or D
2
PAK, this device is
especially intended for use as a Rectifier at the
secondary of 3.3V SMPS and DC/DC units.
DESCRIPTION
I
F(AV)
15 A
V
RRM
25 V
Tj (max)
150 C
V
F
(max)
0.35 V
MAIN PRODUCT CHARACTERISTICS
K
A
D
2
PAK
STPS15L25G
NC
A
K
* :
dPtot
dTj
<
1
Rth
(
j
-
a
)
thermal runaway condition for a diode on its own heatsink
1/5
Symbol
Parameter
Value
Unit
R
th(j-c)
Junction to case
1
C/W
THERMAL RESISTANCES
Symbol
Parameters
Test conditions
Min.
Typ.
Max.
Unit
I
R
*
Reverse leakage current
Tj = 25C
V
R
= V
RRM
1.3
mA
Tj = 125C
225
450
mA
V
F
*
Forward voltage drop
Tj = 25C
I
F
= 15A
0.46
V
Tj = 125C
I
F
= 15A
0.3
0.35
Tj = 25C
I
F
= 30A
0.56
Tj = 125C
I
F
= 30A
0.41
0.46
Pulse test : * tp = 380
s,
< 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.24 x I
F(AV)
+ 0.0073 I
F
2
(RMS)
STATIC ELECTRICAL CHARACTERISTICS
0
2
4
6
8
10
12
14
16
0
1
2
3
4
5
6
7
8
IF(av) (A)
PF(av)(W)
= 0.2
= 0.5
= 1
= 0.05
= 0.1
T
=tp/T
tp
Fig.1 : Average forward power dissipation versus
average forward current.
0
25
50
75
100
125
150
0
2
4
6
8
10
12
14
16
IF(av)(A)
Rth(j-a)=50C/W
Rth(j-a)=Rth(j-c)
Tamb(C)
T
=tp/T
tp
Fig.2 : Average forward current versus ambient
temperature (
= 0.5).
STPS15L25D/G
2/5
1E-3
1E-2
1E-1
1E+0
0
50
100
150
200
250
300
350
IM(A)
Tc=25C
Tc=100C
Tc=75C
t(s)
I
M
t
=0.5
Fig.3 : Non repetitive surge peak forward current
versus overload duration (maximum values).
0
5
10
15
20
25
1E-2
1E-1
1E+0
1E+1
1E+2
1E+3
IR(mA)
Tj=125C
Tj=25C
Tj=150C
VR(V)
Fig.5 : Reverse leakage current versus reverse
voltage applied (typical values).
1.0E-4
1.0E-3
1.0E-2
1.0E-1
1.0E+0
0.0
0.2
0.4
0.6
0.8
1.0
t(s)
Zth(j-c)/Rth(j-c)
T
=tp/T
tp
Single pulse
= 0.1
= 0.2
= 0.5
Fig.4 : Relative variation of thermal impedance
junction to case versus pulse duration.
1
2
5
10
20
30
0.1
1.0
5.0
VR(V)
C(nF)
F=1MHz
Tj=25C
Fig.6 : Junction capacitance versus reverse
voltage applied (typical values).
IFM(A)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.1
1.0
10.0
100.0
200.0
VFM(V)
Tj=25C
Tj=125C
Typical values
Tj=150C
Fig.7 : Forward voltage drop versus forward
current (maximum values).
0
4
8
12
16
20
24
28
32
36
40
0
10
20
30
40
50
60
70
80
Rth(j-a) (C/W)
S(Cu) (cm)
Fig.8 : Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness : 35
m).
(STPS15L25G only)
STPS15L25D/G
3/5
PACKAGE MECHANICAL DATA
D
2
PAK
A
C2
D
R
2.0 MIN.
FLAT ZONE
A2
V2
C
A1
G
L
L3
L2
B
B2
E
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
R
0.40 typ.
0.016 typ.
V2
0
8
0
8
8.90
3.70
1.30
5.08
16.90
10.30
FOOT PRINT DIMENSIONS (in millimeters)
Cooling method: by conduction (method C)
STPS15L25D/G
4/5
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1999 STMicroelectronics - Printed in Italy - All rights reserved.
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http://www.st.com
PACKAGE MECHANICAL DATA
TO-220AC
A
C
D
E
M
L7
H2
I
L5
L6
L9
L4
G
F1
F
L2
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
H2
10.00
10.40
0.393
0.409
L2
16.40 typ.
0.645 typ.
L4
13.00
14.00
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
2.6 typ.
0.102 typ.
Diam. I
3.75
3.85
0.147
0.151
Cooling method : C
Recommended torque value : 0.55 m.N
Maximum torque value : 0.70 m.N
Ordering type
Marking
Package
Weight
Base qty
Delivery
mode
STPS15L25D
STPS15L25D
TO-220AC
1.86g
50
Tube
STPS15L25G
STPS15L25G
D
2
PAK
1.48g
50
Tube
STPS15L25G-TR
STPS15L25G
D
2
PAK
1.48g
1000
Tape & reel
Epoxy meets UL94,V0
STPS15L25D/G
5/5
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