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STPS2L40U
July 2003 - Ed: 2A
LOW DROP POWER SCHOTTKY RECTIFIER
I
F(AV)
2 A
V
RRM
40 V
Tj (max)
150 C
V
F
(max)
0.34 V
MAIN PRODUCT CHARACTERISTICS
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VERY SMALL CONDUCTION LOSSES
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NEGLIGIBLE SWITCHING LOSSES
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LOW FORWARD VOLTAGE DROP
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SURFACE MOUNT MINIATURE PACKAGE
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AVALANCHE CAPABILITY SPECIFIED
FEATURES AND BENEFITS
Single chip Schottky rectifiers suited to Switched
Mode Power Supplies and high frequency DC to
DC converters.
Packaged in SMB, this device is especially
intended for surface mounting and used in low
voltage, high frequency inverters, free wheeling
and polarity protection applications.
DESCRIPTION
SMB
(JEDEC DO-214AA)
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
40
V
I
F(RMS)
RMS forward current
8
A
I
F(AV)
Average forward current
T
L
= 130C
= 0.5
2
A
I
FSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
75
A
P
ARM
Repetitive peak avalanche power
tp = 1s
Tj = 25C
2200
W
T
stg
Storage temperature range
- 65 to + 150
C
Tj
Maximum operating junction temperature *
150
C
dV/dt
Critical rate of rise of reverse voltage
10000
V/
s
ABSOLUTE RATINGS (limiting values)
* :
dPtot
dTj
Rth j
a
<
-
1
(
)
thermal runaway condition for a diode on its own heatsink
STPS2L40U
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Symbol
Parameter
Value
Unit
R
th (j-l)
Junction to lead
SMB
20
C/W
THERMAL RESISTANCES
Symbol
Tests Conditions
Tests Conditions
Min.
Typ.
Max.
Unit
I
R
*
Reverse leakage current
Tj = 25C
V
R
= 40 V
220
A
Tj = 100C
20
mA
Tj = 125C
38
80
mA
V
F
*
Forward voltage drop
Tj = 25C
I
F
= 1 A
0.39
V
Tj = 125C
0.25
0.28
Tj = 25C
I
F
= 2 A
0.43
Tj = 125C
0.31
0.34
Tj = 25C
I
F
= 4 A
0.5
V
Tj = 125C
0.39
0.45
Pulse test : * tp = 380s,
< 2%
STATIC ELECTRICAL CHARACTERISTICS
To evaluate the maximum conduction losses use the following equation :
P = 0.22 x I
F(AV)
+ 0.06 I
F
2
(RMS)
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
0.0
0.2
0.4
0.6
0.8
1.0
IF(av) (A)
PF(av)(W)
T
=tp/T
tp
= 0.05
= 0.1
= 0.2
= 0.5
= 1
Fig. 1: Average forward power dissipation versus
average forward current.
0
25
50
75
100
125
150
0.0
0.4
0.8
1.2
1.6
2.0
2.4
Tamb(C)
IF(av)(A)
Rth(j-a)=Rth(j-l)
Rth(j-a)=100C/W
T
=tp/T
tp
Fig. 2: Average forward current versus ambient
temperature (
=0.5).
STPS2L40U
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0
5
10
15
20
25
30
35
40
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
VR(V)
IR(mA)
Tj=125C
Tj=25C
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
1000
1
10
100
10
100
VR(V)
C(pF)
F=1MHz
Tj=25C
Fig. 8:
Junction capacitance versus reverse
voltage applied (typical values).
1E-3
1E-2
1E-1
1E+0
0
2
4
6
8
10
12
t(s)
IM(A)
Ta=25C
Ta=100C
Ta=50C
I
M
t
=0.5
Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values).
1E-2
1E-1
1E+0
1E+1
1E+2
1E+3
0.0
0.2
0.4
0.6
0.8
1.0
tp(s)
Zth(j-a)/Rth(j-a)
= 0.5
= 0.2
= 0.1
Single pulse
T
=tp/T
tp
Fig. 6: Relative variation of thermal impedance
junction to ambient versus pulse duration.
0
0.2
0.4
0.6
0.8
1
1.2
0
25
50
75
100
125
150
T (C)
j
P
(t )
P
(25C)
ARM p
ARM
Fig. 4: Normalized avalanche power derating
versus junction temperature.
0.001
0.01
0.1
0.01
1
0.1
10
100
1000
1
t (s)
p
P
(t )
P
(1s)
ARM p
ARM
Fig. 3: Normalized avalanche power derating
versus pulse duration.
STPS1L40A/U
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0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
20
40
60
80
100
120
S(Cu) (cm)
Rth(j-a) (C/W)
Fig. 10: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness
s(Cu) = 35m)
0
50
100 150 200 250 300 350 400 450 500
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VFM(mV)
IFM(A)
Tj=25C
Tj=125C
(typical values)
Tj=125C
Fig. 9-2: Forward voltage drop versus forward
current (maximum values, low level).
10.00
0
50 100 150 200 250 300 350 400 450 500 550 600 650 700
0.01
0.10
1.00
VFM(mV)
IFM(A)
Tj=125C
Tj=125C
(typical
values)
Tj=25C
Fig. 9-1: Forward voltage drop versus forward
current (maximum values, high level).
STPS2L40U
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PACKAGE MECHANICAL DATA
SMB
E
C
L
E1
D
A1
A2
b
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.41
0.006
0.016
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
L
0.75
1.60
0.030
0.063
1.52
2.75
2.3
1.52
FOOT PRINT DIMENSIONS (in millimeters)
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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approval of STMicroelectronics.
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2003 STMicroelectronics - Printed in Italy - All rights reserved.
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Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS2L40U
GD4
SMB
0.107g
2500
Tape & reel
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BAND INDICATES CATHODE
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EPOXY MEETS UL94,V0
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