STPS3045G
October 1999 - Ed: 4A
POWER SCHOTTKY RECTIFIER
I
F(AV)
30 A
V
RRM
45 V
Tj (max)
175C
V
F
(max)
0.63 V
MAIN PRODUCT CHARACTERISTICS
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
EXTREMELY FAST SWITCHING
LOW THERMAL RESISTANCE
HIGH DISSIPATION MINIATURE PACKAGE
FEATURES AND BENEFITS
Single Schottky rectifier suited for switchmode
power supply and high frequency DC to DC con-
verters.
Packaged in D
2
PAK surface mount package , this
device is intended for use in low voltage, high fre-
quency inverters, free wheeling and polarity pro-
tection applications.
DESCRIPTION
D
2
PAK
K
A
A
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
45
V
I
F(RMS)
RMS forward current
50
A
I
F(AV)
Average forward current
Tc = 150C
= 0.5
30
A
I
FSM
Surge non repetitive forward current
tp = 10 ms
Sinusoidal
200
A
I
RRM
Repetitive peak reverse current
tp = 2
s
F = 1kHz square
1
A
I
RSM
Non Repetitive peak reverse current
tp = 100
s square
3
A
Tstg
Storage temperature range
- 65 to + 175
C
Tj
Maximum operating junction temperature*
175
C
dV/dt
Critical rate of rise of reverse voltage
10000
V/
s
ABSOLUTE RATINGS (limiting values)
* :
dPtot
dTj
<
1
Rth
(
j
-
a
)
thermal runaway condition for a diode on its own heatsink
1/5
Symbol
Parameter
Value
Unit
R
th (j-c)
Junction to case
1
C/W
THERMAL RESISTANCES
Symbol
Parameter
Tests Conditions
Min.
Typ.
Max.
Unit
I
R
*
Reverse leakage current
Tj = 25
C
V
R
= V
RRM
500
A
Tj = 125
C
20
80
mA
V
F
**
Forward voltage drop
Tj = 125
C
I
F
= 30 A
0.53
0.63
V
Tj = 25
C
I
F
= 60 A
0.84
Tj = 125
C
I
F
= 60 A
0.68
0.78
STATIC ELECTRICAL CHARACTERISTICS
Pulse test :
* tp = 5 ms,
< 2 %
** tp = 380
s,
< 2%
To evaluate the conduction losses use the following equation :
P = 0.48 x I
F(AV)
+ 0.005 I
F
2
(RMS)
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
IF(av) (A)
PF(av)(W)
T
=tp/T
tp
= 0.05
= 0.1
= 0.2
= 0.5
= 1
Fig. 1: Average forward power dissipation versus
average forward current.
0
25
50
75
100
125
150
175
0
5
10
15
20
25
30
35
Tamb(C)
IF(av)(A)
Rth(j-a)=30C/W
Rth(j-a)=Rth(j-c)
T
=tp/T
tp
Fig. 2: Average forward current versus ambient
temperature (
=0.5).
STPS3045G
2/5
1E-3
1E-2
1E-1
1E+0
0
50
100
150
200
250
300
350
400
t(s)
IM(A)
Tc=75C
Tc=100C
Tc=125C
I
M
t
=0.5
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
1E-4
1E-3
1E-2
1E-1
1E+0
0.0
0.2
0.4
0.6
0.8
1.0
tp(s)
Zth(j-c)/Rth(j-c)
= 0.5
= 0.2
= 0.1
Single pulse
T
=tp/T
tp
Fig. 4: Relative variation of thermal impedance
junction to case versus pulse duration.
0
5
10
15
20
25
30
35
40
45
1E+0
1E+1
1E+2
1E+3
1E+4
1E+5
VR(V)
IR(A)
Tj=150C
Tj=100C
Tj=125C
Tj=75C
Tj=50C
Tj=25C
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values)
1
2
5
10
20
50
0.1
1.0
5.0
VR(V)
C(nF)
F=1MHz
Tj=25C
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1
10
100
200
VFM(V)
IFM(A)
Typical values
Tj=125C
Tj=125C
Tj=25C
Fig. 7: Forward voltage drop versus forward current
(maximum values).
0
2
4
6
8
10
12
14
16
18
20
0
10
20
30
40
50
60
70
80
S(Cu) (cm)
Rth(j-a) (C/W)
Fig. 8: Thermal resistance junction to ambient ver-
sus copper surface under tab (Epoxy printed circuit
board, copper thickness: 35
m)
STPS3045G
3/5
PACKAGE MECHANICAL DATA
D
2
PAK
A
C2
D
R
A2
M
V2
C
A1
G
L
L3
L2
B
B2
E
*
* FLAT ZONE NO LESS THAN 2mm
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
R
0.40 typ.
0.016 typ.
V2
0
8
0
8
8.90
3.70
1.30
5.08
16.90
10.30
FOOTPRINT DIMENSIONS (in millimeters)
STPS3045G
4/5
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1999 STMicroelectronics - Printed in Italy - All rights reserved.
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Type
Marking
Package
Weight
Base qty
Delivery mode
STPS3045G
STPS3045G
D
2
PAK
1.48g
50
Tube
STPS3045G-TR
STPS3045G
D
2
PAK
1.48g
500
Tape & Reel
Epoxy meets UL94, V0
STPS3045G
5/5
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