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STPS30L30CT/CG/CR
July 2003 - Ed: 5C
LOW DROP POWER SCHOTTKY RECTIFIER
Dual center tap Schottky rectifiers suited for
Switch Mode Power Supply and high frequency
DC to DC converters.
Packaged in TO-220AB, D
2
PAK and IPAK, these
devices are intended for use in low voltage, high
frequency inverters, free-wheeling and polarity
protection applications.
DESCRIPTION
n
VERY SMALL CONDUCTION LOSSES
n
NEGLIGIBLE SWITCHING LOSSES
n
EXTREMELY FAST SWITCHING
n
LOW FORWARD VOLTAGE DROP
n
LOW THERMAL RESISTANCE
n
AVALANCHE CAPABILITY SPECIFIED
FEATURES AND BENEFITS
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
30
V
I
F(RMS)
RMS forward current
30
A
I
F(AV)
Average forward current
Tc = 140C
= 0.5
Per diode
Per device
15
30
A
I
FSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
220
A
I
RRM
Peak repetitive reverse current
tp = 2 s F = 1kHz square
1
A
I
RSM
Non repetitive peak reverse current
tp = 100s square
3
A
P
ARM
Repetitive peak avalanche power
tp = 1s
Tj = 25C
5300
W
T
stg
Storage temperature range
- 65 to + 150
C
Tj
Maximum operating junction temperature *
150
C
dV/dt
Critical rate of rise reverse voltage
10000
V/s
ABSOLUTE RATINGS (limiting values, per diode)
A1
K
A2
I
F(AV)
2 x 15 A
V
RRM
30 V
Tj (max)
150 C
V
F
(max)
0.37 V
MAIN PRODUCT CHARACTERISTICS
D
2
PAK
STPS30L30CG
A1
K
A2
TO-220AB
STPS30L30CT
A2
K
A1
A1
K
A2
I
2
PAK
STPS30L30CR
STPS30L30CT/CG/CR
2/5
Symbol
Parameter
Tests Conditions
Min.
Typ.
Max.
Unit
I
R
*
Reverse leakage cur-
rent
Tj = 25C
V
R
= V
RRM
1.5
mA
Tj = 125C
170
350
mA
V
F
*
Forward voltage drop
Tj = 25C
I
F
= 15 A
0.46
V
Tj = 125C
I
F
= 15 A
0.33
0.37
Tj = 25C
I
F
= 30 A
0.57
Tj = 125C
I
F
= 30 A
0.43
0.5
Pulse test : * tp = 380 s,
< 2%
To evaluate the conduction losses use the following equation :
P = 0.24x I
F(AV)
+ 0.009 I
F
2
(RMS)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol
Parameter
Value
Unit
R
th (j-c)
Junction to case
Per diode
Total
1.5
0.8
C/W
R
th (c)
Coupling
0.1
C/W
THERMAL RESISTANCE
When the diodes 1 and 2 are used simultaneously :
Tj(diode 1) = P(diode1) x R
th(j-c)
(Per diode) + P(diode 2) x R
th(c)
0
2
4
6
8
10
12
14
16
18
20
0
1
2
3
4
5
6
7
8
9
10
IF(av) (A)
PF(av)(W)
T
=tp/T
tp
= 1
= 0.5
= 0.2
= 0.1
= 0.05
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
0
25
50
75
100
125
150
0
2
4
6
8
10
12
14
16
IF(av)(A)
Rth(j-a)=15C/W
Rth(j-a)=Rth(j-c)
Rth(j-a)=50C/W
T
=tp/T
tp
Tamb(C)
Fig.
2:
Average
current
versus
ambient
temperature (
=0.5) (per diode).
0
0.2
0.4
0.6
0.8
1
1.2
0
25
50
75
100
125
150
T (C)
j
P
(t )
P
(25C)
ARM p
ARM
Fig. 4: Normalized avalanche power derating
versus junction temperature.
0.001
0.01
0.1
0.01
1
0.1
10
100
1000
1
t (s)
p
P
(t )
P
(1s)
ARM p
ARM
Fig. 3: Normalized avalanche power derating
versus pulse duration.
STPS30L30CT/CG/CR
3/5
1E-3
1E-2
1E-1
1E+0
0
25
50
75
100
125
150
175
200
225
250
IM(A)
Tc=25C
Tc=110C
Tc=75C
t(s)
I
M
t
=0.5
Fig. 4: Non repetitive surge peak forward current
versus overload duration (maximum values) (per
diode).
1E-4
1E-3
1E-2
1E-1
1E+0
0.0
0.2
0.4
0.6
0.8
1.0
tp(s)
Zth(j-c)/Rth(j-c)
T
=tp/T
tp
Single pulse
= 0.5
= 0.2
= 0.1
Fig. 5: Relative variation of thermal transient
impedance junction to case versus pulse duration.
0
5
10
15
20
25
30
1E-2
1E-1
1E+0
1E+1
1E+2
1E+3
VR(V)
IR(mA)
Tj=125C
Tj=25C
Tj=150C
Fig. 6: Reverse leakage current versus reverse
voltage applied (typical values) (per diode).
1
2
5
10
20
50
0.1
1.0
5.0
VR(V)
C(nF)
F=1MHz
Tj=25C
Fig. 7: Junction capacitance versus reverse
voltage applied (typical values) (per diode).
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1
10
100
200
VFM(V)
IFM(A)
Tj=150C
(typical values)
Tj=125C
Tj=25C
Fig. 8: Forward voltage drop versus forward
current (maximum values - per diode).
0
4
8
12
16
20
24
28
32
36
40
0
10
20
30
40
50
60
70
80
S(Cu) (cm)
Rth(j-a) (C/W)
Fig. 9: Thermal resistance junction to ambient
versus copper surface under tab (epoxy printed
circuit board FR4, e(Cu) = 35
m)
(STPS30L30CG).
STPS30L30CT/CG/CR
4/5
PACKAGE MECHANICAL DATA
TO-220AB
A
C
D
L7
Dia
L5
L6
L9
L4
F
H2
G
G1
L2
F2
F1
E
M
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
F2
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
G1
2.40
2.70
0.094
0.106
H2
10
10.40
0.393
0.409
L2
16.4 typ.
0.645 typ.
L4
13
14
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
2.6 typ.
0.102 typ.
Diam.
3.75
3.85
0.147
0.151
PACKAGE MECHANICAL DATA
I
2
PAK
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
b
0.70
0.93
0.028
0.037
b1
1.14
1.17
0.044
0.046
b2
1.14
1.17
0.044
0.046
c
0.45
0.60
0.018
0.024
c2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
E
10.0
10.4
0.394
0.409
L
13.1
13.6
0.516
0.535
L1
3.48
3.78
0.137
0.149
L2
1.27
1.40
0.050
0.055
e
D
L
L1
L2
b1
b
b2
E
A
c2
A1
c
n
Cooling method: C
n
Recommended torque value: 0.55 m.N
n
Maximum torque value: 0.70 m.N
STPS30L30CT/CG/CR
5/5
PACKAGE MECHANICAL DATA
D
2
PAK
A
C2
D
R
A2
M
V2
C
A1
G
L
L3
L2
B
B2
E
*
* FLAT ZONE NO LESS THAN 2mm
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
R
0.40 typ.
0.016 typ.
V2
0
8
0
8
8.90
3.70
1.30
5.08
16.90
10.30
FOOT PRINT (in millimeters)
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
2003 STMicroelectronics - Printed in Italy - All rights reserved.
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Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS30L30CT
STPS30L30CT
TO-220AB
2g
50
Tube
STPS30L30CG
STPS30L30CG
D
2
PAK
1.8g
50
Tube
STPS30L30CG-TR
STPS30L30CG
D
2
PAK
1.8g
1000
Tape & reel
STPS30L30CR
STPS30L30CR
I
2
PAK
1.49g
50
Tube
n
Epoxy meets UL94,V0
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