STPS30L40CG/CT/CW
July 1999 - Ed: 3A
LOW DROP POWER SCHOTTKY RECTIFIER
Dual center tap schottky rectifiers suited for
Switched
Mode
Power
Supplies
and
high
frequencyDC to DC converters.
Packaged in TO-247, TO-220ABand D
2
PAK these
devices are intended for use in low voltage, high
frequency inverters, free-wheeling and polarity
protectionapplications.
DESCRIPTION
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
LOW THERMAL RESISTANCE
AVALANCHERATED
FEATURES AND BENEFITS
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
40
V
I
F(RMS)
RMS forward current
30
A
I
F(AV)
Average forward current
Tc = 135
C
= 0.5
Per diode
Per device
15
30
A
I
FSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
220
A
I
RRM
Repetitive peak reverse current
tp=2
s square F=1kHz
1
A
I
RSM
Non repetitive peak reverse current
tp = 100
s square
3
A
T
stg
Storage temperature range
- 65 to + 150
C
Tj
Maximum operating junction temperature *
150
C
dV/dt
Critical rate of rise of reverse voltage
10000
V/
s
ABSOLUTE RATINGS (limiting values, per diode)
A1
K
A2
I
F(AV)
2 x 15 A
V
RRM
40 V
Tj (max)
150
C
V
F
(max)
0.50 V
MAIN PRODUCTS CHARACTERISTICS
D
2
PAK
STPS30L40CG
K
A1
A2
A2
K
A1
K
A1
A2
TO-220AB
STPS30L40CT
TO-247
STPS30L40CW
* :
dPtot
dTj
<
1
Rth
(
j
-
a
)
thermal runaway condition for a diode on its own heatsink
1/6
Symbol
Parameter
Tests Conditions
Min.
Typ.
Max.
Unit
I
R
*
Reverse leakage
current
Tj = 25
C
V
R
= V
RRM
360
A
Tj = 100
C
20
50
mA
V
F
*
Forward voltage drop
Tj = 25
C
I
F
= 15 A
0.55
V
Tj = 125
C
I
F
= 15 A
0.42
0.50
Tj = 25
C
I
F
= 30 A
0.74
Tj = 125
C
I
F
= 30 A
0.59
0.67
Pulse test : * tp = 380
s,
< 2%
To evaluate the conduction losses use the following equation :
P = 0.330 x I
F(AV)
+ 0.011 I
F
2
(RMS)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol
Parameter
Value
Unit
R
th (j-c)
Junction to case
Per diode
Total
1.60
0.85
C/W
R
th (c)
Coupling
0.10
C/W
THERMAL RESISTANCES
When the diodes 1 and 2 are used simultaneously :
Tj(diode 1) = P(diode1) x R
th(j-c)
(Per diode) + P(diode 2) x R
th(c)
PF(av)(W)
0
2
4
6
8
10
12
14
16
18
20
0
2
4
6
8
10
12
IF(av)A
T
=tp/T
tp
= 1
= 0.5
= 0.2
= 0.1
= 0.05
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
0
25
50
75
100
125
150
0
2
4
6
8
10
12
14
16
18
IF(av)(A)
Rth(j-a)=15
C/W
Rth(j-a)=Rth(j-c)
Tamb(
C)
T
=tp/T
tp
Fig.
2:
Average
current
versus
ambient
temperature (
=0.5) (per diode).
STPS30L40CG/CT/CW
2/6
1E-3
1E-2
1E-1
1E+0
0
20
40
60
80
100
120
140
160
180
200
IM(A)
Tc=25
C
Tc=125
C
Tc=75
C
t(s)
I
M
t
=0.5
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values) (per
diode).
1.0E-4
1.0E-3
1.0E-2
1.0E-1
1.0E+0
0.0
0.2
0.4
0.6
0.8
1.0
Zth(j-c)/Rth(j-c)
Single pulse
= 0.1
= 0.2
= 0.5
T
=tp/T
tp
tp(s)
Fig. 4: Relative variation of thermal transient
impedance junction to case versus pulse duration.
0
5
10
15
20
25
30
35
40
1E-2
1E-1
1E+0
1E+1
1E+2
2E+2
IR(mA)
Tj=100
C
Tj=75
C
Tj=25
C
Tj=150
C
VR(V)
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values) (per diode).
1
2
5
10
20
50
100
200
500
1000
2000
F=1MHz
Tj=25
C
C(pF)
VR(V)
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values) (per diode).
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
1
10
100
200
IFM(A)
VFM(V)
Typical values
Tj=150
C
Tj=125
C
Tj=25
C
Fig. 7: Forward voltage drop versus forward
current (maximum values) (per diode).
0
5
10
15
20
25
30
35
40
0
10
20
30
40
50
60
70
80
Rth(j-a) (
C/W)
S(Cu) (cm )
Fig. 8: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35
m)
(STPS30L40CGonly).
STPS30L40CG/CT/CW
3/6
Cooling method : C
Recommended torque value : 0.55 m.N
Maximum torque value : 0.70 m.N
PACKAGE MECHANICAL DATA
TO-220AB
A
C
D
L7
Dia
L5
L6
L9
L4
F
H2
G
G1
L2
F2
F1
E
M
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
F2
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
G1
2.40
2.70
0.094
0.106
H2
10
10.40
0.393
0.409
L2
16.4 typ.
0.645 typ.
L4
13
14
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
2.6 typ.
0.102 typ.
Diam.
3.75
3.85
0.147
0.151
STPS30L40CG/CT/CW
4/6
PACKAGE MECHANICAL DATA
D
2
PAK
A
C2
D
R
A2
M
V2
C
A1
G
L
L3
L2
B
B2
E
*
* FLAT ZONE NO LESSTHAN 2mm
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
R
0.40 typ.
0.016 typ.
V2
0
8
0
8
8.90
3.70
1.30
5.08
16.90
10.30
FOOT PRINT (in millimeters)
D
2
PAK
Cooling method : by conduction (method C)
STPS30L40CG/CT/CW
5/6
PDF 
ZIP