STPS5L25B/B-1
August 1999 - Ed: 3A
LOW DROP POWER SCHOTTKY RECTIFIER
I
F(AV)
5 A
V
RRM
25 V
Tj (max)
150C
V
F
(max)
0.35 V
MAIN PRODUCT CHARACTERISTICS
VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS
HIGH POWER SURFACE MOUNT MINIATURE
PACKAGE
AVALANCHE RATED
FEATURES AND BENEFITS
Single Schottky rectifier suited to Switched Mode
Power Supplies and high frequency DC to DC con-
verters.
This device is especially intended for use as a Rec-
tifier at the secondary of 3.3V SMPS units.
DESCRIPTION
DPAK
STPS5L25B
1
2
3
4
NC
1
2
3
4
NC
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
25
V
I
F(RMS)
RMS forward current
7
A
I
F(AV)
Average forward current
Tc = 145C
= 0.5
5
A
I
FSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
75
A
I
RRM
Repetitive peak reverse current
tp=2
s square F=1kHz
1
A
I
RSM
Non repetitive peak reverse current
tp = 100
s square
2
A
T
stg
Storage temperature range
- 65 to + 150
C
Tj
Maximum operating junction temperature *
150
C
dV/dt
Critical rate of rise of reverse voltage
10000
V/
s
ABSOLUTE RATINGS (limiting values)
2
4 (TAB)
3
IPAK
STPS5L25B-1
* :
dPtot
dTj
<
1
Rth
(
j
-
a
)
thermal runaway condition for a diode on its own heatsink
1/5
Symbol
Parameter
Value
Unit
R
th(j-c)
Junction to case
2.5
C/W
THERMAL RESISTANCES
Symbol
Tests Conditions
Tests Conditions
Min.
Typ.
Max.
Unit
I
R
*
Reverse leakage current
Tj = 25
C
V
R
= V
RRM
350
A
Tj = 125
C
55
115
mA
V
F
*
Forward voltage drop
Tj = 25
C
I
F
= 5 A
0.47
V
Tj = 125
C
I
F
= 5 A
0.31
0.35
Tj = 25
C
I
F
= 10 A
0.59
Tj = 125
C
I
F
= 10 A
0.41
0.50
STATIC ELECTRICAL CHARACTERISTICS
Pulse test :
* tp = 380
s,
< 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.2 x I
F(AV)
+ 0.030 I
F
2
(RMS)
0
1
2
3
4
5
6
0.0
0.5
1.0
1.5
2.0
2.5
IF(av) (A)
PF(av)(W)
= 0.2
= 0.5
= 1
= 0.05
= 0.1
T
=tp/T
tp
Fig. 1: Average forward power dissipation versus
average forward current.
0
25
50
75
100
125
150
0
1
2
3
4
5
6
IF(av)(A)
Rth(j-a)=70C/W
Rth(j-a)=Rth(j-c)
Tamb(C)
T
=tp/T
tp
Fig. 2: Average forward current versus ambient
temperature (
=0.5).
STPS5L25B/B-1
2/5
1E-3
1E-2
1E-1
1E+0
0
20
40
60
80
100
IM(A)
Tc=25C
Tc=100C
Tc=75C
t(s)
I
M
t
=0.5
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
1.0E-4
1.0E-3
1.0E-2
1.0E-1
1.0E+0
0.0
0.2
0.4
0.6
0.8
1.0
tp(s)
Zth(j-c)/Rth(j-c)
= 0.1
= 0.2
= 0.5
Single pulse
T
=tp/T
tp
Fig. 4: Relative variation of thermal impedance
junction to case versus pulse duration.
0
5
10
15
20
25
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
3E+2
IR(mA)
Tj=125C
Tj=25C
Tj=150C
VR(V)
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
1
2
5
10
20
30
100
200
500
1000
2000
VR(V)
C(pF)
F=1MHz
Tj=25C
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
IFM(A)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.1
1.0
10.0
100.0
VFM(V)
Typical values
Tj=150C
Tj=125C
Tj=25C
Fig. 7: Forward voltage drop versus forward cur-
rent (maximum values).
0
2
4
6
8
10
12
14
16
18
20
0
20
40
60
80
100
S(Cu) (cm)
Rth(j-a) (C/W)
Fig. 8: Thermal resistance junction to ambient ver-
sus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35
m).
STPS5L25B/B-1
3/5
PACKAGE MECHANICAL DATA
DPAK
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max
Min.
Max.
A
2.20
2.40
0.086
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.212
C
0.45
0.60
0.017
0.023
C2
0.48
0.60
0.018
0.023
D
6.00
6.20
0.236
0.244
E
6.40
6.60
0.251
0.259
G
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.397
L2
0.80 typ.
0.031 typ.
L4
0.60
1.00
0.023
0.039
V2
0
8
0
8
6.7
6.7
3
3
1.6
1.6
2.3
2.3
FOOT PRINT DIMENSIONS (in millimeters)
STPS5L25B/B-1
4/5
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1999 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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http://www.st.com
PACKAGE MECHANICAL DATA
IPAK
H
L
L1
G
B5
B
V1
D
C
A1
A3
A
C2
B3
B6
L2
E
B2
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
2.2
2.4
0.086
0.094
A1
0.9
1.1
0.035
0.043
A3
0.7
1.3
0.027
0.051
B
0.64
0.9
0.025
0.035
B2
5.2
5.4
0.204
0.212
B3
0.85
0.033
B5
0.3
0.035
B6
0.95
0.037
C
0.45
0.6
0.017
0.023
C2
0.48
0.6
0.019
0.023
D
6
6.2
0.236
0.244
E
6.4
6.6
0.252
0.260
G
4.4
4.6
0.173
0.181
H
15.9
16.3 0.626
0.641
L
9
9.4
0.354
0.370
L1
0.8
1.2
0.031
0.047
L2
0.8
1
0.031 0.039
V1
10
10
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS5L25B
STPS5L25B
DPAK
0.30g
75
Tube
STPS15LB-TR
STPS5L25B
DPAK
0.30g
2500
Tape & reel
STPS5L25B-1
STPS5L25B
IPAK
0.35g
75
Tube
Epoxy meets UL94,V0
STPS5L25B/B-1
5/5
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