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Электронный компонент: STPS8L30B

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STPS8L30B
October 1998 - Ed: 4A
LOW DROP POWER SCHOTTKY RECTIFIER
I
F(AV)
8 A
V
RRM
30 V
Tj (max)
150
C
V
F
(max)
0.40 V
MAIN PRODUCT CHARACTERISTICS
LOW COST DEVICE WITH LOW DROP FOR-
WARD
VOLTAGE
FOR
LESS
POWER
DISSIPATION AND REDUCED HEATSINK
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH LEADS TO THE HIGHEST
YIELD IN THE APPLICATIONS
HIGH POWER SURFACE MOUNT MINIATURE
PACKAGE
FEATURES AND BENEFITS
Single Schottky rectifier suited to Switched Mode
Power Supplies and high frequencyDC to DC con-
verters.
Packaged in DPAK, this device is especially in-
tended for use as a Rectifier at the secondary of
3.3V SMPS or DC/DC units.
DESCRIPTION
DPAK
1
2
3
4
2
(TAB)
3
4
NC
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
30
V
I
F(RMS)
RMS forward current
7
A
I
F(AV)
Average forward current
Tc = 135
C
= 0.5
8
A
I
FSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
75
A
I
RRM
Repetitive peak reverse current
tp = 2
s F = 1kHz square
1
A
I
RSM
Non repetitive peak reverse current
tp = 100
s
square
2
A
T
stg
Storage temperature range
- 65 to + 150
C
Tj
Maximum junction temperature
150
C
dV/dt
Critical rate of rise of reverse voltage
10000
V/
s
ABSOLUTE RATINGS (limiting values)
* :
dPtot
dTj
<
1
Rth
(
j
-
a
)
thermal runaway condition for a diode on its own heatsink
1/4
Symbol
Parameter
Value
Unit
R
th(j-c)
Junction to case
2.5
C/W
THERMAL RESISTANCES
Symbol
Tests Conditions
Tests Conditions
Min.
Typ.
Max.
Unit
I
R
*
Reverse leakage current
Tj = 25
C
V
R
= V
RRM
1
mA
Tj = 100
C
15
40
V
F
*
Forward voltage drop
Tj = 25
C
I
F
= 8 A
0.49
V
Tj = 125
C
0.35
0.4
Tj = 25
C
I
F
= 16 A
0.63
Tj = 125
C
0.48
0.57
STATIC ELECTRICAL CHARACTERISTICS
Pulse test :
* tp = 380
s,
< 2%
To evaluate the maximum conduction losses use the following equation :
P = 0.23 x I
F(AV)
+ 0.021 I
F
2
(RMS)
0
2
4
6
8
10
0.0
1.0
2.0
3.0
4.0
5.0
IF(av) (A)
PF(av)(W)
= 1
= 0.5
= 0.2
= 0.1
= 0.05
T
=tp/T
tp
Fig. 1: Average forward power dissipation versus
average forward current.
0
25
50
75
100
125
150
0
1
2
3
4
5
6
7
8
9
IF(av)(A)
Rth(j-a)=70
C/W
Rth(j-a)=Rth(j-c)
Tamb(
C)
T
=tp/T
tp
Fig. 2: Average forward current versus ambient
temperature (
=0.5).
STPS8L30B
2/4
1E-3
1E-2
1E-1
1E+0
0
20
40
60
80
100
120
IM(A)
Tc=25
C
Tc=125
C
Tc=75
C
I
M
t
=0.5
t(s)
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
1E-4
1E-3
1E-2
1E-1
1E+0
0.0
0.2
0.4
0.6
0.8
1.0
tp(s)
Zth(j-c)/Rth(j-c)
T
=tp/T
tp
Single pulse
= 0.1
= 0.2
= 0.5
Fig. 4: Relative variation of thermal impedance
junction to ambient versus pulse duration.
0
5
10
15
20
25
30
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
3E+2
IR(mA)
Tj=125
C
Tj=25
C
Tj=150
C
VR(V)
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
1
10
40
100
200
500
1000
2000
VR(V)
C(pF)
F=1MHz
Tj=25
C
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
0.0
0.2 0.4
0.6 0.8
1.0
1.2 1.4
1.6 1.8
2.0
0.1
1.0
10.0
100.0
VFM(V)
IFM(A)
Typical values
Tj=150
C
Tj=25
C
Tj=125
C
Fig. 7: Forward voltage drop versus forward cur-
rent (maximum values).
0
2
4
6
8
10
12
14
16
18
20
0
20
40
60
80
100
S(Cu) (cm )
Rth(j-a) (
C/W)
Fig. 8: Thermal resistance junction to ambient ver-
sus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35
m).
STPS8L30B
3/4
PACKAGE MECHANICAL DATA
DPAK
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ.
Max
Min.
Typ.
Max.
A
2.20
2.40 0.086
0.094
A1
0.90
1.10 0.035
0.043
A2
0.03
0.23 0.001
0.009
B
0.64
0.90 0.025
0.035
B2
5.20
5.40 0.204
0.212
C
0.45
0.60 0.017
0.023
C2
0.48
0.60 0.018
0.023
D
6.00
6.20 0.236
0.244
E
6.40
6.60 0.251
0.259
G
4.40
4.60 0.173
0.181
H
9.35
10.10 0.368
0.397
L2
0.80
0.031
L4
0.60
1.00 0.023
0.039
V2
0
8
0
8
6.7
6.7
6.7
3
1.6
1.6
2.3
2.3
FOOT PRINT DIMENSIONS (in millimeters)
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use of such information nor for any infringementof patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1998 STMicroelectronics - Printed in Italy - All rights reserved.
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Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS8L30B
STPS8L30B
DPAK
0.3g
75
Tube
STPS8L30B-TR
STPS8L30B
DPAK
0.3g
2500
Tape & reel
Epoxy meets UL94,V0
STPS8L30B
4/4