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STTH310/S
January 2003 - Ed: 1
HIGH VOLTAGE ULTRAFAST RECTIFIER
The STTH310, which is using ST ultrafast high
voltage planar technology, is specially suited for
free-wheeling, clamping, snubbering, demagneti-
zation in power supplies and other power switching
applications.
DESCRIPTION
s
Low forward voltage drop
s
High reliability
s
High surge current capability
s
Soft switching for reduced EMI disturbances
s
Planar technology
FEATURES AND BENEFITS
Symbol
Parameter
Value
Unit
V
RRM
Repetitive peak reverse voltage
1000
V
V
(RMS)
RMS voltage
700
V
I
F(AV)
Average forward current
Tl = 75C
=0.5
DO-201AD
3
A
Tl = 75C
=0.5
SMC
3
I
FSM
Forward surge current
t = 8.3 ms
DO-201AD
55
A
SMC
45
T
stg
Storage temperature range
- 50 + 175
C
Tj
Maximum operating junction temperature
+ 175
C
ABSOLUTE RATINGS (limiting values)
I
F(AV)
3 A
V
RRM
1000 V
Tj (max)
175 C
V
F
(max)
1.42 V
MAIN PRODUCT CHARACTERISTICS
DO-201AD
STTH310
SMC
STTH310S
STTH310/S
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Symbol
Parameter
Tests conditions
Min.
Typ.
Max.
Unit
I
R
Reverse leakage current
V
R
= 1000V
Tj = 25C
10
A
Tj = 125C
50
V
F
Forward voltage drop
I
F
= 3 A
Tj = 25C
1.7
V
Tj = 150C
0.98
1.42
To evaluate the maximum conduction losses use the following equation :
P = 1.20 x I
F(AV)
+ 0.075 x I
F
2
(RMS)
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Value
Unit
R
th (j-l)
Junction to lead
L = 10 mm
DO-201AD
20
C/W
SMC
20
R
th (j-a)
Junction to ambient
L = 10 mm
DO-201AD
75
THERMAL PARAMETERS
Symbol
Parameter
Tests conditions
Min.
Typ.
Max.
Unit
t
rr
Reverse recovery time
I
F
= 0.5 A
Irr = 0.25 A I
R
= 1A
Tj = 25C
75
ns
t
fr
Forward recovery time
I
F
= 3 A
dI
F
/dt = 50 A/s
V
FR
= 1.1 x V
F
max
Tj = 25C
300
ns
V
FP
Forward recovery voltage
12
V
DYNAMIC ELECTRICAL CHARACTERISTICS
STTH310/S
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P(W)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
I
(A)
F(AV)
T
=tp/T
tp
= 1
= 0.05
= 0.5
= 0.2
= 0.1
Fig. 1: Conduction losses versus average current.
I
(A)
FM
0.1
1.0
10.0
100.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
T =25C
(maximum values)
j
V
(V)
FM
T =150C
(maximum values)
j
T =150C
(typical values)
j
Fig. 2: Forward voltage drop versus forward
current
.
Z
/R
th(j-c)
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
= 0.5
= 0.2
= 0.1
Single pulse
T
=tp/T
tp
t (s)
p
Fig. 3-1: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4, L
leads
= 10mm) (DO-201AD).
Z
/R
th(j-c)
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
T
=tp/T
tp
t (s)
p
= 0.5
= 0.2
= 0.1
Single pulse
Fig. 3-2: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4, S=1cm
2
) (SMC).
R
(C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
0
1
2
3
4
5
SMB
DO-201AD
L
=10mm
leads
S(cm)
Fig. 4: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness:
35m).
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PACKAGE MECHANICAL DATA
SMC
E
C
L
E2
E1
D
A1
A2
b
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
2.90
3.2
0.114
0.126
c
0.15
0.41
0.006
0.016
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
D
5.55
6.25
0.218
0.246
L
0.75
1.60
0.030
0.063
2.0
4.2
2.0
3.3
FOOTPRINT (in millimeters)
STTH310/S
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PACKAGE MECHANICAL DATA
DO-201AD
B
A
E
E
D
D
C
B
note 2
note 1
note 1
REF.
DIMENSIONS
NOTES
Millimeters
Inches
Min.
Max.
Min.
Max.
A
9.50
0.374
1 - The lead diameter
D is not controlled over zone E
2 - The minimum length which must stay straight between
the right angles after bending is 0.59"(15 mm)
B
25.40
1.000
C
5.30
0.209
D
1.30
0.051
E
1.25
0.049
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
STTH310
STTH310
DO-201AD
1.12 g
600
Ammopack
STTH310S
S10
SMC
0.245 g
2500
Tape & reel
STTH310RL
STTH310
DO-201AD
1.12 g
1900
Tape & reel
s
Epoxy meets UL 94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
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2003 STMicroelectronics - Printed in Italy - All rights reserved.
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