TDA7267
2W MONO AMPLIFIER
CAN DELIVER 2W THD 10% 12V/8
INTERNAL FIXED GAIN 32dB
NO FEEDBACK CAPACITOR
NO BOUCHEROT CELL
THERMAL PROTECTION
AC SHORT CIRCUIT PROTECTION
SVR CAPACITOR FOR BETTER RIPPLE
REJECTION
LOW TURN-ON/OFF POP
STAND-BY MODE
DESCRIPTION
The device TDA7267 is a new technology Mono
Audio Amplifier in MINIDIP package specifically
designed for TV application.
Thanks to the fully complementary output configu-
ration the device delivers a rail to rail voltage
swing without need of boostrap capacitors.
June1998
IN
SVR
S-GND
P-GND
V
S
100
F
V
S
=12V
470
F
OUT
8
0.1
F
47
F
IN
D94AU165
+
-
BLOCK DIAGRAM
ORDERING NUMBER: TDA7267
MINIDIP (4+4)
1/5
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
S
Operating Supply Voltage
18
V
I
O
Output Put Peak Current
1.5
A
T
op
Operating Temperature Range
0 to 70
C
T
j
Junction Temperature
150
C
T
stg
Storage Temperature Range
-40 to 125
C
THERMAL DATA
Symbol
Parameter
Value
Unit
R
th j-amb
Thermal Resistance Junction to ambient (on PCB)
80
C/W
R
th j-case
Thermal Resistance Junction to case
15
C/W
V
S
OUT
SVR
IN
1
3
2
4
GND
GND
GND
GND
8
7
6
5
D94AU163
PIN CONNECTION (Top view)
ELECTRICAL CHARACTERISTICS (T
amb
= 25
C; V
S
= 12V; R
L
= 8
; f = 1KHz; unless otherwise speci-
fied.)
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
V
S
Supply Voltage Range
4.5
18
V
I
S
Quiescent Current
20
30
mA
I
sb
Stand-By Current
Pin 3 shorted to GND
0.3
mA
V
O
Quiescent Output Voltage
6
V
A
V
Voltage Gain
32
dB
R
IN
Input Impedance
100
K
P
O
Output Power
THD = 10%
1.8
2
W
THD
Distortion
P
O
= 1W
1.0
%
SVR
Supply Voltage Rejection
V
ripple
= 150mVrms;
F
ripple
= 1KHz
50
dB
E
I
Input Noise Voltage
Rg = 10K
; BW = 20Hz to 20KHz
1.5
5
V
V
sb
Stand-By Enable Voltage
1
V
TDA7267
2/5
APPLICATION HINTS:
For 12V supply and 8
speaker application, its
maximum power dissipation is about 1W.
Assumming that max ambient temperature is
70
C. Required thermal resistance of the device
and heat dissipating means must be equal to (150
- 70)/1 = 80
C/W.
Junction to pin thermal resistance of the package
is about 15
C/W. That means external heat sink
of about 65
C/W is required.
Cu ground plane of PCB can be used as heat dis-
sipating means.
Stand-By switches must be able to discharge C
svr
current.
IN
SVR
P-GND
V
S
100
F
V
S
=12V
470
F
OUT
8
0.1
F
47
F
IN
D94AU166
STAND-BY
APPLICATION CIRCUIT
TDA7267
3/5
MINIDIP PACKAGE MECHANICAL DATA
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
3.3
0.130
a1
0.7
0.028
B
1.39
1.65
0.055
0.065
B1
0.91
1.04
0.036
0.041
b
0.5
0.020
b1
0.38
0.5
0.015
0.020
D
9.8
0.386
E
8.8
0.346
e
2.54
0.100
e3
7.62
0.300
e4
7.62
0.300
F
7.1
0.280
I
4.8
0.189
L
3.3
0.130
Z
0.44
1.6
0.017
0.063
TDA7267
4/5
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1998 STMicroelectronics Printed in Italy All Rights Reserved
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TDA7267
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